Apparatus having first and second transceiver cells formed in a single integrated circuit
An apparatus having first and second transceiver cells formed in a single integrated circuit. In one example embodiment, an apparatus includes a first transceiver cell including a first set of components configured to enable communication on a first communication link in a network and a second transceiver cell formed underneath the first transceiver cell in a single integrated circuit (IC). The second transceiver cell is optically isolated from the first transceiver cell. The second transceiver cell includes a second set of components configured to enable communication on a second communication link in the network.
1. A transceiver comprising:
a semiconductor substrate;
a first optical transceiver cell including a first set of components integrated on the semiconductor substrate: a first laser driver, a first post-amplifier, a first transmitter, a first receiver, a first interconnection between the first transmitter and the first laser driver, and a second interconnection between the first post-amplifier and the first receiver, wherein the first set of components are each fabricated via a semiconductor fabrication process in a single semiconductor die; and
a second optical transceiver cell that is optically isolated from the first optical transceiver cell, the second optical transceiver cell including a second set of components directly integrated on the semiconductor substrate: a second laser driver, a second post-amplifier, a second receiver, a second transmitter, a third interconnection between the second receiver and the second post-amplifier, and a fourth interconnection between the second laser driver and the second transmitter, wherein the second optical transceiver cell is fabricated via the semiconductor fabrication process underneath the first optical transceiver cell in a single integrated circuit and in the single semiconductor die with the first optical transceiver cell;
a first optical port that is configured for communication of optical signals to the first receiver from a first optical fiber;
a second optical port that is configured for communication of optical signals from the first transmitter to a second optical fiber;
a third optical port that is configured for communication of optical signals to the second receiver from a third optical fiber; and
a fourth optical port that is configured for communication of optical signals from the second transmitter to a fourth optical fiber, and
wherein the first transmitter and the first receiver are configured to communicate information on a first communication link and the second transmitter and the second receiver are configured to communicate information on a second communication link.
2. The transceiver of claim 1 , wherein the first optical port, the second optical port, the third optical port, and the fourth optical port are aligned along an axis.
3. The transceiver of claim 1 , wherein:
the first optical transceiver cell further includes a first sense photo diode that is integrated on the semiconductor substrate; and
the second optical transceiver cell further includes a second sense photo diode that is integrated on the semiconductor substrate.
4. The transceiver of claim 1 , wherein the second set of components are each fabricated via the semiconductor fabrication process in the single semiconductor die.