IP Library Granted Patent US 10,535,399
Granted Patent B2
US 10,535,399 · App. 16/137,971 · Granted Jan 14, 2020

Memory arrays

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Quick Facts
Patent No.
US 10,535,399
App. No.
16/137,971
Granted
Jan 14, 2020
Kind
B2
Abstract

Some embodiments include a memory array having a series of bitlines. Each of the bitlines has a first comparative bitline component and a second comparative bitline component. The bitlines define columns of the memory array. Memory cells are along the columns of the memory array. Capacitive units are along the columns of the memory array and are interspersed amongst the memory cells. The capacitive units are not utilized for data storage during operation of the memory array, but rather are utilized for reducing parasitic capacitance between adjacent bitlines.

Claims (28)

1. An apparatus comprising:

a semiconductor substrate;

a first comparative bitline extending horizontally over the semiconductor substrate;

a second comparative bitline extending horizontally over the semiconductor substrate and being aligned vertically with the first comparative bitline;

a plurality of memory cells each comprising a first transistor and a first capacitor that are arranged vertically between the first and second comparative bitlines;

a capacitive unit comprising a second transistor and a second capacitor that are arranged vertically between the first and second comparative bitlines; and

wherein the second transistor of the capacitive unit is configured to be turned on when the first transistor of a selected one of the plurality of memory cells is turned on.

2. The apparatus of claim 1 wherein the first and second comparative bitlines are along a column of a memory array; wherein the capacitive unit is one of many substantially identical capacitive units within the memory array; wherein the column is one of many columns of the memory array; and wherein every column has one of the capacitive units.

3. The apparatus of claim 2 wherein every column has two or more of the capacitive units.

4. The apparatus of claim 2 wherein a row of the memory array extends orthogonally to the columns; and wherein the capacitive units are all along the row.

5. The apparatus of claim 1 wherein the capacitive unit comprises a third transistor on an opposing side of the capacitor from the first transistor, and vertically between the first and second comparative bitlines.

6. A memory array comprising:

a series of bitlines, each of the bitlines having a first comparative bitline component and a second comparative bitline component; the bitlines defining columns of the memory array;

memory cells along the columns of the memory array; individual memory cells comprising a transistor and a capacitor; and

capacitive units along the columns of the memory array; individual capacitive units being configured identically to the individual memory cells but not being utilized for data storage during operation of the memory array, an individual capacitive unit along an individual column being maintained in an “on” state when said individual column is utilized in a READ operation.

7. The memory array of claim 6 wherein said individual capacitive unit is not maintained in the “on” state when said individual column is utilized in a WRITE operation.

8. The memory array of claim 6 wherein said individual capacitive unit is maintained in the “on” state when said individual column is utilized in a WRITE operation.

9. The memory array of claim 6 wherein said individual capacitive unit is along a row of capacitive units.

10. The memory array of claim 9 wherein said individual capacitive unit is also maintained in the “on” state when any column crossing said row is utilized in a READ operation.

11. The memory array of claim 6 wherein the transistor and capacitor of the individual memory cells and the individual capacitive units are all in a common vertical plane as one another.

12. The memory array of claim 6 wherein the columns of the memory array have two or more of the capacitive units.

13. A memory array comprising:

a series of bitlines supported by a base, each of the bitlines having a first comparative bitline component and a second comparative bitline component; the bitlines defining columns of the memory array; the first and second comparative bitline components extending to a sense amplifier supported by the base and being under the first and second comparative bitline components;

memory cells along the columns of the memory array; individual memory cells comprising first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors; the capacitor having a first node electrically coupled with a source/drain region of the first transistor, having a second node electrically coupled with a source/drain region of the second transistor, and having capacitor dielectric material between the first and second nodes; the first and second transistors being coupled to a common wordline; and

capacitive units along the columns of the memory array; the capacitive units being configured identically to the memory cells but not being utilized for data storage during operation of the memory array, the capacitive units being maintained in an “on” state whenever power is provided to the memory array.

14. The memory array of claim 13 wherein the capacitive units are arranged along a row which extends orthogonally to the columns.

15. The memory array of claim 13 wherein the first transistor, second transistor and capacitor of the individual memory cells are all in a common vertical plane as one another.

16. The memory array of claim 13 wherein each of the columns of the memory array has two or more of the capacitive units.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →