IP Library Granted Patent US 10,601,113
Granted Patent B2
US 10,601,113 · App. 16/125,163 · Granted Mar 24, 2020

Electronic device comprising antenna

Inventors: Hong Pyo Bae (Gyeonggi-do, KR); Dong Yeon Kim (Gyeonggi-do, KR); Ho Jung Nam (Gyeonggi-do, KR); Sung Koo Park (Gyeonggi-do, KR); Jae Woon Park (Seoul, KR); Min Cheol Seo (Seoul, KR); Him Chan Yun (Gyeonggi-do, KR); Han Dug Lee (Gyeonggi-do, KR); Hyun Woo Lee (Gyeonggi-do, KR); Hyung Joo Lee (Gyeonggi-do, KR); Byung Man Lim (Seoul, KR); Nak Chung Choi (Seoul, KR)
Assignee: Samsung Electronics Co., Ltd
H01Q1/243H01Q1/38H01Q1/526H01Q9/0407H01Q13/10H04M1/0266H05K1/0216H05K1/0237H04M1/0262
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Quick Facts
Patent No.
US 10,601,113
App. No.
16/125,163
Granted
Mar 24, 2020
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate, the housing including at least one antenna element extended along one portion of the side member, a display exposed through the front plate and including a display panel and a shield layer, a wireless communication circuit electrically connected to the antenna element, a support member, at least a portion of which is positioned in the space in parallel with the shield layer, and a conductive patch layer interposed between the shield layer and the support member.

Claims (41)

1. An electronic device comprising:

a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate,

wherein at least a portion of the side member is formed of an electrically conductive material;

a display positioned in the space between the front plate and the rear plate, the display including a first conductive layer parallel to the front plate;

a conductive structure interposed between the display and the rear plate, the conductive structure including a second conductive layer parallel to the first conductive layer and overlapping at least partially with the first conductive layer when viewed from above the front plate;

a printed circuit board interposed between the conductive structure and the rear plate;

a wireless communication circuit positioned on the printed circuit board and electrically connected with a portion of the side member; and

a conductive patch layer interposed between the first conductive layer and the second conductive layer, wherein at least one portion of the conductive patch layer is extended along the portion of the side member in a first direction or in a second direction perpendicular to the first direction.

2. The electronic device of claim 1 , wherein the patch layer is attached to the second conductive layer.

3. The electronic device of claim 1 , wherein the patch layer is electrically isolated from at least one of the first conductive layer or the second conductive layer.

4. The electronic device of claim 1 , wherein the patch layer is formed of copper.

5. The electronic device of claim 1 , wherein the second conductive layer includes an opening,

wherein the electronic device further comprises a battery partially positioned in the opening, and

wherein the patch layer is extended in the first direction across the opening.

6. The electronic device of claim 1 , wherein the patch layer includes:

a first portion extended in the first direction; and

a second portion extended from one end of the first portion in the second direction.

7. The electronic device of claim 6 , wherein the patch layer further includes:

a third portion extended from another end of the first portion in the second direction.

8. The electronic device of claim 1 , wherein the patch layer is extended along an edge of the second conductive layer.

9. The electronic device of claim 1 , wherein the patch layer includes patterns arranged regularly.

10. The electronic device of claim 1 , further comprising:

an insulating member interposed between the first conductive layer and the second conductive layer,

wherein the insulating member does not overlap with the patch layer when viewed from above the front plate.

11. The electronic device of claim 10 , wherein the insulating member has permittivity or permeability.

12. The electronic device of claim 11 , wherein the insulating member includes a highly-resistant (HR) tape.

13. The electronic device of claim 1 , wherein the first conductive layer is formed of copper.

14. The electronic device of claim 1 , wherein the side member includes two or more regions, which are physically spaced from each other and are formed of an electrically conductive material.

15. The electronic device of claim 14 , wherein the wireless communication circuit is electrically connected to the two or more regions formed of an electrically conductive material.

16. An electronic device comprising:

a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate, the housing including at least one antenna element extended along one portion of the side member;

a display exposed through the front plate and including a display panel and a shield layer;

a wireless communication circuit electrically connected to the antenna element;

a support member, at least a portion of which is positioned in the space in parallel with the shield layer; and

a conductive patch layer interposed between the shield layer and the support member.

17. The electronic device of claim 16 , wherein the conductive patch layer is electrically connected to the shield layer or the support member.

18. The electronic device of claim 16 , wherein the conductive patch layer is electrically isolated from at least one of the support member and the shield layer.

19. The electronic device of claim 16 , wherein the support member includes an opening formed to be spaced from the antenna element.

20. The electronic device of claim 19 , further comprising:

a battery,

wherein the opening is formed to correspond to a size of the battery.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2018
From: BAE, HONG PYO; KIM, DONG YEON; NAM, HO JUNG; PARK, SUNG KOO; PARK, JAE WOON; SEO, MIN CHEOL; YUN, HIM CHAN; LEE, HAN DUG; LEE, HYUN WOO; LEE, HYUNG JOO; LIM, BYUNG MAN; CHOI, NAK CHUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046837/0425 →
Priority Claims (1)
KR 10-2017-0114626 · Sep 7, 2017 · national
Continuity (1)
Related Publication 20190074576A1 · Mar 7, 2019
Cited By (2)
US 12,422,891 US 12,621,925