IP Library Granted Patent US 10,411,171
Granted Patent B2
US 10,411,171 · App. 16/157,991 · Granted Sep 10, 2019

Method of manufacturing a light emitting device

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Quick Facts
Patent No.
US 10,411,171
App. No.
16/157,991
Granted
Sep 10, 2019
Kind
B2
Abstract

A Light Emitting Device (LED) that has increased reliability and efficiency. Specifically, the LED may be formed using Atomic Layer Deposition to improve the thermal conductivity between the ceramic plate and the LED, decrease the amount of organic contamination, and increase the efficiency of the optical output of the LED.

Claims (12)

1. A light emitting device comprising:

an adhesive applied to a portion of a ceramic phosphor plate, wherein the portion of the ceramic phosphor plate has a smaller surface area than a surface area of the ceramic phosphor plate;

a light emitting diode directly affixed to the ceramic phosphor plate by the adhesive, wherein the light emitting diode and the ceramic phosphor plate are separated by a gap; and

a transparent material formed in the gap.

2. The light emitting device of claim 1 , further comprising: the transparent material on sidewalls of the light emitting diode.

3. The light emitting device of claim 1 , wherein the adhesive is silicone or sol-gel glue.

4. The light emitting device of claim 1 , wherein the transparent material has a same index of refraction as the light emitting diode.

5. The light emitting device of claim 1 , wherein the transparent material is Alumina or Al 2 O 3 .

6. The light emitting device of claim 1 , wherein the portion of the ceramic plate includes a plurality of discrete regions.

7. The light emitting device of claim 1 , wherein the portion of the ceramic plate has a cross-sectional area substantially in a shape of a cross.

8. The light emitting device of claim 1 , wherein the portion of the ceramic plate has a cross-sectional area substantially in a shape of a line.

9. The light emitting device of claim 1 , wherein the ceramic phosphor plate is Lumiramic.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2019
From: SHIMIZU, KEN T.; MASUI, HISASHI; ROITMAN, DANIEL B.
To: LUMILEDS LLC
Reel/Frame 049871/0378 →