Semiconductor device
A semiconductor device may include a semiconductor element; a temperature detecting element provided at a central part of a surface of the semiconductor element, and a heat conductor jointed to the surface of the semiconductor element via a jointing element. The jointing element may include a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element. The heat conductor may include a metal part being in contact with the central part of the jointing element, and a graphite part being in contact with the peripheral part of the jointing element.
1. A semiconductor device comprising:
a semiconductor element;
a temperature detecting element provided at a central part of a surface of the semiconductor element; and
a heat conductor jointed to the surface of the semiconductor element via a jointing element,
wherein
the jointing element comprises a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element, and
the heat conductor comprises a metal part being in contact with the central part of the jointing element, and a graphite part being in contact with the peripheral part of the jointing element.
2. The semiconductor device according to claim 1 , further comprising:
a plurality of metal wires embedded in the jointing element,
wherein the plurality of metal wires is arranged along the peripheral part of the jointing element when viewed in a direction orthogonal to the surface of the semiconductor element.
3. The semiconductor device according to claim 1 , wherein
a plurality of recesses is provided in the graphite part, and
the jointing element fills each of the recesses.
4. A semiconductor device comprising:
a semiconductor element;
a temperature detecting element provided at a central part of a surface of the semiconductor element;
a heat conductor jointed to the surface of the semiconductor element via a jointing element; and
a plurality of metal wires embedded in the jointing element,
wherein
the jointing element comprises a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element, and
the plurality of metal wires is arranged along the peripheral part of the jointing element when viewed in a direction orthogonal to the surface of the semiconductor element.