IP Library Granted Patent US 11,395,442
Granted Patent B2
US 11,395,442 · App. 16/154,128 · Granted Jul 19, 2022

Air handling system and method

Inventor: Zhiyong Lin (Dublin, OH)
Assignee: Vertiv Corporation
H05K7/20745F24F5/001F24F5/0035F24F12/006F24F13/30F25B39/00F28C1/14F28D5/00F24F2110/10F25B2339/021
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,395,442
App. No.
16/154,128
Granted
Jul 19, 2022
Kind
B2
Abstract

The present disclosure relates to an air handling system which has a fan supply section for intaking warm air from a room environment, and first and second indirect evaporative cooling subsystems (IDECs) spaced apart from one another to form an air plenum and a hot aisle in communication with the air plenum. The air plenum and the hot aisle are both formed between the IDECs, with the air plenum communicating with the fan supply section to receive the warm air. The IDECs receive the warm air and cool the warm air to produce first and second cooled airflows. The system also includes spaced apart cold aisles adjacent each of the IDECs for channeling the cooled airflows into an evaporator section. The evaporator section produces a final cooled airflow which is directed back into the room environment.

Claims (81)

1. An air handling system, comprising:

a fan supply section for intaking indoor room air from a room environment in which the air handling system is located;

first and second indirect evaporative cooling (IDEC) subsystems spaced apart from one another to form an air plenum and a hot aisle in communication with the air plenum, the air plenum and the hot aisle both also being formed between the IDEC subsystems, the air plenum being in airflow communication with the fan supply section for receiving the indoor room air, the IDEC subsystems receiving the indoor room air and cooling the indoor room air to produce first and second cooled airflows;

spaced apart cold aisles adjacent each of the IDEC subsystems for receiving and channeling the first and second cooled airflows output from the IDEC subsystems; and

an evaporator section in flow communication with the cold aisles for receiving the first and second cooled air flows and producing a final cooled airflow which is directed out from the air handling system back into the room environment; and

wherein the evaporator section is positioned adjacent the cold aisles so that the first and second cooled air flows exiting the IDEC subsystems each make a 90 degree turn to flow into the evaporator section.

2. The system of claim 1 , wherein each of said first and second IDEC subsystems includes at least one condenser having at least one condenser fan.

3. The system of claim 2 , wherein the at least one condenser includes:

a pair of spaced apart condenser coils; and

the at least one condenser fan positioned between the pair of spaced apart condenser coils.

4. The system of claim 3 , wherein the pair of spaced apart condenser coils are arranged in a V-shape.

5. The system of claim 2 , further comprising an outside air plenum and sump pan in communication with the condenser for enabling the indoor room air from the room environment to be ingested into at least one of the first or second IDEC subsystems.

6. The system of claim 1 , further including first and second condensers;

the first condenser being disposed elevationally above the first IDEC subsystem and being operatively associated therewith; and

the second condenser being disposed elevationally above the second IDEC subsystem and being operatively associated therewith.

7. The system of claim 6 , further comprising an outside air plenum and sump pan in communication with both of the condensers for enabling the indoor room air from the room environment to be ingested into both of the first and second IDEC subsystems.

8. The system of claim 1 , wherein each of said first and second IDEC subsystems includes a spray section for spraying atomized water onto the indoor room air flowing therethrough.

9. The system of claim 1 , wherein each one of said first and second IDEC subsystems includes an evaporative air-to-air heat exchanger.

10. The system of claim 1 , further comprising a compressor in communication with the evaporator section.

11. The system of claim 1 , further comprising a first damper movable between open and closed positions for separating the air plenum from the hot aisle.

12. The system of claim 11 , further comprising a second damper movable between open and closed positions, the second damper permitting the indoor room air from the room environment to flow directly through the evaporator section when the first damper is in the closed position.

