Antenna module configurations
An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
1. An antenna module, comprising:
a ground plane in a multilayer substrate;
a mold on the multilayer substrate;
a conductive wall separating a first portion of the mold from a second portion of the mold and electrically coupled to the ground plane; and
a power management integrated circuit (PMIC), in which the mold is arranged to cover the PMIC.
2. The antenna module of claim 1 , further comprising a conformal shield on a surface of the second portion of the mold and electrically coupled to the ground plane.
3. The antenna module of claim 2 , in which the conformal shield comprises a conductive material on the surface of the second portion of the mold, a sidewall of the second portion of the mold and a sidewall of the multilayer substrate.
4. The antenna module of claim 3 , in which the conductive material comprises sputtered copper.
5. The antenna module of claim 1 , in which the conductive wall comprises eaves overlapping an antenna or an integrated circuit.
6. The antenna module of claim 5 , in which the integrated circuit comprises a radio frequency (RF) integrated circuit (RFIC) or power management IC (PMIC).
7. The antenna module of claim 1 , in which the conductive wall comprises a conductive solid sheet, a conductive paste, or a plurality of connected vias.
8. The antenna module of claim 1 , further comprising a radio frequency integrated circuit (RFIC), in which the mold is arranged to cover the RFIC.
9. The antenna module of claim 1 , further comprising a plurality of antennas.
10. The antenna module of claim 9 , tilted with respect to a circuit board of a wireless device so that one or more of the plurality of antennas are angled with respect to the circuit board.
11. The antenna module of claim 10 , further comprising a plurality of tilted antenna modules disposed at different edges of a user equipment (UE).
12. The antenna module of claim 9 , in which the plurality of antennas comprise patch antennas or dipole antennas.
13. The antenna module of claim 9 , in which the plurality of antennas comprise an array of dipole antennas, and in which the conductive wall is disposed between the second portion of the mold and a portion of the multilayer substrate including the array of dipole antennas.
14. An antenna module, comprising:
a ground plane in a multilayer substrate;
a mold on the multilayer substrate; and
a conductive wall separating a first portion of the mold from a second portion of the mold and electrically coupled to the ground plane,
wherein the antenna module is coupled to a circuit board of a mobile device via a flexible connector.
15. The antenna module of claim 14 , in which the flexible connector consists of power supply pins and intermediate frequency (IF) control pins.
16. The antenna module of claim 15 , in which IF control pins are configured to carry control signals modulated with IF signals.
17. The antenna module of claim 15 , in which IF control pins are configured to carry an IF signal modulated with a local oscillator (LO) signal.
18. The antenna module of claim 1 , further comprising an interposer coupling the multilayer substrate to a circuit board.
19. The antenna module of claim 1 , further comprising a ball grid array coupling the multilayer substrate to a circuit board, the ball grid array surrounding a radio frequency integrated circuit (RFIC) and/or a power management IC (PMIC) of the antenna module.
20. A method of integrating a mold in an antenna module, comprising:
depositing a mold compound on a multilayer substrate including a ground plane and a multilayer antenna, wherein the mold compound is arranged to cover a power management integrated circuit (PMIC);
forming a conductive wall separating a first portion of the mold compound from a second portion of the mold compound and electrically coupled to the ground plane; and
depositing a conformal shield material on a surface of the second portion of the mold compound.
21. The method of claim 20 , further comprising etching a trench between the conductive wall and the second portion of the mold compound.
22. The method of claim 20 , further comprising securing the antenna module to a point along a periphery of a housing of a wireless device.
23. The method of claim 20 , in which forming the conductive wall comprises depositing a conductive material on a sidewall of the second portion of the mold compound including the conformal shield material.
24. The method of claim 20 , in which depositing the conformal shield material comprises sputtering a conductive material on the surface of the second portion of the mold compound, a sidewall of the mold compound, and a sidewall of the multilayer substrate.
25. The method of claim 20 , in which depositing the mold compound comprises depositing the mold compound over a radio frequency integrated circuit (RFIC) coupled to the multilayer substrate.
26. An antenna module, comprising:
a ground plane in a multilayer substrate;
a multilayer antenna in the multilayer substrate;
a mold on the multilayer substrate; and
means for suppressing a lossy mold effect of the mold on the multilayer antenna.
27. The antenna module of claim 26 , further comprising a conformal shield on a surface of the mold and electrically coupled to the ground plane.
28. The antenna module of claim 26 , in which the multilayer antenna comprises a plurality of antennas, in which the antenna module is tilted with respect to a circuit board of a wireless device so that the plurality of antennas are angled to receive and radiate from directions different from the plurality of antennas disposed on the circuit board.
29. The antenna module of claim 26 , in which the plurality of antennas comprise patch antennas and/or dipole antennas.
30. An antenna module, comprising:
a ground plane in a multilayer substrate;
a mold on the multilayer substrate; and
a conductive wall separating a first portion of the mold from a second portion of the mold and electrically coupled to the ground plane,
in which the conductive wall comprises eaves overlapping an antenna or an integrated circuit.
31. An antenna module, comprising:
a ground plane in a multilayer substrate;
a mold on the multilayer substrate;
a conductive wall separating a first portion of the mold from a second portion of the mold and electrically coupled to the ground plane; and
a plurality of antennas,
wherein the antenna module is tilted with respect to a circuit board of a wireless device so that one or more of the plurality of antennas are angled with respect to the circuit board.