Input/output systems and devices for use with superconducting devices
Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The ace between the cryogenic tubular assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.
1. A feed-through structure to receive printed circuit board cable, comprising:
a plate having a first surface and a second surface opposite the first surface, wherein the first surface of the plate includes at least one elongated through-hole sized and dimensioned to receive a printed circuit board cable, and wherein the at least one elongated through-hole extends through the second surface of the plate;
wherein the feed-through structure includes a cavity adjacent to the second surface of the plate such that the at least one elongated through-hole extends through the plate and into the cavity, and wherein the cavity includes an open end to receive a sealing agent to establish a substantially hermetic seal in the at least one elongated through-hole.
2. The feed-through structure of claim 1 wherein the plate further comprises:
at least one additional elongated through-hole, wherein each of the at least one additional elongated through-holes is sized and dimensioned to receive a respective printed circuit board cable, and wherein each of the elongated through-holes extends through the plate and into the cavity.
3. The feed-through structure of claim 1 wherein the cavity is formed in a volume of the plate and the open end of the cavity extends through the second surface of the plate.
4. The feed-through structure of claim 1 , further comprising:
a flange that includes a through-hole, wherein the plate is mated with the flange such that the plate covers a first end of the through-hole and the cavity is formed by the through-hole in the flange.
5. The feed-through structure of claim 4 , further comprising:
a hollow vacuum box, wherein a surface of the vacuum box includes an opening and the flange is mounted in the opening such that the at least one elongated through-hole in the plate opens through the cavity into the vacuum box.
6. A system to provide electrical communication between a first environment at a first pressure and a second environment at a second pressure, wherein the second pressure is substantially different from the first pressure, the system comprising:
a first printed circuit board cable; and
a first feed-through structure having a first side and a second side, the first feed-through structure comprising:
a plate having a first surface and a second surface opposite the first surface, wherein the first surface of the plate includes a first elongated through-hole that extends through the second surface of the plate, and wherein the first surface of the plate corresponds to the first side of the first feed-through structure;
wherein the first feed-through structure includes a cavity adjacent to the second surface of the plate such that the first elongated through-hole extends through the plate and into the cavity, and wherein the cavity includes an open end that corresponds to the second side of the first feed-through structure; and
wherein a portion of the first printed circuit board cable is received through the first elongated through-hole such that the first printed circuit board cable passes through the first elongated through-hole and extends into the cavity, and wherein the cavity is potted with a sealing agent to establish a substantially hermetic seal between the first and second sides of the first feed-through structure.
7. The system of claim 6 , further comprising:
at least one additional printed circuit board cable, wherein the first surface of the plate includes at least one additional elongated through-hole that extends through the second surface of the plate and into the cavity, and wherein each printed circuit board cable is received through a respective elongated through-hole such that each printed circuit board cable passes through a respective elongated through-hole and extends into the cavity.
8. The system of claim 6 wherein the cavity is formed in a volume of the plate and the open end of the cavity extends through the second surface of the plate.
9. The system of claim 6 wherein a segment of the first printed circuit board cable extends out the open end of the cavity on the second side of the first feed-through structure, and wherein an electrical connection is established between the segment and at least one conductive current path.
10. The system of claim 9 wherein the at least one conductive current path is superconductive below a critical temperature.
11. The system of claim 6 wherein the sealing agent includes at least one of an epoxy and a mixture of a mixture of metal powder and epoxy.
12. The system of claim 6 wherein the first elongated through-hole has a cross-sectional area that is larger than a cross-sectional area of the first printed circuit board cable such that a gap exists between a perimeter of the first elongated through-hole and a surface of the first printed circuit board, and wherein the gap is sealed with a sealing agent.
13. The system of claim 6 wherein the first feed-through structure comprises a flange that includes a through-hole, and wherein the plate is mated with the flange such that the plate covers a first end of the through-hole and the cavity is formed by the through-hole in the flange.
14. The system of claim 13 further comprising:
a hollow vacuum box, wherein a surface of the vacuum box includes a first opening and the flange of the first feed-through structure is mounted in the first opening such that the at least one elongated through-hole in the plate opens through the cavity into the vacuum box.
15. The system of claim 14 wherein the first side of the first feed-through structure is outside of the vacuum box, and wherein the first printed circuit board cable extends into the vacuum box.
16. The system of claim 14 , further comprising:
a second feed-through structure having a first side and a second side, the second feed-through structure comprising:
a plate having a first surface and a second surface opposite the first surface, wherein the first surface of the plate includes a first elongated through-hole that extends through the second surface of the plate, and wherein the first surface of the plate corresponds to the first side of the second feed-through structure;
a flange that includes a through-hole, wherein the plate is mated with the flange such that the plate covers a first end of the through-hole and a cavity is formed by the through-hole in the flange, wherein the cavity is adjacent to the second surface of the plate such that the first elongated through-hole extends through the plate and into the cavity;
wherein a portion of the first printed circuit board cable is received through the first elongated through-hole such that the first printed circuit board cable passes through the first elongated through-hole and extends into the cavity, and wherein the cavity is potted with a sealing agent to establish a substantially hermetic seal between the first and second sides of the second feed-through structure; and
wherein a surface of the vacuum box includes a second opening and the flange of the second feed-through structure is mounted in the second opening such that the at least one elongated through-hole in the plate opens through the cavity into the vacuum box.
17. The feed-through structure of claim 1 wherein the printed circuit board cable includes a flexible printed circuit board cable.
18. The feed-through structure of claim 1 wherein the printed circuit board cable includes at least one printed circuit board cable selected from a group consisting of: a coaxial cable, a shielded twisted pair cable, and a wire.
19. The system of claim 7 wherein the at least one additional printed circuit board cable includes a flexible printed circuit board cable.
20. The system of claim 7 wherein the at least one additional printed circuit board cable includes at least one printed circuit board cable selected from a group consisting of: a coaxial cable, a shielded twisted pair cable, and a wire.