IP Library Granted Patent US 10,582,639
Granted Patent B1
US 10,582,639 · App. 16/131,629 · Granted Mar 3, 2020

Liquid cooling distribution in a modular electronic system

Inventors: Rakesh Chopra (Menlo Park, CA); Mandy Hin Lam (Fremont, CA); M. Baris Dogruoz (Santa Clara, CA)
Assignee: CISCO TECHNOLOGY, INC.
H05K7/20218H05K7/026
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Quick Facts
Patent No.
US 10,582,639
App. No.
16/131,629
Granted
Mar 3, 2020
Kind
B1
Abstract

In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.

Claims (39)

1. An apparatus comprising:

a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation;

a coolant distribution module inserted into one of said plurality of slots in said first orientation for distributing coolant to at least one of the modules in said second group of the modules; and

a second coolant distribution module inserted into one of said plurality of slots in said second orientation for distributing coolant to at least one of the modules in said first group of the modules.

2. The apparatus of claim 1 wherein the second coolant distribution module receives coolant from the coolant distribution module inserted into one of said plurality of slots in said first orientation.

3. The apparatus of claim 1 wherein one of said first and second groups of the modules comprises line cards and said other of said first and second groups of the modules comprises fabric cards.

4. The apparatus of claim 1 wherein said second group of the modules comprises line cards inserted horizontally in the chassis.

5. The apparatus of claim 1 wherein said second group of the modules comprises fabric cards inserted vertically in the chassis.

6. The apparatus of claim 1 wherein at least one of the modules of said first and second groups of modules is configured only for air cooling by a fan in the chassis.

7. The apparatus of claim 1 wherein the coolant distribution module comprises at least one external connector for receiving the coolant.

8. The apparatus of claim 1 wherein the coolant distribution module comprises a plurality of quick disconnects for mating with coolant distribution lines on a plurality of the modules in said second group of modules.

9. The apparatus of claim 1 wherein the coolant passes through a heat exchanger external to the chassis.

10. The apparatus of claim 1 wherein the coolant distribution module comprises internal connectors for mating with connectors on said second group of the modules receiving the coolant, the internal connectors offset from a location of an orthogonal connector on an air cooled module.

11. The apparatus of claim 1 wherein the coolant distribution module comprises internal connectors for mating with connectors on said second group of the modules receiving the coolant, the internal connectors operable to move between a recessed position when mating with an air cooled module and an engaged position when mating with the connectors on said second group of the modules.

12. An apparatus comprising:

a coolant distribution module for insertion into a chassis of a network device in a first orientation for delivering coolant to one or more modules inserted into the chassis in a second orientation orthogonal to said first orientation, the coolant distribution module comprising:

a plurality of internal connectors for connection to said one or more modules; and

distribution lines for delivering coolant to said plurality of internal connectors.

13. The apparatus of claim 12 wherein the coolant distribution module further comprises at least one external connector for receiving the coolant from an external source.

14. The apparatus of claim 12 wherein at least one of the internal connectors is configured for distributing the coolant to a second coolant distribution module inserted into the chassis in said second orientation for distributing the coolant to one or more modules inserted into the chassis in said first orientation.

15. The apparatus of claim 12 wherein said one or more modules comprises line cards.

16. The apparatus of claim 12 wherein said one or more modules comprises a plurality of modules, at least one of the modules configured only for air cooling by a fan in the chassis.

17. A method comprising:

receiving coolant at a coolant distribution module inserted into a slot of a chassis in a first orientation;

delivering coolant to a plurality of modules inserted into a plurality of slots in the chassis in a second orientation orthogonal to said first orientation for cooling components on the modules; and

delivering coolant to a second coolant distribution module inserted into one of the slots in said second orientation for delivering the coolant to a plurality of modules inserted into slots of the chassis in said first orientation.

18. The method of claim 17 further comprising air cooling one or more modules inserted into the chassis.

19. A method comprising:

receiving coolant at a coolant distribution module inserted into a slot of a chassis in a first orientation;

delivering coolant to a plurality of modules inserted into a plurality of slots in the chassis in a second orientation orthogonal to said first orientation for cooling components on the modules; and

air cooling one or more modules inserted into the chassis and configured only for air cooling.

20. An apparatus comprising:

a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation; and

a coolant distribution module inserted into one of said plurality of slots in said first orientation for distributing coolant to at least one of the modules in said second group of the modules;

wherein the coolant distribution module comprises internal connectors for mating with connectors on said second group of the modules receiving the coolant, the internal connectors offset from a location of an orthogonal connector on an air cooled module.

21. An apparatus comprising:

a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation; and

a coolant distribution module inserted into one of said plurality of slots in said first orientation for distributing coolant to at least one of the modules in said second group of the modules;

wherein the coolant distribution module comprises internal connectors for mating with connectors on said second group of the modules receiving the coolant, the internal connectors operable to move between a recessed position when mating with an air cooled module and an engaged position when mating with the connectors on said second group of the modules.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2018
From: CHOPRA, RAKESH; LAM, MANDY HIN; DOGRUOZ, M. BARIS
To: CISCO TECHNOLOGY, INC.
Reel/Frame 046878/0320 →
Cited By (7)
US 12,250,024 US 12,313,886 US 12,405,433 US 12,455,422 US 12,461,322 US 12,490,401 US 12,520,448