Methods for manufacturing a display device

1. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a carrier substrate supporting a plurality of light emitting diodes (LEDs);

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber;

providing an insulator over the substrate;

providing a first electrode electrically connected to at least one of the plurality of LEDs;

providing a light guide layer over the first electrode and the substrate, wherein the light guide layer serves as a planarization layer;

determining that one of the plurality of LEDs is defective; and

electrically isolating the one of the plurality of LEDs.

2. The method of claim 1 , wherein in transferring the plurality of LEDs from the carrier substrate to the substrate, transfer heads are placed in contact with the plurality of LEDs.

3. The method of claim 2 , wherein a size of one of the transfer heads contacting one of the plurality of LEDs is smaller than a size of the one of the plurality of LEDs contacting the one of the transfer heads.

4. The method of claim 1 , wherein in providing the substrate, a contact via provided in the substrate, one of the plurality of LEDs comprises an electrical contact electrically connected to the contact via, and a size of a top portion of the contact via is greater than a size of the electrical contact.

5. The method of claim 1 , further comprising:

providing a wavelength conversion layer over the insulator; and

providing a color filter over the wavelength conversion layer, wherein a width of the wavelength conversion layer is smaller than a width of the color filter.

6. The method of claim 1 , wherein in fixing the plurality of LEDs to the substrate, a bonding layer is between the substrate and one of the plurality of LEDs.

7. The method of claim 6 , wherein in fixing the plurality of LEDs to the substrate, a bonding material is covering sidewalls of the bonding layer.

8. The method of claim 1 , wherein a thickness of a portion of the light guide layer overlapping the first electrode is less than a thickness of another portion of the light guide layer not overlapping the first electrode.

9. The method of claim 1 , further comprising providing a wavelength conversion layer over the light guide layer.

10. The method of claim 9 , further comprising providing a cover over the wavelength conversion layer.

11. The method of claim 1 , further comprising providing a metal layer under one of the plurality of sub-pixel locations, wherein a part of the metal layer serves as a portion of a thin-film transistor and another part of the metal layer does not serve as a portion of a thin-film transistor.

12. The method of claim 1 , further comprising repair of the one of the plurality of LEDs before the positioning the substrate within a chamber.

13. The method of claim 1 , further comprising providing a passivation layer over the one of the plurality of LEDs.

14. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a carrier substrate supporting a plurality of LEDs;

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber;

providing an insulator over the substrate;

providing a wavelength conversion layer over the insulator; and

providing a color filter over the wavelength conversion layer, wherein a width of the wavelength conversion layer is smaller than a width of the color filter.

15. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a metal layer under one of the plurality of sub-pixel locations, wherein a part of the metal layer serves as a thin-film transistor and another part of the metal layer does not serve as a thin-film transistor;

providing a carrier substrate supporting a plurality of LEDs;

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber; and

providing an insulator over the substrate.