IP Library Granted Patent US 10,517,191
Granted Patent B2
US 10,517,191 · App. 16/131,105 · Granted Dec 24, 2019

Liquid immersion server

Inventors: Yukiko Wakino (Sagamihara, JP); Satoshi Inano (Minoh, JP); Hiroyuki Fukuda (Yokohama, JP); Minoru Ishinabe (Atsugi, JP)
Assignee: FUJITSU LIMITED
H05K7/20236G06F1/20G06F1/206H05K7/20272H05K7/20772G06F2200/201
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Quick Facts
Patent No.
US 10,517,191
App. No.
16/131,105
Granted
Dec 24, 2019
Kind
B2
Abstract

A liquid immersion server includes a processor, a heat sink to which heat generated by the processor is transferred, a flow channel through which a first refrigerant liquid that has absorbed heat from the heat sink flows, and a cooling bath that stores a second refrigerant liquid that is inactive in a lower section thereof and that stores the first refrigerant liquid in an upper section thereof, wherein when the liquid immersion server is in operation, the processor, the heat sink, and the flow channel are immersed in the second refrigerant liquid, the flow channel has a supply port to which the first refrigerant liquid is supplied from a first pipe and a first discharge port that discharges the first refrigerant liquid that has absorbed heat into the cooling bath.

Claims (16)

1. A liquid immersion server comprising:

a processor;

a heat sink to which heat generated by the processor is transferred;

a flow channel through which a first refrigerant liquid that has absorbed heat from the heat sink flows; and

a cooling bath that stores a second refrigerant liquid that is inactive in a lower section thereof and that stores the first refrigerant liquid in an upper section thereof,

when the liquid immersion server is in operation, the processor, the heat sink, and the flow channel are immersed in the second refrigerant liquid,

the flow channel has a supply port to which the first refrigerant liquid is supplied and a discharge port that discharges the first refrigerant liquid that has absorbed heat into the second refrigerant liquid in the lower section of the cooling bath, and

the density of the first refrigerant liquid is smaller than the density of the second refrigerant liquid.

2. The liquid immersion server according to claim 1 , wherein the heat sink and the flow channel are disposed over the processor.

3. The liquid immersion server according to claim 1 , wherein the heat sink and the flow channel are disposed under the processor.

4. The liquid immersion server according to claim 3 , further comprising:

a fan that stirs the second refrigerant liquid; and

a protective cover disposed between the first refrigerant liquid discharged from the discharge port of the flow channel into the second refrigerant liquid and the processor.

5. The liquid immersion server according to claim 1 , further comprising:

a cooling apparatus that cools the first refrigerant liquid discharged into the discharge port; and

a pump that delivers the first refrigerant liquid discharged into the discharge port to the cooling bath.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2018
From: WAKINO, YUKIKO; INANO, SATOSHI; FUKUDA, HIROYUKI; ISHINABE, MINORU
To: FUJITSU LIMITED
Reel/Frame 047091/0678 →
Priority Claims (1)
JP 2017-184916 · Sep 26, 2017 · national
Continuity (1)
Related Publication 20190098796A1 · Mar 28, 2019
Cited By (1)
US 12,363,865