Tamper sensor assembly
A tamper sensor assembly that includes a substrate with a protective bulk section including tamper circuitry and a hardware section configured to receive hardware circuitry and extending from the protective bulk section; the hardware circuitry electrically connected to the tamper circuitry to alter operation of the hardware circuitry responsive to modification of the tamper circuitry. The substrate additionally includes an attachment section extending from the hardware section. The tamper sensor assembly also includes a first fold in the substrate to position a first portion of the hardware section to extend along the protective bulk section, and a second fold in the substrate to position a second portion of the hardware section to extend along the first portion of the hardware section.
1. A tamper sensor assembly comprising:
a substrate including:
a protective bulk section including tamper circuitry;
a hardware section configured to receive hardware circuitry and extending from the protective bulk section;
the hardware circuitry electrically connected to the tamper circuitry to alter operation of the hardware circuitry responsive to modification of the tamper circuitry;
an attachment section extending from the hardware section;
a first fold in the substrate to position a first portion of the hardware section to extend along the protective bulk section; and
a second fold in the substrate to position a second portion of the hardware section to extend along the first portion of the hardware section.
2. The tamper sensor assembly of claim 1 , wherein the protective bulk section is a mesh substrate.
3. The tamper sensor assembly of claim 2 , wherein the mesh substrate includes a flexible polyvinylidene fluoride or polyvinylidene difluoride (PVDF) film.
4. The tamper sensor assembly of claim 3 , wherein the flexible mesh substrate further includes conductive layers and insulative layers formed on the flexible PVDF film.
5. The tamper sensor assembly of claim 4 , wherein the conductive layers include serpentine layers.
6. The tamper sensor assembly of claim 1 , wherein the attachment section includes adhesive that secures the attachment section to the protective bulk section.
7. The tamper sensor assembly of claim 6 , wherein the adhesive secures to a lip of the protective bulk section.
8. The tamper sensor assembly of claim 1 , wherein the attachment section includes an interlocking body that is matingly received by the protective bulk section to secure the attachment section to the protective bulk section.
9. The tamper sensor assembly of claim 8 , wherein the interlocking body is a T-shaped body having a flange that interlocks with a flange of the protective bulk section.
10. A method of manufacturing a tamper sensor assembly comprising:
layering tamper circuitry on a substrate in a protective bulk bulkhead section of the substrate;
placing hardware circuitry on the substrate in a hardware section of the substrate;
connecting the hardware circuitry to the tamper circuitry such that the tamper circuitry alters operation of the hardware circuitry when the tamper circuitry is modified;
folding the substrate a first time to extend a first portion of the hardware section along the protective bulk bulkhead section of the substrate; and
folding the substrate a second time to extend a second portion of the hardware section along the first portion of the hardware section of the substrate.
11. The method of claim 10 , further comprising:
adhering an attachment section of the substrate that extends from the hardware section of the substrate, to the protective bulk bulkhead section.
12. The method of claim 10 , further comprising:
interlocking an attachment section of the substrate that extends from the hardware section of the substrate, to the protective bulkhead section.
13. The method of claim 10 , wherein the substrate is a polyvinylidene fluoride or polyvinylidene difluoride (PVDF) film.
14. The method of claim 10 , wherein the hardware circuitry is a flexible circuit.
15. A tamper sensor assembly comprising:
a substrate including a protective bulk section having tamper circuitry and a hardware section having hardware circuitry extending from the protective bulk section, wherein the hardware circuitry is altered responsive to modification of the tamper circuitry;
a protective bulk section fold along an edge of the protective bulk section adjacent the hardware section to engage a first portion of the hardware section against the protective bulk section along a first engagement surface of the hardware section;
a hardware section fold in the hardware section to engage a second portion of the hardware section against the first portion of the hardware section along a second engagement surface of the hardware section opposite the first engagement surface of the hardware section to enclose the first portion of the hardware section.
16. The tamper sensor assembly of claim 15 , wherein the substrate includes an attachment section extending from the hardware section that secures to a lip of the protective bulk section to position the hardware section between the lip and the hardware section fold.
17. The tamper sensor assembly of claim 16 , wherein the attachment section includes a flange that engages a flange of the protective bulk section.
18. The tamper sensor assembly of claim 15 , wherein the protective bulk section is a mesh substrate.
19. The method of claim 11 , wherein the attachment section includes adhesive, and during the step of adhering the adhesive is placed into contact with the protective bulk section.
20. The tamper sensor assembly of claim 16 , wherein the attachment section includes an adhesive that secures to the lip of the protective bulk section.