IP Library Granted Patent US 10,454,249
Granted Patent B2
US 10,454,249 · App. 16/147,720 · Granted Oct 22, 2019

Semiconductor laser device

Inventor: Tomoya Inoue (Sakai, JP)
Assignee: SHARP KABUSHIKI KAISHA
H01S5/2228H01S5/2209H01S5/3436H01S5/34353
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Quick Facts
Patent No.
US 10,454,249
App. No.
16/147,720
Granted
Oct 22, 2019
Kind
B2
Abstract

In a semiconductor laser device, a n-type cladding layer, a multi-quantum well active layer, and a p-type cladding layer are sequentially laminated on an n-type substrate, and a stripe structure is provided on this semiconductor laminated section. The n-type cladding layer has a first n-type cladding layer configured of Al x1 Ga 1-x1 As (0.4<x1≤1), and a second n-type cladding layer configured of (Al x2 Ga 1-x2 ) 1-y2 In y2 P (0≤x2≤1, 0.45≤y2≤0.55). The p-type cladding layer is configured of (Al x3 Ga 1-x3 ) 1-y3 In y3 P (0≤x3≤1, 0.45≤y3≤0.55). The width of the stripe structure is 10 μm or more, and the refractive index with respect to the laser oscillation wavelength of the first n-type cladding layer is less than or equal to the refractive index with respect to the laser oscillation wavelength of the second n-type cladding layer.

Claims (25)

1. A semiconductor laser device comprising:

an n-type substrate;

a semiconductor laminated section in which an n-type cladding layer, an active layer, and a p-type cladding layer are sequentially laminated on the n-type substrate; and

a stripe structure on an upper section of the semiconductor laminated section,

wherein the n-type cladding layer has at least two layers that are:

a first n-type cladding layer configured of an Al x1 Ga 1-x1 As layer (0.4<x1≤1), at a side distant from the active layer; and

a second n-type cladding layer configured of an (Al x2 Ga 1-x2 ) 1-y2 In y2 P layer (0≤x2≤1, 0.45≤y2≤0.55), at a side near to the active layer,

the p-type cladding layer is configured of an (Al x3 Ga 1-x3 ) 1-y3 In y3 P layer (0≤x3≤1, 0.45≤y3≤0.55), and

a width of the stripe structure is 10 μm or more, and a refractive index with respect to a laser oscillation wavelength of the first n-type cladding layer is less than or equal to a refractive index with respect to a laser oscillation wavelength of the second n-type cladding layer.

2. The semiconductor laser device according to claim 1 ,

wherein, when a layer thickness of the first n-type cladding layer is taken as t n1 and a layer thickness of the second n-type cladding layer is taken as t n2 , a relational expression t n1 >t n2 is satisfied.

3. The semiconductor laser device according to claim 1 ,

wherein, when a refractive index with respect to an oscillation wavelength of the p-type cladding layer is taken as n p , a refractive index with respect to an oscillation wavelength of the first n-type cladding layer is taken as n n1 , a layer thickness of the first n-type cladding layer is taken as t n1 , a refractive index with respect to an oscillation wavelength of the second n-type cladding layer is taken as n n2 , and a layer thickness of the second n-type cladding layer is taken as t n2 , a relational expression n p <[{(n n1 ×t n1 )+(n n2 ×t n2 )}/(t n1 +t n2 )] is satisfied.

4. The semiconductor laser device according to claim 1 ,

wherein the active layer includes at least one quantum well, and has an oscillation wavelength that is greater than or equal to 600 nm and less than or equal to 1100 nm.

5. The semiconductor laser device according to claim 1 ,

wherein the semiconductor laminated section includes,

in the following order:

the n-type cladding layer;

the active layer; and

the p-type cladding layer configured of the (Al x3 Ga 1-x3 ) 1-y3 In y3 P layer (0≤x3≤1, 0.45≤y3≤0.55),

the n-type cladding layer is provided with a laminated body including:

the first n-type cladding layer configured of the Al x1 Ga 1-x1 As layer (0.4<x1≤1), at the side distant from the active layer; and

the second n-type cladding layer configured of the (Al x2 Ga 1-x2 ) 1-y2 In y2 P layer (0≤x2≤1, 0.45≤y2≤0.55), at the side near to the active layer, and

the laminated body is laminated in plurality with a tunnel junction layer interposed.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2022
From: SHARP KABUSHIKI KAISHA
To: SHARP FUKUYAMA LASER CO., LTD.
Reel/Frame 059039/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2018
From: INOUE, TOMOYA
To: SHARP KABUSHIKI KAISHA
Reel/Frame 047013/0975 →
Priority Claims (1)
JP 2017-205200 · Oct 24, 2017 · national
Continuity (1)
Related Publication 20190123514A1 · Apr 25, 2019