IP Library Granted Patent US 10,522,976
Granted Patent B1
US 10,522,976 · App. 16/118,217 · Granted Dec 31, 2019

Laser devices using a semipolar plane

Inventors: James W. Raring (Santa Barbara, CA); You-Da Lin (Goleta, CA); Christiane Elsass (Santa Barbara, CA)
Assignee: Soraa Laser Diode, Inc.
H01S5/34333H01L33/08H01S5/028H01S5/0287H01S5/2009H01S5/2201H01S5/2214H01S5/3202H01S5/3216H01S5/3401H01L21/0274H01L21/042H01L21/28123H01L21/302H01L21/311H01L21/461H01L21/469H01L21/4828H01L33/16H01L41/332H01S5/0014H01S5/0425H01S5/22H01S5/3214
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Quick Facts
Patent No.
US 10,522,976
App. No.
16/118,217
Granted
Dec 31, 2019
Kind
B1
Abstract

An optical device includes a gallium and nitrogen containing substrate comprising a surface region configured in a (20-2-1) orientation, a (30-3-1) orientation, or a (30-31) orientation, within +/−10 degrees toward c-plane and/or a-plane from the orientation. Optical devices having quantum well regions overly the surface region are also disclosed.

Claims (35)

1. A method of operating a system comprising:

in a lighting apparatus coupled to a laser device configured to provide light for the lighting apparatus, the laser device comprising:

a gallium and nitrogen containing material comprising a semipolar surface having an offcut orientation of between +/−5 degrees toward a c-plane and between +/−10 degrees toward an a-plane;

an n-type cladding region overlying the semipolar surface;

an active region comprising at least one light emitting active layer region overlying the n-type cladding region; the light emitting active layer region including:

a plurality of quantum well regions comprising 1 to 7 quantum wells, each of the quantum wells comprising InGaN and ranging in thickness from 2 nm to 5 nm or from 5 nm to 10 nm; or

a double hetero-structure region ranging in thickness from 10 nm to 25 nm;

a p-type cladding region overlying the active region;

a conductive oxide overlying the p-type cladding region;

a laser stripe region comprising at least a portion of the p-type cladding region and the conductive oxide, the laser stripe region being characterized by a cavity orientation substantially parallel to the projection of a c-direction, the laser stripe region having a first end and a second end;

a first facet having a first mirror surface provided on the first end of the laser stripe region;

a reflective coating provided on the first facet; and

a second facet having a second mirror surface provided on the second end of the laser stripe region, wherein the laser device is configured to emit electromagnetic radiation with a peak wavelength of between 400 nm and 500 nm or between 500 nm and 560 nm;

emitting electromagnetic radiation with the peak wavelength of between 400 nm to 500 nm or between 500 nm and 560 nm.

2. The method of claim 1 , wherein the first facet and the second facet are etched facets formed using a lithography and etching process.

3. The method of claim 1 , wherein the conductive oxide comprises indium tin oxide (ITO).

4. The method of claim 1 , wherein the conductive oxide comprises zinc oxide (ZnO).

5. The method of claim 1 , wherein the conductive oxide comprises indium tin oxide (ITO) and is formed from an electron cyclotron resonance deposition technique.

6. The method of claim 1 , wherein the conductive oxide is formed from an electron cyclotron resonance deposition technique at a process temperature below 200° C.

7. The method of claim 1 , wherein the conductive oxide is formed from an electron cyclotron resonance deposition technique at a process temperature below 200° C., wherein the substrate contains a photoresist layer during deposition to provide a lift-off technique.

8. The method of claim 1 , wherein the conductive oxide is ZnO and is formed from an electron cyclotron resonance to deposition technique.

9. The method of claim 1 wherein the semipolar surface is configured on a (30-3-1) orientation, a (30-31) orientation, a (20-2-1) orientation, a (20-21) orientation, or a (30-3-2) orientation.

10. A method for fabricating a lighting apparatus, the method comprising:

processing a laser device by:

providing a gallium and nitrogen containing material having a semipolar surface configured on one of either a (30-3-1) orientation, a (30-31) orientation, a (20-2-1) orientation, a (20-21) orientation, or a (30-3-2) orientation, the semipolar surface having an offcut of the orientation;

forming an n-type cladding region overlying the semipolar surface;

forming an active region comprising at least one light emitting active layer region overlying the n-type cladding region; the light emitting active layer region comprising a quantum well region or a double hetero-structure region; and

depositing a conductive oxide overlying the active region, the conductive oxide being formed from an electron cyclotron resonance deposition technique at a process temperature below 200° C. to maintain a substantially crystalline characteristic of the active region to emit electromagnetic radiation within a desired electroluminescence efficiency, wherein the substrate contains a photoresist layer during deposition to provide a lift-off technique, the conductive oxide forming at least a part of a laser stripe region, the laser stripe region being characterized by a cavity orientation substantially parallel to the projection of a c-direction, the laser stripe region having a first end and a second end;

forming a first facet having a first mirror surface on the first end of the laser stripe region;

forming a reflective coating on the first facet; and

forming a second facet having a second mirror surface on the second end of the laser stripe region, wherein the laser device is configured to emit electromagnetic radiation with a peak wavelength of between 400 nm and 500 nm or 500 nm and 580 nm; and

packaging the laser device in the lighting apparatus.

11. The method of claim 10 , wherein the conductive oxide is selected from indium tin oxide (ITO) and zinc oxide (ZnO).

12. The method of claim 10 , wherein the conductive oxide is ZnO.

13. The method of claim 10 , wherein the first facet and the second facet are etched facets formed using a lithography and etching process.

Assignments (1)
CHANGE OF NAME Recorded Mar 15, 2021
From: SORAA LASER DIODE, INC.
To: KYOCERA SLD LASER, INC.
Reel/Frame 056001/0313 →
Continuity (5)
Continuation 15424551 · Feb 3, 2017
Continuation 14883137 · Oct 14, 2015
Continuation 14604223 · Jan 23, 2015
Continuation 13651291 · Oct 12, 2012
Provisional Application 61546792 · Oct 13, 2011