INTERCONNECTS FOR A MULTI-DIE PACKAGE
Systems, devices, and methods for interconnects for a multi-die package are described. A multi-die package may include a set of conductive pillars and two or more semiconductor dice that each include a bond pad. In some cases, the multi-die package may include a plurality of pillar-wire combinations, and a bond wire may couple a corresponding conductive pillar with a corresponding bond pad. Pillar-wire combinations may each collectively have a matched impedance, or pillar-wire combinations in different groups may have different collective impedances. In other cases, a conductive pillar may be directly coupled with a corresponding bond pad without a bond wire. Different pillar-wire combinations or directly-coupled pillars may carry different signals. In some cases, pillars may be individually impedance-matched to a desired impedance.
1 . An apparatus, comprising:
a plurality of semiconductor dice disposed above a substrate, each semiconductor die of the plurality comprising an upper surface in contact with a bond pad;
a plurality of conductive pillars above the substrate; and
a plurality of bond wires each coupled with a corresponding conductive pillar of the plurality and a corresponding bond pad.
2 . The apparatus of claim 1 , wherein:
the plurality of bond wires and the plurality of conductive pillars comprise a plurality of pillar-wire combinations that each comprise a bond wire of the plurality and the corresponding conductive pillar, and
the pillar-wire combinations of the plurality each have a matched impedance.
3 . The apparatus of claim 2 , wherein the plurality of conductive pillars comprises:
conductive pillars that each have a matched impedance.
4 . The apparatus of claim 2 , wherein the plurality of conductive pillars comprises:
a first conductive pillar of the plurality that has a different impedance than a second conductive pillar of the plurality.
5 . The apparatus of claim 1 , wherein:
a conductive pillar of the plurality has a height that is greater than or equal to a thickness of a semiconductor die of the plurality.
6 . The apparatus of claim 1 , wherein the plurality of conductive pillars comprises:
a first group of conductive pillars having a first height and a second group of conductive pillars having a second height different from the first height.
7 . The apparatus of claim 1 , wherein the plurality of conductive pillars comprises:
a first group of conductive pillars having a first cross-sectional area and a second group of conductive pillars having a second cross-sectional area different from the first cross-sectional area.
8 . The apparatus of claim 1 , wherein the plurality of conductive pillars comprises:
groups of conductive pillars, each group of conductive pillars corresponding to a respective semiconductor die of the plurality.
9 . The apparatus of claim 1 , wherein:
the plurality of bond wires and the plurality of conductive pillars comprise a plurality of pillar-wire combinations that each comprise a bond wire of the plurality and the corresponding conductive pillar; and
the plurality of pillar-wire combinations comprises groups of pillar-wire combinations, pillar-wire combinations in different groups of pillar-wire combinations having different impedances.
10 . The apparatus of claim 9 , wherein:
a first group of pillar-wire combinations is configured to communicate a first category of signals and a second group of pillar-wire combinations is configured to communicate a second category of signals.
11 . The apparatus of claim 10 , wherein:
the first category of signals comprises a power signal and the second category of signals comprises a clock signal or a data signal.
12 . The apparatus of claim 1 , wherein:
the plurality of semiconductor dice comprises a stack of semiconductor dice; and
a subset of the semiconductor dice of the stack are offset in a first direction.
13 . The apparatus of claim 12 , wherein:
a first semiconductor die of the plurality is offset relative to a second semiconductor die of the plurality in the first direction; and
a third semiconductor die of the plurality is offset relative to the second semiconductor die of the plurality in a second direction that is opposite to the first direction.
14 . The apparatus of claim 12 , wherein:
the subset of the semiconductor dice of the stack are offset in a second direction that is orthogonal to the first direction.
15 . The apparatus of claim 12 , wherein:
the plurality of conductive pillars is disposed above a first region of the substrate;
the stack of semiconductor dice is disposed above a second region of the substrate; and
each semiconductor die of the stack is disposed farther from the first region than any lower semiconductor die of the stack.
16 . An apparatus, comprising:
a plurality of semiconductor dice disposed above a first region of a substrate, each semiconductor die of the plurality comprising a lower surface in contact with a bond pad; and
a plurality of conductive pillars above a second region of the substrate, the second region being subset of the first region, each conductive pillar of the plurality directly coupled with a corresponding bond pad.
17 . The apparatus of claim 16 , wherein conductive pillars of the plurality are impedance-matched to one another.
18 . The apparatus of claim 17 , wherein:
a first conductive pillar of the plurality has a different height than a second conductive pillar of the plurality.
19 . The apparatus of claim 17 , wherein:
a first conductive pillar of the plurality has a different cross-sectional area than a second conductive pillar of the plurality.
20 . The apparatus of claim 16 , wherein:
the plurality of conductive pillars further comprises groups of conductive pillars; and
a height of conductive pillars in a same group of conductive pillars corresponds to a distance between the substrate and the lower surface of a corresponding semiconductor die of the plurality.
21 . The apparatus of claim 16 , wherein:
each conductive pillar of the plurality is electrically coupled with the corresponding bond pad via a solder.
22 . An apparatus, comprising:
a plurality of semiconductor dice disposed above a substrate, each semiconductor die of the plurality comprising a bond pad of a plurality of bond pads;
a plurality of conductive pillars disposed above the substrate, wherein a first group of conductive pillars of the plurality has a first height that is less than a thickness of a semiconductor die of the plurality and a second group of conductive pillars of the plurality has a second height that is greater than the thickness of the semiconductor die; and
a plurality of bond wires each electrically coupling a corresponding conductive pillar of the plurality with a corresponding bond pad of the plurality.
23 . The apparatus of claim 16 , wherein:
conductive pillars of the plurality are impedance-matched to a common impedance.
24 . An apparatus, comprising:
a plurality of semiconductor dice disposed above a first region of a substrate, each semiconductor die of the plurality comprising a bond pad; and
a plurality of conductive pillars disposed above a second region of the substrate, the first region at least partially including the second region, wherein:
each conductive pillar of a first group of conductive pillars of the plurality has a first height corresponding to a first distance between a first semiconductor die of the plurality and the substrate; and
each conductive pillar of a second group of conductive pillars of the plurality has a second height corresponding to a second distance between a second semiconductor die of the plurality and the substrate.
25 . The apparatus of claim 16 , wherein:
each conductive pillar of the first group is in contact with the first semiconductor die; and
each conductive pillar of the second group is in contact with the second semiconductor die.