IP Library Granted Patent US 10,764,998
Granted Patent B2
US 10,764,998 · App. 16/134,257 · Granted Sep 1, 2020

Electronic circuit board

Inventors: Masayuki Naohara (Shizuoka, JP); Tomohiro Sugiura (Shizuoka, JP); Yoshihiro Kawamura (Shizuoka, JP)
Assignee: YAZAKI CORPORATION
H05K1/0278H01H45/04H05K1/181H05K5/0056H05K5/064H05K3/06H05K5/0013H05K5/0047H05K2201/058H05K2201/10053H05K2201/10189H05K2201/10522
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Quick Facts
Patent No.
US 10,764,998
App. No.
16/134,257
Granted
Sep 1, 2020
Kind
B2
Abstract

An electronic circuit board includes electronic components to be mounted; a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern thereof. A plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions.

Claims (17)

1. An electronic circuit board comprising:

a plurality of electronic components to be mounted;

a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic components to the circuit pattern; and

at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and the at least one soft flexible board portion is integrated with the rigid board portions which are electrically connected to the circuit pattern of the flexible board portion,

wherein when a plurality of contact relays in which occurs resonance therebetween or resonance may occur therebetween as the electronic components is mounted, the plurality of the contact relays is dispersedly arranged on the respective rigid board portions, and

wherein when a number of the contact relays to be mounted is larger than a number of the rigid board portions, the contact relays are mounted, one by one, on the respective rigid board portions, and at least one of the contact relays is mounted on each of the rigid board portions as many as a number of the remaining contact relays selected from among the respective rigid board portions.

2. The electronic circuit board according to claim 1 ,

wherein a first contact relay of the contact relays and a first electronic component of the electronic components are arranged on a same side of a first rigid board portion of the rigid board portions, and

wherein a second contact relay of the contact relays and a second electronic component of the electronic components are arranged on opposite sides of a second rigid board portion of the rigid board portion.

3. An electronic circuit board comprising:

a plurality of electronic components to be mounted;

a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic components to the circuit pattern; and

at least one soft flexible board portion which has an insulating insulator and a conductive circuit pattern,

wherein the conductive circuit pattern is mounted onto the at least one soft flexible board portion and is electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions,

wherein the at least one soft flexible board portion is integrated with the rigid board portions which are electrically connected to the circuit pattern of the flexible board portion,

wherein a plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions, and

wherein when a number of the contact relays to be mounted is larger than a number of the rigid board portions, the contact relays are mounted, one by one, on the respective rigid board portions, and at least one of the contact relays is mounted on each of the rigid board portions as many as a number of the remaining contact relays selected from among the respective rigid board portions.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2018
From: NAOHARA, MASAYUKI; SUGIURA, TOMOHIRO; KAWAMURA, YOSHIHIRO
To: YAZAKI CORPORATION
Reel/Frame 046900/0812 →