Electrical connector and electrical connector assembly having a mating array of signal and ground contacts
Electrical connector includes a housing and a mating array having a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing. The signal contacts and the ground contacts are positioned for mating with signal conductors and ground conductors, respectively, of a mating connector. The ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition. The ground-material composition is configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation. The signal-material composition is configured to cause a second LLCR while mated with the signal conductors during operation. The second LLCR is less than the first LLCR during operation.
1. An electrical connector comprising:
a housing; and
a mating array comprising a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing, the signal contacts and the ground contacts being positioned for mating with signal conductors and ground conductors, respectively, of a mating connector;
wherein the ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition, the ground-material composition configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation, the signal-material composition configured to cause a second LLCR while mated with the signal conductors during operation, the second LLCR being less than the first LLCR during operation.
2. The electrical connector of claim 1 , wherein the signal-material composition and the ground-material composition differ by at least one of a material or a layer thickness.
3. The electrical connector of claim 1 , wherein:
the signal-material composition is configured to cause the second LLCR while mated with the signal conductors during operation if the second LLCR is at most 20 milliohms after applying an accelerated-aging protocol; and
the ground-material composition is configured to cause the first LLCR while mated with the ground conductors during operation if the first LLCR is at most 25 ohms after applying the accelerated-aging protocol.
4. The electrical connector of claim 3 , wherein the first LLCR is at least 10× greater than the second LLCR after applying the accelerated-aging protocol.
5. The electrical connector of claim 1 , wherein:
the ground-material composition is configured to cause the first LLCR while mated with the ground conductors during operation if the first LLCR increases by at least three times after an accelerated-aging protocol is applied; and
the signal-material composition is configured to cause the second LLCR while mated with the signal conductors during operation if the second LLCR increases by at most three times after the accelerated-aging protocol is applied.
6. The electrical connector of claim 5 , wherein the first LLCR is at most 10 ohms and the second LLCR is at most 20 milliohms, the first LLCR being at least 10× greater than the second LLCR after applying the accelerated-aging protocol.
7. The electrical connector of claim 1 , wherein the ground-material composition includes a plated layer that has a first thickness and the signal-material composition includes a plated layer that has a second thickness, the first thickness being less than the second thickness.
8. The electrical connector of claim 7 , wherein the first thickness is less than 0.30 micrometers and the second thickness is greater than 0.30 micrometers.
9. The electrical connector of claim 1 , wherein the signal-material composition includes outer and inner signal layers comprising first and second materials, respectively, and wherein the ground-material composition includes outer and inner ground layers comprising the first and second materials, respectively, wherein the outer layers of the signal-material composition and the ground-material composition have different thicknesses.
10. The electrical connector of claim 9 , wherein the ground-material composition comprises at least one of a nickel sulfamate (Ni(SO3NH2)2), tin-nickel (Sn/Ni), nickel-phosphorus (NiP), nickel-tungsten (NiW), structured nickel, cobalt-phosphorus (CoP), dilute palladium-nickel (PdNi), chromium (Cr), zinc (Zn), zinc-nickel (ZnNi), zinc with steel, carbon, a carbon ink, or a carbon epoxy.
11. The electrical connector of claim 1 , wherein the signal-material composition includes outer and inner signal layers and wherein the ground-material composition includes outer and inner ground layers, wherein the outer layers of the signal-material composition and the ground-material composition have different materials.
12. The electrical connector of claim 11 , wherein the outer layer of the signal-material composition includes palladium-nickel (PdNi) and the outer layer of the ground-material composition includes gold (Au).
13. The electrical connector of claim 1 , wherein the mating array is at least one of configured to transmit data at a rate of at least 10 gigabits/second (Gbps) or has at least 12 signal contacts per 100 mm2 along a mating side of the electrical connector.
14. An electrical connector assembly comprising:
a mating connector having signal conductors and ground conductors; and
an electrical connector comprising:
a housing; and
a mating array comprising a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing, the signal contacts and the ground contacts being positioned for mating with the signal conductors and the ground conductors, respectively, of the mating connector;
wherein the ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition, the ground-material composition and the ground conductors mating with each other at respective ground interfaces and the signal-material composition and the signal conductors mating with each other at respective signal interfaces, wherein the ground interfaces have a first low-level contact resistance (LLCR) and the signal interfaces have a second LLCR, the second LLCR being less than the first LLCR.
15. The electrical connector assembly of claim 14 , wherein the signal-material composition and the ground-material composition differ by at least one of a material or a layer thickness and wherein the first LLCR is at least 10× greater than the second LLCR after applying an accelerated-aging protocol.
16. The electrical connector assembly of claim 14 , wherein:
the ground interfaces have the first LLCR if the first LLCR is between 100 milliohms and 25 ohms after applying an accelerated-aging protocol; and
the signal interfaces have the second LLCR if the second LLCR is at most 10 milliohms after applying the accelerated-aging protocol.
17. The electrical connector assembly of claim 14 , wherein the ground-material composition includes an outer layer that has a first thickness and the signal-material composition includes an outer layer that has a second thickness, the first thickness being less than the second thickness.
18. The electrical connector assembly of claim 14 , wherein the signal-material composition includes outer and inner signal layers comprising first and second materials, respectively, and wherein the ground-material composition includes outer and inner ground layers comprising the first and second materials, respectively, wherein the outer layers of the signal-material composition and the ground-material composition have different thicknesses.
19. An electrical connector comprising:
a housing; and
a mating array comprising a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing, the signal contacts and the ground contacts being positioned for mating with signal conductors and ground conductors, respectively, of a mating connector;
wherein the ground contacts have a plated layer that includes a precious metal and the signal contacts have a plated layer that includes the precious metal, the plated layers of the ground contacts and the plated layers of the signal contacts having different thicknesses, wherein the thickness of the plated layers of the signal contacts is greater than the thickness of the plated layers of the ground contacts.
20. The electrical connector of claim 19 , wherein the ground contacts are configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation, the signal contacts configured to cause a second LLCR while mated with the signal conductors during operation, the second LLCR being less than the first LLCR during operation.
21. The electrical connector of claim 20 , wherein the first LLCR is at least 10× greater than the second LLCR after applying an accelerated-aging protocol.