Multi-patterned sputter traps and methods of making

1. A sputtering chamber component comprising a particle trap, the particle trap comprising:

a first pattern formed on at least a portion of a surface of the particle trap, the first pattern arranged in a repeating pattern having a first pattern thread count, the first pattern having a first pattern top surface and comprising first indentations having a first depth and separated by first and second threads, the first and second threads having first and second thread top surfaces that form the first pattern top surface; and

a second pattern formed on at least a portion of the first pattern top surface, the second pattern arranged in a repeating pattern having a second thread count, the second pattern having a second pattern top surface and comprising second indentations having a second depth and separated by third and fourth threads, the third and fourth threads having third and fourth thread top surfaces configured to form the second pattern top surface

wherein:

the first threads extending in a first direction form side walls separating adjacent first indentations in a second direction, the second direction at an angle of greater than 0 and less than 180 degrees to the first direction, and the second threads extending in the second direction form side walls separating adjacent first indentations in the first direction; and

the third threads extending in a direction parallel to the first direction form side walls separating adjacent second indentations in a direction parallel to the second direction, and the fourth threads extending in the direction parallel to the second direction form side walls separating adjacent second indentations in the direction parallel to the first direction.

2. The sputtering chamber particle trap of claim 1 , wherein the first pattern thread count is about 15 threads per inch to about 80 threads per inch and the second pattern thread count is about 15 threads per inch to about 80 threads per inch.

3. The sputtering chamber particle trap of claim 1 , further comprising a third pattern formed on at least a portion of the first and second patterns.

4. The sputtering chamber particle trap of claim 3 , further comprising at least one additional pattern formed on at least a portion of the third pattern.

5. The sputtering chamber particle trap of claim 1 , wherein an average depth of at least one of the first and second indentations is from about 330 μm to about 600 μm.

6. The sputtering chamber particle trap of claim 1 , wherein the sputtering chamber particle trap is formed from at least one material chosen from tantalum (Ta), titanium (Ti), aluminum (Al), copper (Cu), nickel (Ni), cobalt (Co), molybdenum (Mo), gold (Au), silver (Ag), platinum (Pt), tungsten (W), chromium (Cr), a tantalum (Ta) alloy, a titanium (Ti) alloy, an aluminum (Al) alloy, a copper (Cu) alloy, a nickel (Ni) alloy, a cobalt (Co) alloy, a molybdenum (Mo) alloy, a gold (Au) alloy, a silver (Ag) alloy, a platinum (Pt) alloy, a tungsten (W) alloy, and a chromium (Cr) alloy.

7. A sputtering chamber component comprising a particle trap, the particle trap comprising:

a first pattern formed on at least a portion of a surface of the particle trap, the first pattern arranged in a repeating pattern having a first pattern thread count, the first pattern having a first pattern top surface and comprising first indentations having a first depth and separated by first and second threads, the first and second threads having first and second thread top surfaces that form the first pattern top surface; and

a second pattern formed on at least a portion of the first pattern top surface, the second pattern arranged in a repeating pattern having a second thread count, the second pattern having a second pattern top surface and comprising second indentations having a second depth and separated by third and fourth threads, the third and fourth threads having third and fourth thread top surfaces configured to form the second pattern top surface,

wherein:

the first threads extending in a first direction form side walls separating adjacent first indentations in a second direction, the second direction at an angle of greater than 0 and less than 180 degrees to the first direction, and the second threads extending in the second direction form side walls separating adjacent first indentations in the first direction; and

the third grooves extending in a direction parallel to the first direction form side walls separating adjacent second ridges in a direction parallel to the second direction, and the fourth grooves extending in the direction parallel to the second direction form side walls separating adjacent second ridges in the direction parallel to the first direction.

8. The sputtering chamber particle trap of claim 7 , wherein the first pattern thread count is about 15 threads per inch to about 80 threads per inch and the second pattern thread count is about 15 threads per inch to about 80 threads per inch.

9. The sputtering chamber particle trap of claim 7 , further comprising a third pattern formed on at least a portion of the first and second patterns.

10. The sputtering chamber particle trap of claim 7 , wherein an average depth of at least one of the first and second indentations is from about 330 μm to about 600 μm.

11. The sputtering chamber particle trap of claim 7 , wherein an average height of at least one of the first and second ridges is from about 0 μm to about 600 μm.

12. A sputtering chamber component comprising a particle trap, the particle trap comprising:

a first pattern formed on at least a portion of a surface of the particle trap, the first pattern arranged in a repeating pattern having a first pattern thread count, the first pattern having a first pattern top surface and comprising first ridges having a first height and separated by first and second grooves, the first ridges having first ridge top surfaces that form the first pattern top surface; and

a second pattern formed on at least a portion of the first pattern top surface, the second pattern arranged in a repeating pattern having a second thread count, the second pattern having a second pattern top surface and comprising second ridges having a second height and separated by third and fourth grooves, the second ridges having second ridge top surfaces configured to form the second pattern top surface,

wherein:

the first grooves extending in a first direction form side walls separating adjacent first ridges in a second direction, the second direction at an angle of greater than 0 and less than 180 degrees to the first direction, and the second grooves extending in the second direction form side walls separating adjacent first ridges in the first direction; and

the third grooves extending in a direction parallel to the first direction form side walls separating adjacent second ridges in a direction parallel to the second direction, and the fourth grooves extending in the direction parallel to the second direction form side walls separating adjacent second ridges in the direction parallel to the first direction.

13. The sputtering chamber particle trap of claim 12 , wherein the first pattern thread count is about 15 threads per inch to about 80 threads per inch and the second pattern thread count is about 15 threads per inch to about 80 threads per inch.

14. The sputtering chamber particle trap of claim 12 , further comprising a third pattern formed on at least a portion of the first and second patterns.

15. The sputtering chamber particle trap of claim 12 , wherein an average height of at least one of the first and second ridges is from about 0 μm to about 600 μm.

16. A sputtering chamber component comprising a particle trap, the particle trap comprising:

a first pattern formed on at least a portion of a surface of the particle trap, the first pattern arranged in a repeating pattern having a first pattern thread count, the first pattern having a first pattern top surface and comprising first ridges having a first height and separated by first and second grooves, the first ridges having first ridge top surfaces that form the first pattern top surface; and

a second pattern formed on at least a portion of the first pattern top surface, the second pattern arranged in a repeating pattern having a second thread count, the second pattern having a second pattern top surface and comprising second ridges having a second height and separated by third and fourth grooves, the second ridges having second ridge top surfaces configured to form the second pattern top surface,

wherein:

the first grooves extending in a first direction form side walls separating adjacent first ridges in a second direction, the second direction at an angle of greater than 0 and less than 180 degrees to the first direction, and the second grooves extending in the second direction form side walls separating adjacent first ridges in the first direction; and

the third threads extending in a direction parallel to the first direction form side walls separating adjacent second indentations in a direction parallel to the second direction, and the fourth threads extending in the direction parallel to the second direction form side walls separating adjacent second indentations in the direction parallel to the first direction.

17. The sputtering chamber particle trap of claim 16 , wherein the first pattern thread count is about 15 threads per inch to about 80 threads per inch and the second pattern thread count is about 15 threads per inch to about 80 threads per inch.

18. The sputtering chamber particle trap of claim 16 , further comprising a third pattern formed on at least a portion of the first and second patterns.

19. The sputtering chamber particle trap of claim 16 , wherein an average depth of at least one of the first and second indentations is from about 330 μm to about 600 μm.

20. The sputtering chamber particle trap of claim 16 , wherein an average height of at least one of the first and second ridges is from about 0 μm to about 600 μm.