Semiconductor light source
A light source may comprise a thermally conductive frame comprising a base and a faceted portion extending from the base. The faceted portion may comprise a plurality of facets spaced circumferentially thereabout. Additionally, a hollow passageway may extend through the base and axially through the faceted portion. A plurality of LED chips may be arranged on the plurality of facets to provide an emission of light in an arc of 360 degrees.
1. A lighting device, comprising:
a conductive frame, comprising a first portion and a second portion separated from the first portion by a gap;
a first LED chip, disposed on the first portion;
an insulation material, formed in the gap; and
a first wire, striding over the gap, and directly connecting the first LED chip and the second portion,
wherein the gap has a bending portion, and wherein the first portion, the second portion, the insulation material are overlapped with each other in a cross-sectional view.
2. The lighting device of claim 1 , wherein the first portion and the second portion are directly connected to the insulation material.
3. The lighting device of claim 1 , further comprising a second wire, the first LED chip is electrically connected to the first portion by the second wire.
4. The lighting device of claim 3 , wherein the first LED chip has a first node and a second node which are on a same side of the first LED chip, the first node and the second node have opposite electric polarities, the second node directly connects to the second wire.
5. The lighting device of claim 1 , wherein the first portion has a top surface on which the LED chip is disposed.
6. The lighting device of claim 5 , wherein the first portion has a bottom surface opposite to the top surface, the insulation material directly contacts the bottom surface.
7. The lighting device of claim 1 , further comprising a first light conversion layer covering the first LED chip.
8. The lighting device of claim 1 , further comprising a second LED chip, wherein the second LED chip is electrically connected to the first LED chip through the second portion.
9. The lighting device of claim 8 , further comprising a conductive surface, wherein the second LED chip is disposed on the conductive surface.
10. The lighting device of claim 9 , further comprising a third wire, wherein the second LED chip is electrically connected to the conductive surface through the third wire.
11. The lighting device of claim 8 , further comprising a second light conversion layer covering the second LED chip.
12. The lighting device of claim 11 , further comprising a cap covering the first LED chip and the second LED chip.
13. The light device of claim 8 , wherein the first LED chip and second LED chip are oriented toward different directions.
14. The lighting device of claim 1 , wherein the first LED chip has a first node and a second node which are arranged on a same side of the first LED chip, the first node and the second node have opposite electric polarities.
15. The lighting device of claim 14 , wherein the first wire is directly connected to the first node and the second portion.
16. The lighting device of claim 1 , wherein the first portion has a first side surface, the second portion has a second side surface facing the first side surface, and the insulation material directly contacts the first side surface and the second side surface.
17. The lighting device of claim 1 , further comprising a pin extended out of the insulation material.