Heat sink tray for printed circuit boards

1. A printed circuit board heat sink and encapsulation device comprising:

a thermally conductive single-piece tray having a well configured for receiving a printed circuit board mountable to a portion of the well;

wherein the well is configured to receive thermally conductive potting material located between a mounted printed circuit board and the tray;

wherein, when the well is substantially filled with the potting material, the mounted printed circuit board is substantially encapsulated, and the thermally conductive single-piece tray serves as a heat sink for the printed circuit board;

wherein the well has an outer boundary that is substantially similar in shape to the shape of a non-linear outer edge of the printed circuit board received in the well;

wherein the bottom surface of the well of the single-piece tray also comprises printed circuit component compliment cavities;

wherein the bottom surface of the well includes a recess track structured to receive a plurality of printed circuit components; and

wherein the recess track intersects the printed circuit component compliment cavities.

2. The printed circuit board heat sink and encapsulation device of claim 1 , wherein the well comprises a substantially planar bottom portion and a side wall protruding upward from the bottom portion so that the side wall forms an external boundary that is substantially similar in shape to the shape of more than one non-linear edge of the printed circuit board.

3. The printed circuit board heat sink and encapsulation device of claim 1 , wherein the potting material is also placed between the printed circuit board and a bottom surface of the well.

4. The printed circuit board heat sink and encapsulation device of claim 3 , wherein the printed circuit board is mounted to the single-piece tray via threaded fasteners extending through the printed circuit board and threadably coupled to threaded fastener holes.

5. The printed circuit board heat sink and encapsulation device of claim 4 , wherein washers are positioned around the threaded fasteners and located between the printed circuit board and the bottom surface of the well, when the printed circuit board is mounted to the single-piece tray.

6. The printed circuit board heat sink and encapsulation device of claim 1 , wherein the recess track includes a first recess level and a second recess level.

7. A printed circuit board heat sink comprising:

a substantially planar bottom portion;

a side wall protruding upward from the bottom portion of the printed circuit board heat sink, wherein the side wall protrudes upward from the bottom portion so that the side wall forms an external boundary that is substantially similar in shape to the shape of an outer edge of a printed circuit board;

wherein the planar bottom portion and side wall are configured so that the printed circuit board is mountable to the bottom of the printed circuit board heat sink, when the printed circuit board is positioned within the external boundary formed by the protruding side wall;

wherein the printed circuit board heat sink is configured to dissipate heat from the printed circuit board, when the printed circuit board is mounted to the printed circuit board heat sink;

wherein the printed circuit board heat sink is configured to receive and retain encapsulating material in a manner facilitating encapsulation of the printed circuit board, when the printed circuit board is mounted to the printed circuit board heat sink;

wherein the printed circuit board is mounted to the substantially planar bottom portion, by threaded fasteners that extend through the printed circuit board and fasten into fastener holes correspondingly located on the substantially planar bottom portion;

wherein washers are located between the printed circuit board and the substantially planar bottom portion, when the printed circuit board is mounted to the substantially planar bottom portion;

wherein encapsulating material is placed between the printed circuit board and the substantially planar bottom portion, when the printed circuit board is mounted to the substantially planar bottom portion;

wherein the substantially planar bottom includes printed circuit component compliment cavities; and

wherein the substantially planar bottom includes a recess track structured to receive a plurality of printed circuit components.

8. The printed circuit board heat sink of claim 7 , further comprising a sil-pad between the printed circuit board and the heat sink when the printed circuit board is mounted to the substantially planar bottom portion.

9. The printed circuit board heat sink of claim 7 , wherein the encapsulating material is a thermally conductive compound.

10. The printed circuit board heat sink of claim 9 , wherein heat from the mounted printed circuit board is transferred to the printed circuit board heat sink via the thermally conductive encapsulating material, placed in between the substantially planar bottom portion and the mounted printed circuit board.