TO-CAN packaged laser and optical module
View Patent ↗The present disclosure provides a TO-CAN packaged laser and an optical module. According to an example, the TO-CAN packaged laser includes a base; a substrate located on the base, where the substrate is provided with a first conductive sheet and a second conductive sheet; a laser chip provided on the substrate, where an anode of the laser chip is electrically coupled with the first conductive sheet and a cathode of the laser chip is electrically coupled with the second conductive sheet; and a first pin and a second pin that protrude from the base, where the first pin is coupled with the first conductive sheet by conductive welding flux or conductive paste and the second pin is coupled with the second conductive sheet by conductive welding flux or conductive paste.
1. A TO-CAN packaged laser, comprising:
a base;
a first substrate located on the base, wherein the first substrate is provided with a first conductive sub-sheet and comprises a first metal heat sink;
a second substrate located on the base, wherein the second substrate is provided with a third conductive sub-sheet and comprises a second metal heat sink;
a heat transfer substrate located on the base and between the first substrate and the second substrate, wherein the heat transfer substrate is provided with a second conductive sub-sheet and a fourth conductive sub-sheet, the heat transfer substrate have a higher heat exchange rate than the first substrate and the second substrate, and the heat transfer substrate comprises a third metal heat sink;
a laser chip provided on the heat transfer substrate, wherein an anode of the laser chip is electrically coupled with the second conductive sub-sheet and a cathode of the laser chip is electrically coupled with the fourth conductive sub-sheet; and
a first pin and a second pin that protrude from the base, wherein the first pin is coupled with the first conductive sub-sheet by conductive welding flux or conductive paste and the second pin is coupled with the third conductive sub-sheet by conductive welding flux or conductive paste.
2. The laser of claim 1 , wherein the laser chip is attached on the second conductive sub-sheet or the fourth conductive sub-sheet.
3. The laser of claim 1 , wherein,
the laser chip is disposed on an upper surface of the heat transfer substrate away from the base, wherein the upper surface of the heat transfer substrate is parallel with a surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided.
4. The laser of claim 3 , wherein the second conductive sub-sheet and the fourth conductive sub-sheet are provided in one of the following:
a first manner comprising:
the second conductive sub-sheet extends from a side surface of the heat transfer substrate to the upper surface of the heat transfer substrate, wherein the side surface of the heat transfer substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and
the fourth conductive sub-sheet extends from the side surface of the heat transfer substrate to the upper surface of the heat transfer substrate;
a second manner comprising:
the second conductive sub-sheet is provided on the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet is provided on the upper surface of the heat transfer substrate;
a third manner comprising:
the second conductive sub-sheet is provided on the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet extends from the side surface of the heat transfer substrate to the upper surface of the heat transfer substrate; and
a fourth manner comprising:
the second conductive sub-sheet extends from a side surface of the heat transfer substrate to the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet is provided on the upper surface of the heat transfer substrate.
5. The laser of claim 3 , wherein the first conductive sub-sheet and the third conductive sub-sheet are provided in one of following:
a first manner comprising:
the first conductive sub-sheet extends from a side surface of the first substrate to an upper surface of the first substrate away from the base, wherein the side surface of the first substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and the upper surface of the first substrate is parallel with the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and
the third conductive sub-sheet extends from a side surface of the second substrate to an upper surface of the second substrate away from the base, wherein the side surface of the second substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and the upper surface of the second substrate is parallel with the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided;
a second manner comprising:
the first conductive sub-sheet extends from the side surface of the first substrate to an upper surface of the first substrate away from the base, and
the third conductive sub-sheet is provided on the side surface of the second substrate; and
a third manner comprises:
the first conductive sub-sheet is provided on the side surface of the first substrate, and
the third conductive sub-sheet extends from a side surface of the second substrate to an upper surface of the second substrate away from the base; and
a fourth manner comprises:
the first conductive sub-sheet is provided on the side surface of the first substrate, and
the third conductive sub-sheet is provided on the side surface of the second substrate.
6. The laser of claim 1 , further comprises:
an optical detector.
7. The laser of claim 1 , further comprising:
a thermoelectric cooler between the heat transfer substrate and the base.
8. The laser of claim 7 , further comprises:
a sub-substrate on the thermoelectric cooler; and
an optical detector located on the sub-substrate.
9. The laser of claim 7 , wherein the heat transfer substrate is of a L-shaped structure; and
the laser further comprises:
a sub-substrate on a lateral part of the L-shaped structure; and
an optical detector located on the sub-substrate.
10. The laser of claim 1 , wherein,
the first conductive sub-sheet and the second conductive sub-sheet are coupled through wire bonding; and
the third conductive sub-sheet and the fourth conductive sub-sheet are coupled through wire bonding.
11. An optical module including a TO-CAN packaged laser, wherein the TO-CAN packaged laser comprises:
a base;
a first substrate located on the base, wherein the first substrate is provided with a first conductive sub-sheet and comprises a first metal heat sink;
a second substrate located on the base, wherein the second substrate is provided with a third conductive sub-sheet and comprises a second metal heat sink;
a heat transfer substrate located on the base and between the first substrate and the second substrate, wherein the heat transfer substrate is provided with a second conductive sub-sheet and a fourth conductive sub-sheet, the heat transfer substrate have a higher heat exchange rate than the first substrate and the second substrate, and the heat transfer substrate comprises a third metal heat sink;
a laser chip provided on the heat transfer substrate, wherein an anode of the laser chip is electrically coupled with the second conductive sub-sheet and a cathode of the laser chip is electrically coupled with the fourth conductive sub-sheet; and
a first pin and a second pin that protrude from the base, wherein the first pin is coupled with the first conductive sub-sheet by conductive welding flux or conductive paste and the second pin is coupled with the third conductive sub-sheet by conductive welding flux or conductive paste.
