IP Library Granted Patent US 10,635,320
Granted Patent B2
US 10,635,320 · App. 16/171,958 · Granted Apr 28, 2020

Integrator for a storage device, corresponding storage device and method of manufacturing the same

Inventors: Haifang Zhai (Shanghai, CN); Hendry Wu (Shanghai, CN); David Dong (Shanghai, CN); Yujie Zhou (Shanghai, CN)
Assignee: EMC IP Holding Company LLC
G06F3/061G06F3/0655G06F3/0679G06F13/4022G06F13/4221G06F13/4234G06F2213/0008G06F2213/0026G06F2213/0028
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Quick Facts
Patent No.
US 10,635,320
App. No.
16/171,958
Granted
Apr 28, 2020
Kind
B2
Abstract

The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.

Claims (37)

1. An integrator for a storage device, comprising:

a base board comprising a first interface and a second interface;

one or more connectors coupled to the first interface of the base board, the one or more connectors being connectable with a set of multiple servers in the storage device;

one or more input/output (I/O) parts coupled to the second interface of the base board and connectable with first and second I/O devices of different types; and

a switcher arranged on the base board and adapted to exchange data between the first and second interfaces to support data transmission of the first and second I/O devices with the set of multiple servers via the integrator;

wherein the integrator is deployed in a separate integrator chassis relative to the set of multiple servers and the first and second I/O devices, the set of multiple servers and the first and second I/O devices thereby being deployed external to the integrator chassis.

2. The integrator of claim 1 , wherein the one or more connectors are compliant with Peripheral Component Interconnect Express (PCIe) protocol.

3. The integrator of claim 2 , wherein the one or more input/output (I/O) parts are compliant with at least one of the following protocols: PCIe protocol, Ethernet protocol, Serial SCSI (SAS) protocol, Fiber Channel (FC) protocol, Infiniband (IB) protocol, small input/output card (SLIC) protocol and non-volatile memory express (NVME) protocol.

4. The integrator of claim 1 , wherein the switcher comprises a plurality of PCIe switch chips.

5. The integrator of claim 4 , wherein the data is exchanged between the PCIe switch chips via a non-transparent bridge (NTB).

6. The integrator of claim 1 , further comprising a heat radiator ( 107 ) for dissipating heat for the integrator.

7. The integrator of claim 1 , further comprising a power supply module coupled to the base board for powering the integrator.

8. A storage device, comprising:

a set of multiple servers;

first and second I/O devices of different types; and an integrator comprising:

a base board comprising a first interface and a second interface;

one or more connectors coupled to the first interface of the base board, the one or more connectors being connectable with the set of multiple servers in the storage device;

one or more input/output (I/O) parts coupled to the second interface of the base board and connectable with the first and second I/O devices; and

a switcher arranged on the base board and adapted to exchange data between the first and second interfaces to support data transmission of the first and second I/O devices with the set of multiple servers via the integrator;

wherein the integrator is deployed in a separate integrator chassis relative to the set of multiple servers and the first and second I/O devices, the set of multiple servers and the first and second I/O devices thereby being deployed external to the integrator chassis.

9. A method for manufacturing an integrator for a storage device, comprising:

providing a base board comprising a first interface and a second interface;

coupling one or more connectors to the first interface of the base board, the one or more connectors being connectable with a set of multiple servers in the storage device;

coupling one or more input/output (I/O) parts to the second interface of the base board, the one or more input/output (I/O) parts (being connectable with first and second I/O devices of different types; and

arranging a switcher on the base board, the switcher being adapted to exchange data between the first and second interfaces to support data transmission of the first and second I/O devices with the set of multiple servers via the integrator;

wherein the integrator is deployed in a separate integrator chassis relative to the set of multiple servers and the first and second I/O devices, the set of multiple servers and the first and second I/O devices thereby being deployed external to the integrator chassis.

10. The integrator of claim 1 , wherein at least one of the first and second I/O devices comprises at least one of a storage array enclosure and a non-volatile memory cluster.

11. The integrator of claim 1 , wherein the one or more connectors comprise one or more removable connectors.

12. The integrator of claim 1 , wherein the one or more connectors are connectable with the set of multiple servers by wire or wirelessly.

13. The integrator of claim 1 , wherein the one or more connectors comprise a plurality of connectors and the one or more input/output (I/O) parts comprise a plurality of input/output (I/O) parts.

14. The storage device of claim 8 , wherein at least one of the first and second I/O devices comprises at least one of a storage array enclosure and a non-volatile memory cluster.

15. The storage device of claim 8 , wherein the one or more connectors comprise one or more removable connectors.

16. The storage device of claim 8 , wherein the one or more connectors are connectable with the set of multiple servers by wire or wirelessly.

17. The storage device of claim 8 , wherein the one or more connectors comprise a plurality of connectors and the one or more input/output (I/O) parts comprise a plurality of input/output (I/O) parts.

18. The method of claim 9 , wherein at least one of the first and second I/O devices comprises at least one of a storage array enclosure and a non-volatile memory cluster.

19. The method of claim 9 , wherein the one or more connectors comprise one or more removable connectors.

20. The method of claim 9 , wherein the one or more connectors comprise a plurality of connectors and the one or more input/output (I/O) parts comprise a plurality of input/output (I/O) parts.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2018
From: ZHAI, HAIFANG; WU, HENDRY; DONG, DAVID; ZHOU, YUJIE
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 047485/0160 →
Priority Claims (1)
CN 2017 1 1023143 · Oct 27, 2017 · national
Continuity (1)
Related Publication 20190171358A1 · Jun 6, 2019