Thermal interface structure for optical transceiver modules
A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.
1. An electronic component, comprising:
a cage receptacle including a heat sink;
an optical transceiver module including a housing having an external wall; and
a thermal interface structure disposed between and in abutment with the external wall and with the heat sink, the thermal interface structure comprising:
a solid thermal interface material including a polymer matrix, a phase change material, and at least one filler present in a total amount of 85 wt. % to 97 wt. %, based on a total weight of the thermal interface material;
a polymer layer connected to the thermal interface material; and
wherein the thermal interface material includes a first side and a second side, the first side connected to the external wall of the housing and the second side connected to the polymer layer, and the polymer layer in abutment with the heat sink of the cage receptacle.
2. An electronic component, comprising:
a cage receptacle including a heat sink;
an optical transceiver module including a housing having an external wall; and
a thermal interface structure disposed between and in abutment with the external wall and with the heat sink, the thermal interface structure comprising:
a solid thermal interface material including a polymer matrix, a phase change material, and at least one filler present in a total amount of 85 wt. % to 97 wt. %, based on a total weight of the thermal interface material;
a polymer layer connected to the thermal interface material; and
wherein the thermal interface material includes a first side and a second side, the first side connected to the heat sink of the cage receptacle and the second side connected to the polymer layer, the polymer layer in abutment with the external wall of the housing.
3. The electronic component of claim 1 , wherein the thermal interface structure additionally includes an adhesive layer connecting the polymer layer and the heat sink of the cage receptacle.
4. The electronic component of claim 2 , wherein the thermal interface structure additionally includes an adhesive layer connecting the polymer layer and the external wall of the optical transceiver module.
5. The electronic component of claim 1 , wherein the polymer layer is formed of at least one polymer selected from the group consisting of polyester, polyimide, polysulfone, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyvinylchloride, polylactic acid, polyurethane, polyacrylic, polyvinyl alcohol, polyethylene vinylacetate, polyethylene, polypropylene, polycyclopentadiene, polytetrafluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, poly(ethylene-co-tetrafluoroethylene), poly(hexafluoropropylene-co-tetrafluoroethylene), polychlorotrifluoroethylene, polystyrene, polyether sulfone, polyether ether ketone, and combinations thereof.
6. The electronic component of claim 1 , wherein the polymer layer has a thermal conductivity of at least 0.2 W/mK.
7. The electronic component of claim 1 , wherein the phase change material has a melting point of 20° C. to 100° C.
8. An electronic component, comprising:
a cage receptacle including a heat sink;
an optical transceiver module including a housing having an external wall; and
a thermal interface structure disposed between and in abutment with the external wall and with the heat sink, the thermal interface structure comprising:
a solid thermal interface material including a polymer matrix, a phase change material, and at least one filler present in a total amount of 85 wt. % to 97 wt. %, based on a total weight of the thermal interface material;
an adhesive surrounding a perimeter of the thermal interface material; and
a polymer layer connected to the thermal interface material and the adhesive;
wherein the thermal interface material and the adhesive each include a first side and a second side, each first side connected to the polymer layer and each second side connected to the heat sink of the cage receptacle; and
wherein the polymer layer includes a first side and a second side, the first side connected to the thermal interface material and the adhesive, and the second side in abutment with the external wall of the optical transceiver module housing.
9. The electronic component of claim 8 , wherein the phase change material has a melting point of 20° C. to 100° C.
10. The electronic component of claim 8 , wherein the polymer layer has a thermal conductivity of at least 0.2 W/mK.
11. The electronic component of claim 2 , wherein the polymer layer is formed of at least one polymer selected from the group consisting of polyester, polyimide, polysulfone, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyvinylchloride, polylactic acid, polyurethane, polyacrylic, polyvinyl alcohol, polyethylene vinylacetate, polyethylene, polypropylene, polycyclopentadiene, polytetrafluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, poly(ethylene-co-tetrafluoroethylene), poly(hexafluoropropylene-co-tetrafluoroethylene), polychlorotrifluoroethylene, polystyrene, polyether sulfone, polyether ether ketone, and combinations thereof.
12. The electronic component of claim 2 , wherein the polymer layer has a thermal conductivity of at least 0.2 W/mK.
13. The electronic component of claim 2 , wherein the phase change material has a melting point of 20° C. to 100° C.
14. The electronic component of claim 1 , wherein the polymer layer comprises a polyimide.
15. The electronic component of claim 2 , wherein the polymer layer comprises a polyimide.
16. The electronic component of claim 8 , wherein the polymer layer comprises a polyimide.
17. The electronic component of claim 1 , wherein the phase change material includes at least one wax.
18. The electronic component of claim 2 , wherein the phase change material includes at least one wax.
19. The electronic component of claim 8 , wherein the phase change material includes at least one wax.