INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
Embodiments relate to the design of a device capable of maintaining the alignment an interconnect by resisting lateral forces acting on surfaces of the interconnect. The device comprises a first body comprising a first surface with a nanoporous metal structure protruding from the first surface. The device further comprises a second body comprising a second surface with a locking structure to resist a lateral force between the first body and the second body during or after assembly of the first body and the second body.
1 . A device comprising:
a first body comprising a first conductive surface with a nanoporous metal structure protruding from the first conductive surface; and
a second body comprising a second conductive surface facing the first conductive surface, the second conductive surface formed with a locking structure to resist a lateral force between the first body and the second body during assembly or after assembly of the first body and the second body.
2 . The device of claim 1 , wherein the nanoporous metal structure has a conical shape or a stepped conic shape before the assembly, and the locking structure has an indented portion that is configured to receive a tip of the nanoporous metal structure that is collapsed during the assembly.
3 . The device of claim 2 , wherein the nanoporous metal structure is formed by an electroplating process and a dealloying process.
4 . The device of claim 3 , wherein the first body is immersed in a series of solutions with different metal compositions during the electroplating process.
5 . The device of claim 2 , wherein a portion of the nanoporous metal structure collapsed during the assembly at least fills the indented portion.
6 . The device of claim 1 , wherein the nanoporous metal structure comprises a nanoporous gold structure.
7 . The device of claim 1 , wherein the locking structure comprises a pin protruding from the second conductive surface and configured to penetrate into the nanoporous metal structure during the assembly.
8 . The device of claim 1 , wherein the first body is a light emitting diode and the second body is a substrate formed with circuits to operate the light emitting diode.
9 . A method comprising:
positioning a first body relative to a second body to align a nanoporous metal structure protruding from a first conductive surface of the first body with a locking structure on a second conductive surface of the second body facing the first conductive surface; and
engaging the nanoporous metal structure with the locking structure in a manner that resists a lateral force between the first body and the second body during assembly or after assembly of the first body and the second body, after positioning the first body relative to the second body.
10 . The method of claim 9 , wherein the nanoporous metal structure engages with the locking structure by collapsing at least a tip of the nanoporous metal structure.
11 . The method of claim 10 , further comprising forming the nanoporous metal structure by aa electroplating process and a dealloying process before positioning the first body relative to the second body.
12 . The method of claim 11 , wherein forming the nanoporous metal structure comprises immersing the first body in a series of solutions with different metal compositions during the electroplating process.
13 . The method of claim 10 , wherein a portion of the nanoporous metal structure collapsed during the assembly at least fills an indented portion of the locking structure.
14 . The method of claim 9 , wherein the nanoporous metal structure comprises a nanoporous gold structure.
15 . The method of claim 9 , wherein the nanoporous metal structure engages with the locking structure by having a pin protruding from the second conductive surface penetrate into the nanoporous metal structure.
16 . The method of claim 9 , wherein the first body is a light emitting diode and the second body is a substrate formed with circuits to operate the light emitting diode.
17 . A non-transitory computer readable medium storing instructions thereon, the instructions when executed by a processor cause the processor to:
position a first body relative to a second body to align a nanoporous metal structure protruding from a first conductive surface of the first body with a locking structure on a second conductive surface of the second body facing the first conductive surface; and
engage the nanoporous metal structure with the locking structure in a manner that resists a lateral force between the first body and the second body during assembly or after assembly of the first body and the second body, after positioning the first body relative to the second body.
18 . The non-transitory computer readable medium of claim 1 , wherein the nanoporous metal structure engages with the locking structure by collapsing at least a tip of the nanoporous metal structure, the collapsing of the nanoporous structure at least filling an indented portion of the locking structure.
19 . The non-transitory computer readable medium of claim 1 , further comprising instructions causing the processor to form the nanoporous metal structure by an electroplating process and a dealloying process before positioning the first body relative to the second body, the electroplating process further comprising immersing the first body in a series of solutions with different metal compositions.
20 . The non-transitory computer readable medium of claim 1 , wherein the first body is a light emitting diode and the second body is a substrate formed with circuits to operate the light emitting diode.