IP Library Granted Patent US 10,367,033
Granted Patent B2
US 10,367,033 · App. 16/112,570 · Granted Jul 30, 2019

Cross-point memory and methods for fabrication of same

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Quick Facts
Patent No.
US 10,367,033
App. No.
16/112,570
Granted
Jul 30, 2019
Kind
B2
Abstract

A method of fabricating a memory device is disclosed. In one aspect, the method comprises patterning a first conductive line extending in a first direction. The method additionally includes forming a free-standing pillar of a memory cell stack on the first conductive line after patterning the first conductive line. Forming the free-standing pillar includes depositing a memory cell stack comprising a selector material and a storage material over the conductive line and patterning the memory cell stack to form the free-standing pillar. The method further includes patterning a second conductive line on the pillar after patterning the memory cell stack, the second conductive line extending in a second direction crossing the first direction.

Claims (11)

1. A method, comprising:

forming a first conductive line and a second conductive line extending in a first direction, the first conductive line and the second conductive line separated by a space;

covering, with a liner material, sidewalls of the first conductive line and the second conductive line and a surface extending between the sidewalls;

depositing a dielectric material over the liner material, wherein a first sidewall and a second sidewall of the dielectric material are in contact with the liner material; and

forming a pillar of a memory cell stack on the first conductive line or the second conductive line after depositing the dielectric material.

2. The method of claim 1 , further comprising:

depositing a pillar liner in contact with a plurality of side surfaces of the pillar, wherein the pillar liner is in contact with the dielectric material and the liner material.

3. The method of claim 2 , further comprising:

depositing a pillar insulating material in contact with the pillar liner, wherein the pillar insulating material is different than the pillar liner.

4. The method of claim 1 , further comprising:

patterning a third conductive line over the pillar, the third conductive line extending in a second direction that intersects the first direction.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →