Through substrate via (TSV) and method therefor
A through substrate via (TSV) and method of forming the same are provided. The method of making the TSV may include etching a via opening into the backside of semiconductor substrate, the via opening exposing a surface of a metal landing structure. A conductive layer is deposited over the backside of semiconductor substrate, sidewalls of the via opening, and exposed surface of the metal landing structure. The conductive layer is coated with a polymer material, filling the via opening. The polymer material is developed to remove the polymer material from the backside of semiconductor substrate, leaving the via opening filled with undeveloped polymer material. A planar backside surface of semiconductor substrate is formed by removing the conductive layer.
1. A semiconductor device, comprising:
a semiconductor substrate having an active side and a backside;
a metal landing structure embedded in the active side;
a via opening formed in the backside of the semiconductor substrate, the via opening exposing a surface of the metal landing structure;
a conductive layer formed over the sidewalls of the via opening and exposed surface of the metal landing structure; and
a photoresist polymer material disposed within the via opening, the photoresist polymer unexposed to ultraviolet (UV) light and undeveloped, a surface of the photoresist polymer in the same plane as a surface of the backside of the semiconductor substrate.
2. The semiconductor device of claim 1 , wherein the via opening is characterized as a high aspect ratio via opening having a depth-to-diameter ratio of substantially 8:1 or greater.
3. The semiconductor device of claim 1 , wherein the conductive layer comprises a copper (Cu) material.
4. The semiconductor device of claim 1 , wherein the photoresist polymer material is characterized as hard-baked positive tone photoresist polymer material.
5. The semiconductor device of claim 1 , further comprising a barrier layer disposed between the semiconductor substrate and the conductive layer.
6. The semiconductor device of claim 2 , wherein the barrier layer includes nickel boron (NiB) material.
7. The semiconductor device of claim 1 , wherein the metal landing structure comprises a copper (Cu) or aluminum (Al) material.
8. The semiconductor device of claim 1 , wherein the backside of the semiconductor substrate is formed as a planar backside surface by removing a portion of the conductive layer using a chemical-mechanical planarization (CMP) process.
9. A semiconductor device, comprising:
a semiconductor substrate having an active side and a backside;
a metal landing structure embedded in the active side;
a via opening formed in the backside of the semiconductor substrate, the via opening exposing a surface of the metal landing structure;
a conductive layer formed over the sidewalls of the via opening and exposed surface of the metal landing structure; and
a cross-linked photoresist polymer material disposed within the via opening, the photoresist polymer unexposed to ultraviolet (UV) light and undeveloped, a surface of the photoresist polymer in the same plane as a surface of the backside of the semiconductor substrate.
10. The semiconductor device of claim 9 , wherein the cross-linked photoresist polymer material is characterized as hard-baked positive tone photoresist polymer material.
11. The semiconductor device of claim 9 , further comprising a barrier layer disposed between the semiconductor substrate and the conductive layer.
12. The semiconductor device of claim 11 , wherein the barrier layer includes nickel boron (NiB) material.
13. The semiconductor device of claim 11 , wherein the conductive layer comprises electroplated copper (Cu) formed on the barrier layer.
14. The semiconductor device of claim 9 , wherein the metal landing structure comprises a copper (Cu) or aluminum (Al) material.
15. The semiconductor device of claim 9 , wherein the backside of the semiconductor substrate is formed as a planar backside surface by way of removing a portion of the conductive layer using a chemical-mechanical planarization (CMP) process.
16. The semiconductor device of claim 9 , wherein the via opening is characterized as a high aspect ratio via opening having a depth-to-diameter ratio of substantially 8:1 or greater.
17. A semiconductor device, comprising:
a semiconductor substrate having an active side and a backside, the backside having a planar surface;
a metal landing structure embedded in the active side;
a via opening formed in the backside of the semiconductor substrate, the via opening exposing a surface of the metal landing structure;
a conductive layer formed over the sidewalls of the via opening and exposed surface of the metal landing structure; and
a hard-baked photoresist polymer material disposed within the via opening, the photoresist polymer unexposed to ultraviolet (UV) light and undeveloped, a surface of the photoresist polymer in the same plane as the planar surface of the backside of the semiconductor substrate.
18. The semiconductor device of claim 17 , wherein the metal landing structure comprises a copper (Cu) or aluminum (Al) material.
19. The semiconductor device of claim 17 , further comprising a barrier layer disposed between the semiconductor substrate and the conductive layer.
20. The semiconductor device of claim 19 , wherein the conductive layer comprises electroplated copper (Cu) formed on the barrier layer.