13. The system of claim 1 , wherein the fan supply section is positioned elevationally above the evaporator section.

14. An air handling system, comprising:

a fan supply section for intaking indoor room air from a room environment in which the air handling system is located;

first and second condenser sections;

first and second indirect evaporative cooling (IDEC) subsystems positioned adjacent the fan supply section and elevationally below the first and second condenser sections;

the first and second IDEC subsystems spaced apart from one another to form an air plenum and a hot aisle therebetween, and wherein both of the IDEC subsystems are in communication with the air plenum and the hot aisle;

the air plenum and the hot aisle being in communication with one another and the air plenum being in airflow communication with the fan supply section for receiving the indoor room air, the IDEC subsystems receiving the indoor room air from the hot aisle and cooling the indoor room air to produce first and second cooled airflows;

spaced apart cold aisles adjacent each of the IDEC subsystems and elevationally below the condenser for receiving and channeling the first and second cooled airflows output from the IDEC subsystems; and

an evaporator section disposed adjacent the IDEC subsystems and in flow communication with the cold aisles for receiving the first and second cooled air flows and producing a final cooled airflow which is directed out from the air handling system back into the room environment.

15. The system of claim 14 , wherein each of the first and second IDEC subsystems include:

a spray section for spraying an atomized fluid into the indoor room air; and

an evaporative air-to-air heat exchanger section.

16. The system of claim 14 , further including a first damper disposed between the air plenum and the hot aisle, the first damper being movable between open and closed positions.

17. The system of claim 16 , further including a second damper movable between open and closed positions, the second damper permitting the indoor room air from the room environment to flow directly through the evaporator section when the first damper is in the closed position.

18. The system of claim 14 , further comprising an outside air plenum and sump pan in communication with both of the condensers for enabling the indoor room air from the room environment to be ingested into both of the IDEC subsystems.

19. A method for forming an air handing unit, comprising:

using a fan supply section to intake indoor room air from a room environment in which the air handling system is located;

arranging first and second indirect evaporative cooling (IDEC) subsystems so as to be spaced apart from one another, parallel to one another, with an intake side of each said IDEC subsystem facing the other, to form an air plenum and a hot aisle between the IDEC subsystems;

placing the air plenum and the hot aisle in airflow communication with one another;

placing the air plenum in airflow communication with the fan supply section to receive the indoor room air ingested from the room environment by the fan supply section;

splitting the indoor room air flowing into the air plenum into first and second portions within the hot aisle;

causing the first and second portions of the indoor room air to make 90 degree turns within the hot aisle, such that the second portion flows in a direction 180 degrees opposite to that of the first portion, and such that the first and second portions flow into the first and second IDEC subsystems, respectively,

using the first and second IDEC subsystems to receive the first and second portions of the indoor room air exiting the hot aisle and to cool the first and second portions of the indoor room air to produce first and second cooled airflows, respectively;

directing the first and second cooled airflows into spaced apart, parallel extending cold aisles adjacent each of the first and second IDEC subsystems, the cold aisles further being configured parallel one another, and parallel to the hot aisle;

using an evaporator section arranged to extend perpendicularly to the cold aisles, and such that the evaporator section covers both of the cold aisles, with the evaporator section being in flow communication with the cold aisles, and configured to receive the first and second cooled air flows and to output a final cooled airflow back into the room environment; and

wherein the evaporator section is positioned adjacent the cold aisles so that the first and second cooled air flows exiting the IDEC subsystems each make a 90 degree turn to flow into the evaporator section.

20. An air handling system, comprising:

a fan supply section for intaking indoor room air from a room environment in which the air handling system is located;

first and second indirect evaporative cooling (IDEC) subsystems spaced apart from one another to form an air plenum and a hot aisle in communication with the air plenum, the air plenum and the hot aisle both also being formed between the IDEC subsystems, the air plenum being in airflow communication with the fan supply section for receiving the indoor room air, the IDEC subsystems receiving the indoor room air and cooling the indoor room air to produce first and second cooled airflows;

spaced apart cold aisles adjacent each of the IDEC subsystems for receiving and channeling the first and second cooled airflows output from the IDEC subsystems; and

an evaporator section in flow communication with the cold aisles for receiving the first and second cooled air flows and producing a final cooled airflow which is directed out from the air handling system back into the room environment;

a first damper movable between open and closed positions for separating the air plenum from the hot aisle; and

a second damper movable between open and closed positions, the second damper permitting the indoor room air from the room environment to flow directly through the evaporator section when the first damper is in the closed position.

