Multi-part device enclosure
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
1. An electronic device comprising:
an enclosure formed of a plurality of layers cooperating to define an interior volume, comprising:
a first layer formed of a first material and defining:
a user input surface of the enclosure; and
a first portion of a side surface of the enclosure;
a second layer positioned below the first layer, the second layer comprising a circuit board formed of a second material different from the first material and defining a second portion of the side surface of the enclosure; and
a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining:
a bottom surface of the enclosure; and
a third portion of the side surface of the enclosure.
2. The electronic device of claim 1 , further comprising a fourth layer between the first layer and the second layer and defining a fourth portion of the side surface of the enclosure.
3. The electronic device of claim 2 , wherein:
the electronic device further comprises an electronic assembly within the interior volume and having a non-planar side profile; and
the second layer and the fourth layer cooperate to define a non-planar interior wall of the interior volume that conforms to the non-planar side profile of the electronic assembly.
4. The electronic device of claim 3 , wherein the fourth layer is formed of a fourth material different from the first, second, and third materials.
5. The electronic device of claim 3 , wherein:
the electronic device further comprises:
a fifth layer defining a fifth portion of the side surface of the enclosure; and
a sixth layer defining a sixth portion of the side surface of the enclosure; and
the fifth and sixth layers of the enclosure cooperate with the second and fourth layers to define the non-planar interior wall of the interior volume that conforms to the non-planar side profile of the electronic assembly.
6. The electronic device of claim 1 , wherein the first layer comprises a transparent region.
7. The electronic device of claim 1 , wherein the side surface defines a curved surface along at least the second portion of the side surface and the third portion of the side surface.
8. An electronic device comprising:
a top layer defining:
a top surface of the electronic device; and
a first portion of a side surface of the electronic device;
a circuit board positioned below the top layer and comprising:
a substrate; and
a conductive trace on the substrate, the substrate defining a second portion of the side surface of the electronic device; and
a bottom layer positioned below the circuit board and defining:
a bottom surface of the electronic device; and
a third portion of the side surface of the electronic device.
9. The electronic device of claim 8 , wherein:
the top layer comprises an opening in the top surface; and
the electronic device comprises a button mechanism positioned in the opening.
10. The electronic device of claim 9 , wherein the button mechanism comprises a dome switch coupled to the circuit board.
11. The electronic device of claim 9 , further comprising a reinforcing layer attached to the top layer and defining an additional portion of the side surface of the electronic device between the top layer and the circuit board.
12. The electronic device of claim 11 , wherein the reinforcing layer comprises carbon fiber.
13. The electronic device of claim 8 , wherein the top layer is formed of a material selected from the group consisting of: aluminum; stainless steel; plastic; sapphire; glass; and carbon fiber.
14. The electronic device of claim 8 , wherein the first, second, and third portions of the side surface extend around an entire periphery of the electronic device.
15. An electronic device comprising:
a top case defining:
a top surface of the electronic device; and
a first portion of a side surface of the electronic device;
a first intermediate layer, having a first thickness, positioned below the top case and defining a second portion of the side surface of the electronic device;
a second intermediate layer, having a second thickness different than the first thickness, positioned below the first intermediate layer and defining a third portion of the side surface of the electronic device; and
a bottom case defining:
a bottom surface of the electronic device; and
a fourth portion of the side surface of the electronic device.
16. The electronic device of claim 15 , further comprising a third intermediate layer having a third thickness different than the first thickness and the second thickness, positioned below the second intermediate layer and defining a fifth portion of the side surface of the electronic device.
17. The electronic device of claim 15 , wherein the top surface of the electronic device defines an input surface of the electronic device.
18. The electronic device of claim 15 , wherein:
the top case comprises glass;
the first intermediate layer comprises a glass-reinforced polymer; and
the bottom case comprises metal.
19. The electronic device of claim 15 , wherein the first and second intermediate layers are formed of different materials.
20. The electronic device of claim 15 , wherein the second intermediate layer comprises:
a substrate; and
a conductive trace integrated with the substrate.