Supplementary tool for chip transfer device with removal tool and turning tool
A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.
1. A chip transfer device for transferring chips from a wafer to a placement head of an automatic placement machine, the chip transfer device comprising:
first and second rotatable tools, the first rotatable tool comprising a rotatable removal tool rotatable about a first axis of rotation, the rotatable removal tool being configured to
remove singulated chips from the wafer, and to
turn the removed chips to provide the removed chips as Flip-Chip-on-Board (FCOB) chips at a first collection position, and to
transfer, at a common transfer position, the removed chips to a rotatable turning tool which is rotatable about a second axis of rotation parallel to the first axis of rotation; and
the second rotatable tool comprising a rotatable turning tool which is configured to
receive removed chips from the rotatable removal tool, and is further configured to
again turn the chips so received, in order to provide them as Chip-on-Board (COB) chips at a second collection position;
wherein the rotatable removal tool has a plurality of first grippers each for temporarily receiving one chip, the first grippers being configured and arranged for protruding radially from the first axis of rotation and in a first plane,
wherein the rotatable turning tool has a plurality of second grippers each for temporarily receiving one chip, the second grippers being configured and arranged for radially protruding from the second axis of rotation and in a second plane parallel to the first plane,
wherein at least one rotatable removal tool has a first interface, enabling mounting of a supplementary tool with a plurality of third grippers, which are configured and arranged for radially protruding from a center axis of a supplementary tool in a third plane parallel to the first plane when the supplementary tool is mounted, and
wherein the first interface is formed such that the center axis coincides with the first axis of rotation or with the second axis of rotation when the supplementary tool is mounted.
2. The chip transfer device of claim 1 , wherein the at least one rotatable removal tool with the first interface comprises:
a chassis; and
a displacement drive mounted on the chassis for displacing (i) the first grippers of the rotatable tool and (ii) the third grippers of the supplementary tool along the axis of rotation of the rotatable removal tool;
optionally, the chip transfer device further comprises a pneumatic interface for the controlled application of a partial vacuum to the first grippers of the rotatable removal tool with the first interface;
optionally, the chip transfer device further comprises a pneumatic shunt element, which is connected downstream of the pneumatic interface and which is configured to apply a partial vacuum only to those of the grippers associated with a selected plane of the grippers, depending on the current position of the pneumatic shunt element;
optionally, the pneumatic shunt element is coupled to the displacement drive such that those grippers associated with the selected plane of grippers are automatically subjected to a partial vacuum.
3. The chip transfer device of claim 1 , further comprising a plurality of actuable radial drives, and one of the radial drives is associated with each of the grippers of the rotatable removal tool, the rotatable turning tool and the supplementary tool so that the respective gripper can be moved in the radial direction with respect to one of the particular axes of rotation.
4. The chip transfer device of claim 3 , wherein the grippers of the rotatable tool without the first interface are each associated with a radial drive.
5. The chip transfer device of claim 3 , wherein no radial drive is associated with the grippers of the rotatable removal tool with the first interface and/or with the grippers of the supplementary tool.
6. The chip transfer device of claim 1 , wherein the first grippers, the second grippers and/or the third grippers are spring-mounted at least in the radial direction.