Communication module packaging
A communication module may include a communication ground layer. The communication module may also include a circuit board. The circuit board may be located proximate the communication ground layer. The circuit board may include a stitch layer. The stitch layer may be electrically coupled to the communication ground layer via a plurality of stitch layer vias. Additionally, the communication module may include multiple ground vias. The ground vias may be electrically coupled to a portion of the circuit board and to the communication ground layer.
1. A communication module comprising:
a communication ground layer;
a circuit board located proximate the communication ground layer, the circuit board including:
a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias; and
two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer;
a plurality of ground vias electrically coupled to a portion of the circuit board and to the communication ground layer;
an enclosure within which at least some components of the communication module are positioned; and
one or more enclosure vias that electrically couple the stitch layer to the enclosure.
2. The communication module of claim 1 , the communication module further comprising an integrated circuit (IC) ground electrically coupled to the communication ground layer via a plurality of IC ground vias, the IC ground including an extended IC ground portion that extends beyond the first edge of the circuit board and is electrically coupled to a portion of the circuit board and the communication ground layer via a plurality of extended IC ground vias.
3. The communication module of claim 2 , the communication module further comprising an IC electrically coupled to the IC ground and located proximate the communication ground layer and adjacent the first edge of the circuit board.
4. The communication module of claim 3 , the extended IC ground portion configured to reduce signal interference discontinuity by reducing impedance mismatch between the IC and the circuit board.
5. The communication module of claim 3 , the communication module further comprising:
a plurality of signal wire bonds that electrically couple the IC to the plurality of circuit board signal traces; and
a plurality of ground wire bonds that electrically couple the IC to the circuit board,
wherein the circuit board further includes a plurality of circuit board ground traces electrically coupled to the communication ground layer via the plurality of ground vias and electrically coupled to the IC via the plurality of ground wire bonds.
6. The communication module of claim 5 , the stitch layer configured to enhance signal integrity by enhancing isolation of the circuit board signal traces.
7. The communication module of claim 5 , the circuit board further comprising a plurality of capacitors, wherein each capacitor is electrically coupled in series to a circuit board signal trace.
8. The communication module of claim 5 , wherein a sequence of traces of the circuit board comprises a ground trace, a signal trace, a ground trace, a signal trace, and a ground trace.
9. The communication module of claim 8 , wherein the sequence of traces of the circuit board comprises a first circuit board ground trace, a first circuit board signal trace, the stitch layer, a second circuit board signal trace, and a second circuit board ground trace.
10. The communication module of claim 1 , wherein a portion of the circuit board is located within the enclosure, the enclosure configured to provide electromagnetic interference shielding of the portion of the circuit board.
11. An electrical signal module comprising a plurality of the communication module of claim 5 .
12. A communication module comprising:
a communication ground layer;
a circuit board located proximate the communication ground layer, the circuit board including:
a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias; and
two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer;
an IC ground that includes a first portion electrically coupled to the communication ground layer via a plurality of IC ground vias, the IC ground further including an extended IC ground portion that extends continuously from and coplanar with the first portion beyond a first edge of the circuit board, wherein the extended IC ground portion is electrically coupled to a portion of the circuit board and the communication ground layer via a plurality of extended IC ground vias; and
a plurality of ground vias electrically coupled to a portion of the circuit board and to the communication ground layer.
13. The communication module of claim 12 , further comprising:
an enclosure within which at least some components of the communication module are positioned; and
one or more enclosure vias that electrically couple the stitch layer to the enclosure.
14. The communication module of claim 13 , the communication module further comprising:
a plurality of signal electrical connectors that electrically couple the IC to the circuit board, the two circuit board signal traces electrically coupled to the IC via the plurality of signal electrical connectors; and
a plurality of ground electrical connecters that electrically couple the IC to the circuit board,
the circuit board further including a plurality of circuit board ground traces electrically coupled to the communication ground layer via the plurality of ground vias and electrically coupled to the IC via the plurality of ground electrical connectors.
15. The communication module of claim 14 , the circuit board further comprising a plurality of capacitors, wherein each capacitor is electrically coupled in series to a circuit board signal trace and wherein at least a portion of the circuit board is located within an enclosure, the enclosure configured to provide electromagnetic interference shielding of the IC and the at least the portion of the circuit board.
16. A communication module comprising:
a communication ground layer;
a plurality of signal wire bonds, a plurality of ground wire bonds, and a plurality of ground vias;
an IC located proximate the communication ground layer and electrically coupled to a circuit board via the plurality of signal wire bonds and the plurality of ground wire bonds;
the circuit board located proximate the communication ground layer and the IC, the circuit board including:
a plurality of circuit board signal traces, wherein each circuit board signal trace of the plurality of circuit board signal traces is electrically coupled to the IC via a corresponding signal wire bond of the plurality of signal wire bonds;
a plurality of circuit board ground traces electrically coupled to the communication ground layer via the plurality of ground vias, wherein each circuit board ground trace of the plurality of circuit board ground traces is electrically coupled to the IC via a corresponding ground wire bond of the plurality of ground wire bonds and wherein each circuit board ground trace is spaced apart from and extends lengthwise along an entire length of a corresponding one of the plurality of circuit board signal traces; and
a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias, wherein the plurality of circuit board signal traces includes two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer and beyond terminal ends of the stitch layer; and
an IC ground located proximate the IC, the IC ground electrically coupled to the IC, the IC ground including a first portion electrically coupled to the communication ground layer via a plurality of IC ground vias, the IC ground further including an extended IC ground portion that extends continuously from and coplanar with the first portion beyond a first edge of the circuit board, wherein the extended IC ground portion is electrically coupled to the circuit board ground traces and the communication ground layer via a plurality of extended IC ground vias.
17. The communication module of claim 16 , wherein a sequence of traces of the circuit board comprises a first circuit board ground trace, a first circuit board signal trace, the stitch layer, a second circuit board signal trace, and a second circuit board ground trace.
18. The communication module of claim 16 , wherein a portion of the circuit board is located within an enclosure, the enclosure configured to provide electromagnetic interference shielding of the portion of the circuit board.
19. The communication module of claim 16 , the circuit board further comprising a plurality of capacitors, wherein each capacitor is electrically coupled in series to a corresponding circuit board signal trace of the plurality of circuit board signal traces.
20. An electrical signal module comprising a plurality of the communication module of claim 16 .