CIRCUIT BOARD, CAMERA MODULE, AND METHOD FOR LABELING THE CIRCUIT BOARD
A circuit board includes an assembly and a labeling area. The assembly area is for installation of the elements. The labeling area is for marking of the circuit board. A paint layer is coated on a surface of the labeling area. A two-dimensional code is printed on the paint layer. A camera module having the circuit board and a method for labeling the circuit board are also provided.
1 . A circuit board comprising:
an assembly area; and
a labeling area connected to the assembly area;
wherein a paint layer is coated on a surface of the labeling area, a two-dimensional code is printed on the paint layer.
2 . The circuit board of claim 1 , wherein the two-dimensional code is formed by laser.
3 . The circuit board of claim 1 , wherein the paint layer is white paint.
4 . A camera module comprising:
a circuit board comprising:
an assembly area for installation of the elements;
a labeling area for marking of the circuit board;
wherein a paint layer is coated on a surface of the labeling area, a two-dimensional code is printed on the paint layer.
5 . The camera module of claim 4 , wherein the two-dimensional code is printed on the paint layer by laser.
6 . The camera module of claim 5 , wherein the paint layer is white paint.
7 . The camera module of claim 5 , further comprising a connector, wherein the connector is fixed on the labeling area and is opposite to the paint layer.
8 . A method for labeling circuit board, comprising:
providing a circuit board, the circuit board comprising an assembly area and a labeling area connected to the assembly area.
painting a paint layer on the assembly area; and
printing a two-dimensional code on the paint layer.
9 . The method of claim 8 , wherein the two-dimensional code is printed on the paint layer by laser.
10 . The method of claim 8 , wherein the paint layer is white paint.