12. The optical module of claim 11 , wherein the laser chip is attached on the second conductive sub-sheet or the fourth conductive sub-sheet.
13. The optical module of claim 11 , wherein,
the laser chip is disposed on an upper surface of the heat transfer substrate away from the base, wherein the upper surface of the heat transfer substrate is parallel with a surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided.
14. The optical module of claim 13 , wherein the second conductive sub-sheet and the fourth conductive sub-sheet are provided in one of following:
a first manner comprises:
the second conductive sub-sheet extends from a side surface of the heat transfer substrate to the upper surface of the heat transfer substrate, wherein the side surface of the heat transfer substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and
the fourth conductive sub-sheet extends from the side surface of the heat transfer substrate to the upper surface of the heat transfer substrate;
a second manner comprises:
the second conductive sub-sheet is provided on the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet is provided on the upper surface of the heat transfer substrate;
a third manner comprises:
the second conductive sub-sheet is provided on the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet extends from the side surface of the heat transfer substrate to the upper surface of the heat transfer substrate; and
a fourth manner comprises:
the second conductive sub-sheet extends from a side surface of the heat transfer substrate to the upper surface of the heat transfer substrate, and
the fourth conductive sub-sheet is provided on the upper surface of the heat transfer substrate.
15. The optical module of claim 13 , wherein the first conductive sub-sheet and the third conductive sub-sheet are provided in of the following:
a first manner comprises:
the first conductive sub-sheet extends from a side surface of the first substrate to an upper surface of the first substrate away from the base, wherein the side surface of the first substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and the upper surface of the first substrate is parallel with the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and
the third conductive sub-sheet extends from a side surface of the second substrate to an upper surface of the second substrate away from the base, wherein the side surface of the second substrate is perpendicular to the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided, and the upper surface of the second substrate is parallel with the surface of the base on which the first substrate, the second substrate and the heat transfer substrate are provided;
a second manner comprises:
the first conductive sub-sheet extends from the side surface of the first substrate to an upper surface of the first substrate away from the base, and
the third conductive sub-sheet is provided on the side surface of the second substrate; and
a third manner comprises:
the first conductive sub-sheet is provided on the side surface of the first substrate, and
the third conductive sub-sheet extends from a side surface of the second substrate to an upper surface of the second substrate away from the base; and
a fourth manner comprises:
the first conductive sub-sheet is provided on the side surface of the first substrate, and
the third conductive sub-sheet is provided on the side surface of the second substrate.
16. The optical module of claim 11 , wherein,
the first conductive sub-sheet and the second conductive sub-sheet are coupled through wire bonding; and
the third conductive sub-sheet and the fourth conductive sub-sheet are coupled through wire bonding.
17. A TO-CAN packaged laser, comprising:
a base;
a first substrate located on the base, wherein the first substrate is provided with a first conductive sub-sheet, wherein the first conductive sheet is L-shaped, a lateral part of the first conductive sub-sheet is attached on an upper surface of the first substrate, a vertical part of the first conductive sub-sheet is attached on a side surface of the first substrate, the upper surface of the first substrate is parallel with a surface of the base on which the first substrate is located, and the side surface of the first substrate is perpendicular to the surface of the base on which the first substrate is located;
a second substrate located on the base, wherein the second substrate is provided with a third conductive sub-sheet, wherein the third conductive sheet is L-shaped, a lateral part of the third conductive sub-sheet is attached on an upper surface of the second substrate, a vertical part of the third conductive sub-sheet is attached on a side surface of the second substrate, the upper surface of the second substrate is parallel with the surface of the base, and the side surface of the second substrate is perpendicular to the surface of the base;
a heat transfer substrate located on the base and between the first substrate and the second substrate, wherein the heat transfer substrate is provided with a second conductive sub-sheet and a fourth conductive sub-sheet, the second conductive sub-sheet is provided on an upper surface of the heat transfer substrate, the fourth conductive sub-sheet is provided on the upper surface of the heat transfer substrate, the upper surface of the heat transfer substrate is parallel with the surface of the base;
a laser chip provided on the upper surface of the heat transfer substrate, wherein an anode of the laser chip is electrically coupled with the second conductive sub-sheet and a cathode of the laser chip is electrically coupled with the fourth conductive sub-sheet; and
a first pin and a second pin that protrude from the base, wherein the first pin is coupled with the vertical part of the first conductive sub-sheet by conductive welding flux or conductive paste and the second pin is coupled with the vertical part of the third conductive sub-sheet by conductive welding flux or conductive paste.
18. The laser of claim 17 , wherein the second conductive sub-sheet extends from a side surface of the heat transfer substrate to the upper surface of the heat transfer substrate, wherein the side surface of the heat transfer substrate is perpendicular to the surface of the base;
the fourth conductive sub-sheet extends from the side surface of the heat transfer substrate to the upper surface of the heat transfer substrate.