IP Library Granted Patent US 10,488,901
Granted Patent B1
US 10,488,901 · App. 16/136,824 · Granted Nov 26, 2019

Dynamic thermal responses for computing components

Inventors: Kevin B. Locke (Georgetown, TX); Jian Xin Guo (Austin, TX); Yuan David Ma (Pflugerville, TX)
Assignee: Dell Products L.P.
G06F1/206H05K7/20136H05K7/20209
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,488,901
App. No.
16/136,824
Granted
Nov 26, 2019
Kind
B1
Abstract

Methods, systems, and computer programs encoded on computer storage medium, for detecting a throttling of a component; identifying a temperature of the component; calculating a thermal response for the component, including: setting the identified temperature as a maximum temperature, setting a first temperature lower than the maximum temperature, wherein for temperatures of the component less than the first temperature, the cooling fan system has a first fan speed, setting a second temperature between the first and the maximum temperature, wherein for temperatures of the component between the first and the second temperatures, a fan speed of the cooling fan system is linearly increased until an acoustic fan speed, setting a third temperature between the second and the maximum temperature, wherein for temperatures of the component between the second and third temperatures, maintaining the fan speed at the acoustic fan speed; applying the thermal response to the component.

Claims (86)

1. A computer-implemented method, comprising:

identifying a computing device including at least one computing component and a cooling fan system;

detecting, by a thermal response module, a throttling of the computing component;

in response to detecting the throttling of the computing component:

identifying, by the thermal response module, a temperature of the computing component at a time of the throttling;

calculating, by the thermal response module, a thermal response for the computing component, including:

setting the identified temperature as a maximum temperature,

setting a first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the first temperature, the cooling fan system has a first fan speed,

setting a second temperature between the first temperature and the maximum temperature, wherein for temperatures of the computing component between the first and the second temperatures, a fan speed of the cooling fan system is linearly increased until an acoustic fan speed,

setting a third temperature between the second temperature and the maximum temperature, wherein for temperatures of the computing component between the second and third temperatures, maintaining the fan speed at the acoustic fan speed, and wherein for temperatures of the computing component greater than the third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the thermal response to the computing component.

2. The computer-implemented method of claim 1 , further comprising:

after applying the thermal response to the computing component:

detecting, by the thermal response module, a further throttling of the computing component;

in response to detecting the further throttling of the computing component:

identifying, by the thermal response module, a further temperature of the computing component at a time of the further throttling;

calculating, by the thermal response module, a further thermal response for the computing component, including:

setting the identified further temperature as a further maximum temperature,

setting a further first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the further first temperature, the cooling fan system has the first fan speed, wherein the further first temperature is lower than the first temperature,

setting a further second temperature between the further first temperature and the further maximum temperature, wherein for temperatures of the computing component between the further first and the further second temperatures, the fan speed of the cooling fan system is linearly increased until the acoustic fan speed, wherein the further second temperature is lower than the second temperature,

setting a further third temperature between the further second temperature and the further maximum temperature, wherein for temperatures of the computing component between the further second and further third temperatures, maintaining the fan speed at the acoustic fan speed, wherein the further third temperature is lower than the third temperature, and wherein for temperatures of the computing component greater than the further third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the further thermal response to the computing component.

3. The computer-implemented method of claim 1 , after applying the thermal response to the computing component, ceasing to detect, by the thermal response module, a further throttling of the computing component within a time period.

4. The computer-implemented method of claim 1 , wherein the first fan speed is an idle fan speed.

5. The computer-implemented method of claim 1 , wherein the acoustic fan speed is based on acoustics of the computing device.

6. The computer-implemented method of claim 1 , wherein identifying the temperature of the computing component includes:

providing, by the thermal response module to the computing component, a query of the temperature of the computing component; and

in response to the query, receiving, by the thermal response module and from the computing component, the temperature of the computing component.

7. The computer-implemented method of claim 1 , wherein identifying the temperature of the computing component includes receiving, from one or more sensors provided for the computing component, the temperature of the computing component.

8. A system comprising a processor having access to memory media storing instructions executable by the processor to:

identifying a computing device including at least one computing component and a cooling fan system;

detecting, by a thermal response module, a throttling of the computing component;

in response to detecting the throttling of the computing component:

identifying, by the thermal response module, a temperature of the computing component at a time of the throttling;

calculating, by the thermal response module, a thermal response for the computing component, including:

setting the identified temperature as a maximum temperature,

setting a first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the first temperature, the cooling fan system has a first fan speed,

setting a second temperature between the first temperature and the maximum temperature, wherein for temperatures of the computing component between the first and the second temperatures, a fan speed of the cooling fan system is linearly increased until an acoustic fan speed,

setting a third temperature between the second temperature and the maximum temperature, wherein for temperatures of the computing component between the second and third temperatures, maintaining the fan speed at the acoustic fan speed, and wherein for temperatures of the computing component greater than the third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the thermal response to the computing component.