21. The system of claim 20 , wherein each of said first and second IDEC subsystems includes at least one condenser having at least one condenser fan.

22. The system of claim 21 , wherein the at least one condenser of each one of said IDEC subsystems includes:

a pair of spaced apart condenser coils; and

the at least one condenser fan positioned between the pair of condenser coils.

23. The system of claim 22 , wherein the spaced apart condenser coils are arranged in a V-shape.

24. The system of claim 21 , further comprising an outside air plenum and sump pan in communication with the at least one condenser for enabling the indoor room air from the room environment to be ingested into at least one of the first or second IDEC subsystems.

25. The system of claim 20 , further including first and second condensers;

the first condenser being disposed elevationally above the first IDEC subsystem and being operatively associated therewith; and

the second condenser being disposed elevationally above the second IDEC subsystem and being operatively associated therewith.

26. The system of claim 25 , further comprising an outside air plenum and sump pan in communication with the first and second condensers for enabling the indoor room air from the room environment to be ingested into both of the first and second IDEC subsystems.

27. The system of claim 20 , wherein each of said first and second IDEC subsystems includes a spray section for spraying atomized water onto the indoor room air flowing therethrough.

28. The system of claim 20 , wherein each one of said first and second IDEC subsystems includes an evaporative air-to-air heat exchanger.

29. The system of claim 20 , further comprising a compressor in communication with the evaporator section.

30. The system of claim 20 , wherein the evaporator section is positioned adjacent the cold aisles so that the first and second cooled air flows exiting the first and second IDEC subsystems each make a 90 degree turn to flow into the evaporator section.

31. The system of claim 20 , wherein the fan supply section is positioned elevationally above the evaporator section.

32. A method for forming an air handing unit, comprising:

using a fan supply section to intake indoor room air from a room environment in which the air handling system is located;

arranging first and second indirect evaporative cooling (IDEC) subsystems so as to be spaced apart from one another, parallel to one another, with an intake side of each said IDEC subsystem facing the other, to form an air plenum and a hot aisle between the IDEC subsystems;

placing the air plenum and the hot aisle in airflow communication with one another;

placing the air plenum in airflow communication with the fan supply section to receive the indoor room air ingested from the room environment by the fan supply section;

splitting the indoor room air flowing into the air plenum into first and second portions within the hot aisle;

causing the first and second portions of the indoor room air to make 90 degree turns within the hot aisle, such that the second portion flows in a direction 180 degrees opposite to that of the first portion, and such that the first and second portions flow into the first and second IDEC subsystems, respectively,

using the first and second IDEC subsystems to receive the first and second portions of the indoor room air exiting the hot aisle and to cool the first and second portions of the indoor room air to produce first and second cooled airflows, respectively;

directing the first and second cooled airflows into spaced apart, parallel extending cold aisles adjacent each of the first and second IDEC subsystems, the cold aisles further being configured parallel one another, and parallel to the hot aisle;

using an evaporator section arranged to extend perpendicularly to the cold aisles, and such that the evaporator section covers both of the cold aisles, with the evaporator section being in flow communication with the cold aisles, and configured to receive the first and second cooled air flows and to output a final cooled airflow back into the room environment;

using a first damper movable between open and closed positions for separating the air plenum from the hot aisle; and

using a second damper movable between open and closed positions, the second damper permitting the indoor room air from the room environment to flow directly through the evaporator section when the first damper is in the closed position.

Assignments (6)
SECURITY INTEREST Recorded Oct 26, 2021
From: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.
To: UMB BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 057923/0782 →
ABL SECURITY AGREEMENT Recorded Mar 3, 2020
From: ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 052075/0497 →
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2019
From: LIN, ZHIYONG
To: VERTIV CORPORATION
Reel/Frame 048801/0023 →