IP Library Granted Patent US 10,585,252
Granted Patent B2
US 10,585,252 · App. 16/175,569 · Granted Mar 10, 2020

Screwless heat sink attachment

Inventors: William H. Wang (Pleasanton, CA); Joshua John Edward Moore (Ontario, CA)
Assignee: Finisar Corporation
G02B6/4269H01L23/4093H01L23/4006H01L2023/405H01L2023/4062
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Quick Facts
Patent No.
US 10,585,252
App. No.
16/175,569
Granted
Mar 10, 2020
Kind
B2
Abstract

An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing.

Claims (37)

1. A cantilever retention clip to removably secure a heat sink to an optoelectronic module, the cantilever retention clip comprising:

one or more cross springs configured to be received between a pair of fins of the heat sink, each of the one or more cross springs having a front end and a rear end opposite the front end;

a first projection that extends downward from the front end of the one or more cross springs and that is configured to be positioned proximate to a fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the cantilever retention clip, the first projection coupling the cantilever retention clip to the optoelectronic module; and

a second projection that extends downward from the rear end of the one or more cross springs and that is configured to be positioned proximate to a rear side of the optoelectronic module opposite the fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the cantilever retention clip, the second projection not coupling the cantilever retention clip to the optoelectronic module;

wherein at least one of the first projection or the second projection is configured to selectively engage the optoelectronic module to removably secure the heat sink to the optoelectronic module.

2. The cantilever retention clip of claim 1 , wherein the first projection comprises a collar configured to receive a neck of the optoelectronic module and wherein the second projection comprises a lip configured to extend below a bottom surface of the heat sink when the heat sink is removably secured to the optoelectronic module by the cantilever retention clip.

3. The cantilever retention clip of claim 1 , wherein the one or more cross springs comprise a plurality of cross springs, each of the plurality of cross springs configured to be received between a different pair of fins of the heat sink.

4. The cantilever retention clip of claim 1 , wherein the first projection comprises two front legs that each includes a foot that extends rearward from a bottom of the corresponding front leg and wherein the second projection comprises at least one rear leg.

5. An optoelectronic system, comprising:

an optoelectronic module;

a heat sink comprising a plurality of fins; and

retention clip that removably secures the heat sink to the optoelectronic module, the retention clip comprising:

two cross springs, each positioned between a different pair of fins of the heat sink;

two front legs that extend downward from a front of the two cross springs proximate a fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module, each of the two front legs including a foot that extends rearward; and

at least one rear leg that extends downward from a rear of the two cross springs proximate to a rear side of the optoelectronic module opposite the fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the retention clip.

6. The optoelectronic system of claim 5 , wherein:

the fiber side of the optoelectronic module includes a receptacle with a plug received therein, the plug terminating an optical fiber;

the two front legs are separated by a gap;

at least a portion of the plug is positioned within the gap;

a first one of the two front legs is laterally positioned to a first side of the plug; and

a second one of the two front legs is laterally positioned to a second side of the plug, the second side opposite the first side.

7. The optoelectronic system of claim 5 , wherein the at least one rear leg comprises two rear legs that each includes a foot that extends frontward.

8. The optoelectronic system of claim 7 , wherein the foot of each of the front and rear legs is configured to engage a bottom surface of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the retention clip.

9. The optoelectronic system of claim 8 , further comprising a front tab that extends upward from the front legs and a rear tab that extends upward from the rear legs, wherein a distance between the feet of the front legs and the feet of the rear legs is configured to increase in response to the front and rear tabs being squeezed toward each other.

10. The optoelectronic system of claim 5 , wherein the at least one rear leg comprises a single rear leg, the retention clip further comprising a lever coupled to the single rear leg.

11. The optoelectronic system of claim 5 , wherein a minimum translation distance in an optical fiber plugging direction to removably secure the heat sink to the optoelectronic module using the retention clip is zero.

12. The optoelectronic system of claim 5 , wherein when the heat sink is removably secured to the optoelectronic module by the retention clip, the cross springs urge the heat sink downward against the optoelectronic module.

13. The optoelectronic system of claim 5 , wherein each of the two front legs is configured to flex forwardly and each of the at least one rear leg is configured to flex rearwardly in response to installation of the retention clip on the optoelectronic module.

14. The optoelectronic system of claim 5 , wherein an uninstalled lengthwise distance between a portion of the two front legs and a portion of the at least one rear leg is less than a length of the optoelectronic module and wherein the two front legs and the at least one rear leg are configured to flex outwardly in response to installation of the retention clip on the optoelectronic module.

15. The optoelectronic system of claim 5 , wherein each of the two cross springs is substantially u-shaped when viewed from the side and is configured to flex and partially flatten in response to installation of the retention clip on the optoelectronic module.

16. A cantilever retention clip to removably secure a heat sink to an optoelectronic module, the cantilever retention clip comprising:

one or more cross springs, each of the one or more cross springs configured to be received between a different pair of fins of the heat sink;

a lip that extends downward from a first end of the one or more cross springs and with a bottom edge configured to extend below a bottom surface of the heat sink when the heat sink is removably secured to the optoelectronic module using the cantilever retention clip; and

a collar that extends downward from a second end of the one or more cross springs that is opposite the first end, wherein the collar is configured to receive therein a neck of the optoelectronic module that defines a receptacle to receive therein an optical fiber plug.

17. The cantilever retention clip of claim 16 , wherein the neck of the optoelectronic module extends in an optical fiber plugging direction away from a fiber side surface of the optoelectronic module and wherein an assembly envelope in an optical fiber plugging direction to removably secure the heat sink to the optoelectronic module using the cantilever retention clip is less than or equal to a distance that the neck extends away from the fiber side surface.

18. The cantilever retention clip of claim 16 , wherein when the heat sink is removably secured to the optoelectronic module by the cantilever retention clip, the cross springs are configured to urge the heat sink downward against the optoelectronic module.

19. The cantilever retention clip of claim 18 , wherein the cross springs are configured to flex when the cantilever retention clip is installed on the optoelectronic module and to remain at least partially flexed when the heat sink is removably secured to the optoelectronic module by the retention clip to urge the heat sink against the optoelectronic module.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2018
From: WANG, WILLIAM H.; MOORE, JOSHUA JOHN EDWARD
To: FINISAR CORPORATION
Reel/Frame 047361/0372 →
Continuity (3)
Continuation 15224384 · Jul 29, 2016
Provisional Application 62199590 · Jul 31, 2015
Related Publication 20190121039A1 · Apr 25, 2019