METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL ALLOYS
System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern.
1 . A method comprising:
printing a conductive pattern on a flexible substrate using metal alloy nanopowders, wherein the nanopowders are in the range of approximately 1 nanometers (nm) to approximately 20 nm in diameter; and
fusing the nanopowders on the flexible substrate at a temperature ranging from approximately 150 degrees Celsius (C) to 300 degrees C. in a fuser.
2 . The method of claim 1 , wherein the nanopowders are in the range of approximately 2 to approximately 10 nm in diameter.
3 . The method of claim 1 , wherein the fusing of the nanopowders on the flexible substrate occurs at a temperature ranging from approximately 200 degrees C. to approximately 250 degrees C. without the use of any of the group consisting of the following: surface modifiers, organic surfactants, and surface treating agents.
4 . The method of claim 1 , wherein the conductive pattern forms a plurality of metal circuits.
5 . The method of claim 1 , wherein the nanopowders are from the group consisting of copper (Cu), silver (Ag), tin (Sn), nickel (Ni), gold (Au) and their alloys.
6 . The method of claim 1 , further comprising: forming the nanopowder in a flame spray reactor.
7 . The method of claim 1 , wherein the nanopowders are applied to the substrate using an aerosol stream.
8 . The method of claim 1 , wherein the conductive patterns are received as a computer aided design (CAD) file.
9 . The method of claim 1 , wherein the printing of the conductive patterns will use a photoreceptor drum.
10 . The method of claim 1 , wherein the printing of the conductive patterns will use at least one printhead receiving the nanopowder from a cartridge.
11 . The method of claim 10 , wherein the nanopowders are surrounded by a sheath gas in a nozzle attached to the printhead while transporting to the flexible substrate.
12 . The method of claim 1 , wherein the nanopowders are supplied from an aerosol reactor.
13 . A method of forming conductive patterns in a printer comprising:
forming metal nanopowder using a flame spray reactor;
inputting the nanopowder into an aerosol dispenser;
depositing metallic patterns using the nanopowder on a flexible substrate; and
fusing the nanopowder to the substrate in a temperature range of approximately 150 degrees Celsius (C) to 300 degrees C.
14 . The method of claim 13 , wherein the fusing of the nanopowder on the flexible substrate occurs at a temperature ranging from approximately 200 degrees C. to approximately 250 degrees C.
15 . A method comprising:
inputting a conductive pattern into a printer;
placing a positive charge on a nanopowder and a photoreceptor drum substantially uniformly by a corona discharge process;
activating a laser beam and drawing the conductive pattern on the photoreceptor drum using a mirror assembly and creating a negatively charged pattern of the conductive pattern;
sprinkling positively charged nanopowder using a roller on the photoreceptor drum enabling sticking of positively charged nanopowder to the negatively charged pattern on the photoreceptor drum;
charging a substrate using a second corona discharge and feeding the substrate near the photoreceptor drum so that the nanopowder on the photoreceptor drum is transferred to the substrate; and
feeding the substrate through a hot roller to fuse the nanopowder on the substrate by heat and pressure applied by the hot roller.
16 . The method of claim 15 , wherein the substrate is a printed circuit board.
17 . The method of claim 15 , wherein the substrate is a flexible substrate.
18 . The method of claim 15 , wherein the fuse step occurs at a temperature ranging from approximately 200 degrees C. to approximately 250 degrees C.
19 . The method of claim 15 , wherein the nanopowder is in the range of approximately 2 to approximately 10 nm in diameter.
20 . The method of claim 15 , wherein the nanopowder is supplied from an aerosol reactor.