Semiconductor device including diode structure
A semiconductor device may include a semiconductor substrate, an upper electrode and a lower electrode. The semiconductor substrate may include: a p-type anode region being in contact with the upper electrode; an n-type cathode region being in contact with the lower electrode; an n-type drift region interposed between the anode region and the cathode region. The semiconductor substrate may further include a barrier region interposed between the anode region and the drift region; and an n-type pillar region extending between the barrier region and the upper electrode. The barrier region may include a multi-layer structure in which a p-type second barrier layer is interposed between an n-type first barrier layer and an n-type third barrier layer. The first barrier layer may be in contact with the anode region and is connected to the upper electrode via the pillar region.
1. A semiconductor device comprising:
a semiconductor substrate;
an upper electrode provided on an upper surface of the semiconductor substrate; and
a lower electrode provided on a lower surface of the semiconductor substrate located opposite to the upper surface,
wherein the semiconductor substrate comprises:
a p-type anode region being in contact with the upper electrode;
an n-type cathode region being in contact with the lower electrode;
an n-type drift region interposed between the anode region and the cathode region, a carrier density of the drift region being lower than a carrier density of the cathode region,
a barrier region interposed between the anode region and the drift region; and
an n-type pillar region extending between the barrier region and the upper electrode, the pillar region being in Schottky contact with the upper electrode,
the barrier region comprises a multi-layer structure comprising an n-type first barrier layer, a p-type second barrier layer and an n-type third barrier layer, wherein the second barrier layer is interposed between the first barrier layer and the third barrier layer,
carrier densities of the first and third barrier layers are each higher than the carrier density of the drift region, and
the first barrier layer is in contact with the anode region and is connected to the upper electrode via the pillar region.
2. The semiconductor device according to claim 1 ,
wherein the semiconductor substrate further comprises:
a p-type body region being in contact with the upper electrode;
an n-type emitter region being in contact with the upper electrode and being separated from the drift region by the body region;
a trench provided in the upper surface and extending up to the drift region; and
a p-type collector region being in contact with the lower electrode and being separated from the body region by the drift region,
a gate electrode and a gate insulator film are provided within the trench, the gate electrode being opposed to the emitter region, the body region and the drift region via the gate insulator film, and
the barrier region is interposed between the body region and the drift region.
3. The semiconductor device according to claim 2 , wherein the barrier region further comprises a p-type forth barrier layer interposed between the third barrier layer and the drift region.
4. The semiconductor device according to claim 1 , wherein the carrier density of the third barrier layer is higher than the carrier density of the first barrier layer.
5. The semiconductor device according to claim 4 , wherein the carrier density of the third barrier layer is at least three times as high as the carrier density of the first barrier layer.
6. The semiconductor device according to claim 1 , wherein the carrier density of the third barrier layer is constant along a direction parallel with the semiconductor substrate.