IP Library Granted Patent US 10,896,831
Granted Patent B2
US 10,896,831 · App. 16/118,734 · Granted Jan 19, 2021

Film forming apparatus

Inventors: Kunihiko Suzuki (Kanagawa, JP); Naohisa Ikeya (Kanagawa, JP); Keisuke Fukada (Saitama, JP); Masahiko Ito (Kanagawa, JP); Isaho Kamata (Kanagawa, JP); Hidekazu Tsuchida (Kanagawa, JP); Hiroaki Fujibayashi (Aichi, JP); Hideyuki Uehigashi (Aichi, JP); Masami Naito (Aichi, JP); Kazukuni Hara (Aichi, JP); Hirofumi Aoki (Aichi, JP); Takahiro Kozawa (Aichi, JP)
Assignees: NuFlare Technology, Inc.; Showa Denko K.K.; Central Research Institute of Electric Power Industry
H01L21/6719C23C16/455C23C16/45587H01L21/205B01F3/028H01L21/02529
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Quick Facts
Patent No.
US 10,896,831
App. No.
16/118,734
Granted
Jan 19, 2021
Kind
B2
Abstract

A supply part includes a first partition, a second partition under the first partition, a third partition under the second partition, a first flow path between the first partition and the second partition allowing a first gas to be introduced therein, a second flow path between the second partition and the third partition allowing a second gas to be introduced therein, a first piping extending from the second partition to reach below the third partition and being communicated with the first flow path, a second piping extending from the third partition to reach below the third partition and being communicated with the second flow path, and a convex portion provided on an outer circumferential surface of the first piping or an inner circumferential surface of the second piping protruding from one of the outer circumferential surface and the inner circumferential surface toward the other one.

Claims (22)

1. A film forming apparatus comprising:

a reaction chamber configured to enable a reaction on a substrate; and

a supply part placed above the reaction chamber and configured to supply at least a first gas and a second gas onto the substrate, wherein

the supply part comprises

a first partition,

a second partition provided under the first partition at a predetermined interval therefrom,

a third partition provided under the second partition at a predetermined interval therefrom,

a first flow path provided between the first partition and the second partition to allow the first gas to be introduced therein,

a second flow path provided between the second partition and the third partition to allow the second gas to be introduced therein;

a first piping extending from the second partition to reach below the third partition and being communicated with the first flow path,

a second piping provided to enclose the first piping, extending from the third partition to reach below the third partition, and being communicated with the second flow path, and

a convex portion provided on an outer circumferential surface of the first piping or an inner circumferential surface of the second piping and protruding from one of the outer circumferential surface of the first piping and the inner circumferential surface of the second piping toward the other one,

wherein a bottom end of the convex portion is provided in a position separated upward from bottom ends of the first piping and the second piping.

2. The apparatus of claim 1 , wherein the convex portion is provided on the outer circumferential surface of the first piping and protrudes toward the inner circumferential surface of the second piping.

3. The apparatus of claim 1 , wherein the convex portion is provided above bottom ends of the first piping and the second piping.

4. The apparatus of claim 1 , wherein the convex portion has a shape extending in a central axis direction of the first piping.

5. The apparatus of claim 4 , wherein a bottom end of the convex portion has a taper.

6. The apparatus of claim 2 , wherein a dimension of the convex portion in a radial direction is a dimension that does not bring the convex portion into contact with the inner circumferential surface of the second piping after the first piping and the second piping are deformed due to heat.

7. The apparatus of claim 1 , wherein a bottom end of the first piping is positioned at a same level as that of a bottom end of the second piping.

8. The apparatus of claim 1 , wherein convex portions as many as three or more are provided on the outer circumferential surface of the first piping to be equally phased in a circumferential direction.

9. The apparatus of claim 1 , wherein the first piping includes a bottom end portion with a tapered shape having an inside diameter increasing gradually toward below, and the second piping has a linear shape.

10. The apparatus of claim 1 , wherein the first piping and the second piping include a bottom end portion with a tapered shape having an inside diameter increasing gradually toward below.

Assignments (2)
CHANGE OF NAME Recorded Nov 15, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 065593/0496 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2018
From: SUZUKI, KUNIHIKO; IKEYA, NAOHISA; FUKADA, KEISUKE; ITO, MASAHIKO; KAMATA, ISAHO; TSUCHIDA, HIDEKAZU; FUJIBAYASHI, HIROAKI; UEHIGASHI, HIDEYUKI; NAITO, MASAMI; HARA, KAZUKUNI; AOKI, HIROFUMI; KOZAWA, TAKAHIRO
To: NUFLARE TECHNOLOGY, INC.; SHOWA DENKO K K; CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY
Reel/Frame 047161/0692 →