IP Library Granted Patent US 11,108,127
Granted Patent B2
US 11,108,127 · App. 16/141,797 · Granted Aug 31, 2021

Rectangular waveguide communication between memory and processor

Inventor: Yoshihito Koya (Kamakura, JP)
Assignee: Micron Technology, Inc.
H01P3/12G06F13/1668G06F13/4068H01P1/24H05K1/0243H05K1/181H01P5/085H05K2201/10159H05K2201/10257H05K2201/10515H05K2201/10522
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Quick Facts
Patent No.
US 11,108,127
App. No.
16/141,797
Granted
Aug 31, 2021
Kind
B2
Abstract

Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

Claims (33)

1. An apparatus comprising:

a memory;

a processor;

a rectangular waveguide coupled to the memory and the processor and configured for the memory and the processor to communicate with each other via the rectangular waveguide;

a first circuit connected between the memory and the rectangular waveguide, wherein the first circuit is configured to convert the read data in parallel to serial to supply the read data output from the memory in parallel to the rectangular waveguide in serial; and

a second circuit connected between the processor and the rectangular waveguide.

2. The apparatus of claim 1 , wherein the rectangular waveguide is configured to transmit data between the memory and processor.

3. The apparatus of claim 1 , wherein

the memory outputs read data;

the processor receives the read data; and

the rectangular waveguide transmits the read data from the memory to the processor.

4. The apparatus of claim 1 , wherein the first circuit is integrated in a different semiconductor chip from the memory.

5. An apparatus comprising:

a memory;

a processor:

a rectangular waveguide coupled to the memory and the processor and configured for the memory and the processor to communicate with each other via the rectangular waveguide;

a first circuit connected between the memory and the rectangular waveguide; and

a second circuit connected between the processor and the rectangular waveguide, wherein the second circuit is configured to convert the read data in serial to parallel to supply the read data output from the rectangular waveguide in serial to the processor in parallel.

6. The apparatus of claim 5 , wherein the second circuit is integrated in a different semiconductor chip from the processor.

7. The apparatus of claim 5 ,

wherein the processor outputs write data,

wherein the memory receives the write data, and

wherein the rectangular waveguide transmits the write data from the processor to the memory.

8. The apparatus of claim 7 ,

wherein the second circuit is further configured to convert the write data in parallel to serial to supply the write data output from the processor in parallel to the rectangular waveguide in serial, and

wherein the first circuit is further configured to convert the write data in serial to parallel to supply the write data output from the rectangular waveguide in serial to the memory in parallel.

9. The apparatus of claim 1 , wherein the processor is configured to supply a control signal to the memory via a signal line different from the rectangular waveguide.

10. The apparatus of claim 3 ,

wherein the memory includes first and second memories,

wherein the processor includes first and second processors, and

wherein the first and second processors are configured to communicate the first and second memories, respectively, via the rectangular waveguide.

11. The apparatus of claim 10 , further comprising an arbitrator configured to control an output timing of the read data from the first and second memories to not output the read data from the first and second memories simultaneously.

12. The apparatus of claim 10 , further comprising a modulator configured to modulate the read data from the first and second memories to not interfere with each other.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2018
From: KOYA, YOSHIHITO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046968/0343 →