9. The system of claim 8 , the instructions further comprising:

after applying the thermal response to the computing component:

detecting, by the thermal response module, a further throttling of the computing component;

in response to detecting the further throttling of the computing component:

identifying, by the thermal response module, a further temperature of the computing component at a time of the further throttling;

calculating, by the thermal response module, a further thermal response for the computing component, including:

setting the identified further temperature as a further maximum temperature,

setting a further first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the further first temperature, the cooling fan system has the first fan speed, wherein the further first temperature is lower than the first temperature,

setting a further second temperature between the further first temperature and the further maximum temperature, wherein for temperatures of the computing component between the further first and the further second temperatures, the fan speed of the cooling fan system is linearly increased until the acoustic fan speed, wherein the further second temperature is lower than the second temperature,

setting a further third temperature between the further second temperature and the further maximum temperature, wherein for temperatures of the computing component between the further second and further third temperatures, maintaining the fan speed at the acoustic fan speed, wherein the further third temperature is lower than the third temperature, and wherein for temperatures of the computing component greater than the further third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the further thermal response to the computing component.

10. The system of claim 8 , after applying the thermal response to the computing component, the operations further comprising ceasing to detect, by the thermal response module, a further throttling of the computing component within a time period.

11. The system of claim 8 , wherein the first fan speed is an idle fan speed.

12. The system of claim 8 , wherein the acoustic fan speed is based on acoustics of the computing device.

13. The system of claim 8 , wherein identifying the temperature of the computing component includes:

providing, by the thermal response module to the computing component, a query of the temperature of the computing component; and

in response to the query, receiving, by the thermal response module and from the computing component, the temperature of the computing component.

14. The system of claim 8 , wherein identifying the temperature of the computing component includes receiving, from one or more sensors provided for the computing component, the temperature of the computing component.

15. A non-transitory computer-readable medium storing software comprising instructions executable by one or more computers which, upon such execution, cause the one or more computers to perform operations comprising:

identifying a computing device including at least one computing component and a cooling fan system;

detecting, by a thermal response module, a throttling of the computing component;

in response to detecting the throttling of the computing component:

identifying, by the thermal response module, a temperature of the computing component at a time of the throttling;

calculating, by the thermal response module, a thermal response for the computing component, including:

setting the identified temperature as a maximum temperature,

setting a first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the first temperature, the cooling fan system has a first fan speed,

setting a second temperature between the first temperature and the maximum temperature, wherein for temperatures of the computing component between the first and the second temperatures, a fan speed of the cooling fan system is linearly increased until an acoustic fan speed,

setting a third temperature between the second temperature and the maximum temperature, wherein for temperatures of the computing component between the second and third temperatures, maintaining the fan speed at the acoustic fan speed, and wherein for temperatures of the computing component greater than the third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the thermal response to the computing component.

16. The computer-readable medium of claim 15 , the instructions further comprising:

after applying the thermal response to the computing component:

detecting, by the thermal response module, a further throttling of the computing component;

in response to detecting the further throttling of the computing component:

identifying, by the thermal response module, a further temperature of the computing component at a time of the further throttling;

calculating, by the thermal response module, a further thermal response for the computing component, including:

setting the identified further temperature as a further maximum temperature,

setting a further first temperature lower than the maximum temperature, wherein for temperatures of the computing component less than the further first temperature, the cooling fan system has the first fan speed, wherein the further first temperature is lower than the first temperature,

setting a further second temperature between the further first temperature and the further maximum temperature, wherein for temperatures of the computing component between the further first and the further second temperatures, the fan speed of the cooling fan system is linearly increased until the acoustic fan speed, wherein the further second temperature is lower than the second temperature,

setting a further third temperature between the further second temperature and the further maximum temperature, wherein for temperatures of the computing component between the further second and further third temperatures, maintaining the fan speed at the acoustic fan speed, wherein the further third temperature is lower than the third temperature, and wherein for temperatures of the computing component greater than the further third temperature, increasing the fan speed of the cooling system greater than the acoustic fan speed;

applying, by the thermal response module, the further thermal response to the computing component.

17. The computer-readable medium of claim 15 , after applying the thermal response to the computing component, the operations further comprising ceasing to detect, by the thermal response module, a further throttling of the computing component within a time period.

18. The computer-readable medium of claim 15 , wherein the first fan speed is an idle fan speed.

19. The computer-readable medium of claim 15 , wherein the acoustic fan speed is based on acoustics of the computing device.

20. The computer-readable medium of claim 15 , wherein identifying the temperature of the computing component includes:

providing, by the thermal response module to the computing component, a query of the temperature of the computing component; and

in response to the query, receiving, by the thermal response module and from the computing component, the temperature of the computing component.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052216/0758) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0680 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 24, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052216/0758 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2018
From: LOCKE, KEVIN B.; GUO, JIAN XIN; MA, YUAN DAVID
To: DELL PRODUCTS L.P.
Reel/Frame 046928/0486 →
Cited By (3)
US 12,442,854 US 12,524,059 US 12,560,992