Multilayer circuit board used for probe card and probe card including multilayer circuit board
A multilayer circuit board 3 a includes a core substrate 7 ; a resin section 8 , which covers the side surface and a lower surface 12 of the core substrate 7 ; and a plurality of metal pins 11 , which are disposed within the resin section 8 . The core substrate 7 includes a ceramic multilayer section 9 , which is disposed on the mother-substrate side of the core substrate 7 ; and a resin multilayer section 10 , which is stacked on a main surface 13 on a side of the ceramic multilayer section 9 , the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11 , and a through-hole 22 , which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22 , to mount the multilayer circuit board 3 a on the mother substrate.
1. A multilayer circuit board used for a probe card and having a plurality of probe pins connected, the multilayer circuit board comprising:
a core substrate including a ceramic multilayer section having a plurality of stacked ceramic layers, wherein the plurality of probe pins are connected to one main surface of the core substrate; and
a resin section disposed so as to cover an entire side surface of the ceramic multilayer section.
2. The multilayer circuit board used for a probe card according to claim 1 , wherein the resin section further covers another main surface of the core substrate,
the multilayer circuit board further comprising a columnar conductor disposed in a portion of the resin section, the portion covering the other main surface of the core substrate, wherein the columnar conductor is electrically connected to each of the plurality of probe pins, and has one end surface exposed at a surface of the resin section, the surface being opposite to the other main surface of the core substrate.
3. The multilayer circuit board used for a probe card according to claim 2 , wherein a portion of the resin section covering the side surface of the core substrate has a hole portion recessed in a thickness direction.
4. The multilayer circuit board used for a probe card according to claim 2 , wherein the core substrate further includes a resin multilayer section stacked on a surface of the ceramic multilayer section, the surface being opposite to a resin section-side surface of the ceramic multilayer section, and
a surface of the resin multilayer section opposite to a resin section-side surface of the resin multilayer section serves as the one main surface of the core substrate.
5. A probe card comprising the multilayer circuit board used for a probe card according to claim 2 , the probe card being configured to perform electrical testing on a test article.
6. The multilayer circuit board used for a probe card according to claim 1 , wherein a portion of the resin section covering the side surface of the core substrate has a hole portion recessed in a thickness direction.
7. The multilayer circuit board used for a probe card according to claim 6 , wherein the core substrate further includes a resin multilayer section stacked on a surface of the ceramic multilayer section, the surface being opposite to a resin section-side surface of the ceramic multilayer section, and
a surface of the resin multilayer section opposite to a resin section-side surface of the resin multilayer section serves as the one main surface of the core substrate.
8. A probe card comprising the multilayer circuit board used for a probe card according to claim 6 , the probe card being configured to perform electrical testing on a test article.
9. The multilayer circuit board used for a probe card according to claim 1 , wherein the core substrate further includes a resin multilayer section stacked on a surface of the ceramic multilayer section, the surface being opposite to a resin section-side surface of the ceramic multilayer section, and
a surface of the resin multilayer section opposite to a resin section-side surface of the resin multilayer section serves as the one main surface of the core substrate.
10. A probe card comprising the multilayer circuit board used for a probe card according to claim 9 , the probe card being configured to perform electrical testing on a test article.
11. The multilayer circuit board used for a probe card according to claim 9 ,
wherein the resin section further covers a side surface of the resin multilayer section.
12. A probe card comprising the multilayer circuit board used for a probe card according to claim 1 , the probe card being configured to perform electrical testing on a test article.
13. The multilayer circuit board used for a probe card according to claim 1 , wherein the ceramic multilayer section further has a plurality of stacked wiring layers, and wherein the plurality of stacked ceramic layers and the plurality of stacked wiring layers are alternately stacked.