Antenna-in-package with better antenna performance

1. An Antenna-in-Package (AiP), comprising:

an interface layer comprising at least an antenna layer and an insulating layer disposed under the antenna layer, wherein the antenna layer comprising a first antenna region and a second antenna region spaced apart from the first antenna region;

an integrated circuit die disposed on the interface layer, wherein the integrated circuit die is interposed between the first antenna region and the second antenna region, wherein the first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge, wherein the first antenna region comprises a first antenna element, a second antenna element extending along a first direction, a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die, wherein the feeding network, the first antenna element, and the second antenna element are coplanar; and

a plurality of solder balls disposed on a bottom surface of the interface layer.

2. The AiP according to claim 1 , wherein the first antenna region is used for transmitting signals and the second antenna region is used for receiving signals.

3. The AiP according to claim 1 , wherein the interface layer comprises a substrate, an interconnection structure, a redistribution layer (RDL) structure, or an interposer substrate.

4. The AiP according to claim 1 , wherein the AiP further comprises a ground reflector layer, wherein the antenna layer and the ground reflector layer are formed in two different metal layers, respectively, which are in different horizontal planes.

5. The AiP according to claim 1 , wherein the integrated circuit die comprises an integrated circuit silicon die or a semiconductor chip that comprises relative functional circuits for transmitting and receiving millimeter-wave (mmW) or radio-frequency (RF) signals.

6. The AiP according to claim 1 , wherein the first antenna element is disposed relatively farther away from the integrated circuit die and the second antenna element is disposed relatively closer to the integrated circuit die.

7. The AiP according to claim 1 , wherein the first antenna element and the second antenna element are two folded dipole antenna elements arranged in parallel with each other.

8. The AiP according to claim 1 , wherein the feeding network comprises two parallel feed lines.

9. The AiP according to claim 1 , wherein the feeding network is divided into two integral portions: a longitudinal portion extending along the second direction and a lateral portion extending along the first direction.

10. The AiP according to claim 9 , wherein two distal ends of the longitudinal portion are electrically coupled to the first antenna element and the second antenna element, respectively.

11. The AiP according to claim 9 , wherein the lateral portion is integrally connected to the longitudinal portion and is electrically coupled to the integrated circuit die.

12. The AiP according to claim 9 , wherein a distance L 1 between the first antenna element and the lateral portion of the feeding network is greater than a distance L 2 between the second antenna element and the lateral portion of the feeding network.

13. The AiP according to claim 12 , wherein a difference between L 1 and L 2 is approximately equal to a half wavelength λ g , wherein λ g is the guided wavelength of electromagnetic radiation transmitted via the antenna layer.

14. The AiP according to claim 1 , wherein the second antenna region has a layout that is mirror symmetric to a layout of the first antenna region.

15. The AiP according to claim 1 further comprising:

a first annular guard ring provided around the first antenna region; and

a second annular guard ring provided around the second antenna region, wherein the first annular guard ring continuously surrounds the first antenna region and the second annular guard ring continuously surrounds the second antenna region.

16. The AiP according to claim 15 , wherein first annular guard ring and the second annular guard ring are coplanar with the first and second antenna elements.

17. The AiP according to claim 1 further comprising:

a mesh type layout of ground ball pads around the first antennal region and the second antenna region.

18. An Antenna-in-Package (AiP), comprising:

an interface layer comprising at least an antenna layer and an insulating layer disposed under the antenna layer, wherein the antenna layer comprising a first antenna region and a second antenna region spaced apart from the first antenna region;

an integrated circuit die disposed on the interface layer, wherein the integrated circuit die is interposed between the first antenna region and the second antenna region, wherein the first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge, wherein the first antenna region comprises a first antenna element, a second antenna element extending along a first direction, a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die, wherein the feeding network, the first antenna element, and the second antenna element are coplanar;

a plurality of solder balls disposed on a bottom surface of the interface layer; and

a printed circuit board (PCB) comprising a ground reflector layer, wherein the interface layer disposed on the PCB via the plurality of solder balls.