Fuse pad, printed circuit board having the fuse pad, and method of the printed circuit board
Disclosed are a fuse pad, a printed circuit board having the fuse pad, and a method of manufacturing the printed circuit board. The fuse pad includes a first pad provided at one side of a fuse, a second pad provided at an opposite side of the fuse, and a measurement pad electrically connected to the second pad to measure whether the fuse is detached.
1. A fuse pad comprising:
a first pad provided at one side of a fuse;
a second pad provided at an opposite side of the fuse; and
a measurement pad electrically connected to the second pad and disposed away from the fuse to measure whether the fuse is detached.
2. The fuse pad of claim 1 , wherein the second pad is provided at a portion of the fuse which is fixed.
3. The fuse pad of claim 1 , wherein the second pad is provided at an outer end portion of the fuse which is fixed.
4. The fuse pad of claim 1 , wherein the second pad is provided at a central portion of the fuse which is fixed.
5. The fuse pad of claim 1 , wherein the second pad is provided at an inner end portion of the fuse which is fixed.
6. The fuse pad of claim 1 , wherein the measurement pad is configured to:
output a fuse-fixation signal when the fuse and the second pad are in contact with each other; and
output a fuse-separation signal when the fuse and the second pad are in no contact with each other.
7. The fuse pad of claim 1 , wherein at least one of the first pad and the second pad includes a solder mask.
8. The fuse pad of claim 1 , wherein the fuse includes a thermal fuse.
9. The fuse pad of claim 1 , wherein the measurement pad is disposed on a same plane as the first and/or second pads.
10. The fuse pad of claim 9 , wherein the measurement pad is connected with the second pad directly, or connected with the second pad by non-movable connection positioned between the measurement pad and the second pad.
11. A printed circuit board comprising:
a substrate material;
a first pad provided at one side of a fuse, at one side of the substrate material to protect the one side of the substrate material;
a second pad provided at an opposite side of the fuse, at an opposite side of the substrate material to protect the opposite side of the substrate material; and
a measurement pad electrically connected to the second pad and disposed away from the fuse to measure whether the fuse is detached.
12. The printed circuit board of claim 11 , wherein the substrate material is provided in the form of multi-layer, and
the measurement pads are connected to each other through a via hole formed through the substrate material in the form of multi-layer.
13. The printed circuit board of claim 11 , further comprising an electronic device to communicate with the measurement pad,
wherein the measurement pad transmits a fuse-fixation signal or a fuse-separation signal to the electronic device such that the electronic device identifies whether the fuse is separated or not.
14. The printed circuit board of claim 11 , wherein the measurement pad is disposed on a same plane as the first and/or second pads.
15. The printed circuit board of claim 11 , wherein the measurement pad is disposed below the first and/or second pads.
16. The printed circuit board of claim 14 , wherein the measurement pad is connected with the second pad directly, or connected with the second pad by non-movable connection positioned between the measurement pad and the second pad.
17. A fuse pad comprising:
a first pad provided at one side of a fuse;
a second pad provided at an opposite side of the fuse; and
a measurement pad electrically connected to the second pad and disposed away from the fuse to measure whether the fuse is detached
wherein the measurement pad is disposed below the first and/or second pads.