Method of applying conductive adhesive and manufacturing device using the same

1. An applying method, comprises:

providing a conductive adhesive comprising a plurality of conductive particles and an insulating binder;

providing a carrier plate;

forming a patterned adhesive on the carrier plate by the conductive adhesive, wherein the patterned adhesive comprises a first transferring portion;

providing a manufacturing device comprising a needle;

moving the needle to contact the first transferring portion; and

transferring, by the manufacturing device, the first transferring portion to a board.

2. The applying method according to claim 1 , further comprises:

providing a screen plate having an opening, wherein the opening has an opening pattern with a shape which is the same as that of the patterned adhesive.

3. The applying method according to claim 1 , wherein the patterned adhesive comprises a second transferring portion adjacent to the first transferring portion.

4. The applying method according to claim 3 , wherein the first transferring portion comprises a first neck portion, and the second transferring portion comprises a second neck portion which connects to the first neck portion.

5. The applying method according to claim 3 , further comprising a connection portion, wherein the first transferring portion connects with the second transferring portion in the connection portion.

6. The applying method according to claim 5 , wherein the first transferring portion comprises a first edge and a second edge, and a distance between the first edge and the second edge gets smaller toward the connection portion.

7. The applying method according to claim 3 , wherein the first transferring portion has an amount which is the same as that of the second transferring portion.

8. The applying method according to claim 1 , wherein the patterned adhesive is configured to be provided in a linear arrangement.

9. The applying method according to claim 1 , wherein the manufacturing device comprises a plate and a capturing component disposed on the plate, wherein the capturing component comprises the needle, a base, elastic portion and a scraping portion.

10. The applying method according to claim 9 , wherein the needle is fixed to the base, and the elastic portion is disposed between the scraping portion and the base.

11. The applying method according to claim 9 , wherein in step of moving the needle to contact the first transferring portion further comprises:

driving the plate to move, such that the needle is corresponding to the first transferring portion; and

driving the plate to move, such that the needle contacts the first transferring portion.

12. The applying method according to claim 9 , wherein the board comprises a pad, and in step of transferring, by the manufacturing device, the first transferring portion to the board comprises:

driving the manufacturing device to be located above the board, such that first transferring portion captured by the capturing component is corresponding to the pad; and

pushing the scraping portion move downward, such that the scraping portion scrapes the first transferring portion from the needle.

13. An applying method, comprises:

providing a carrier plate;

forming a patterned adhesive on the carrier plate, wherein the patterned adhesive comprises a conductive adhesive, and has a first transferring portion and a second transferring portion;

providing a manufacturing device comprising a first needle and a second needle;

moving the first needle to contact the first transferring portion and the second needle to contact the second transferring portion; and

transferring the first transferring portion and the second transferring portion to a board.

14. The applying method according to claim 13 , wherein the conductive adhesive comprises a plurality of conductive particles and an adhesive insulating binder.

15. The applying method according to claim 14 , further comprising heating the first transferring portion and the second transferring portion to melt the plurality of conductive particles and to cure the insulating binder.