LDMOS device having hot carrier suppression
A first diffusion region of a first conductivity type and a second diffusion region of a second conductivity type are formed next to each other in a semiconductor substrate. Drain and source contact regions of the first conductivity type are formed in the first and second diffusion region, respectively. A trench insulating region is formed in the first diffusion region between the drain and source contact regions. A third diffusion region of the second conductivity type is formed next to a side wall of the trench insulating region on the source contact region side in the first diffusion region between the source contact region and the trench insulating region. A gate electrode is formed on the semiconductor substrate through a gate insulating film to cover an area from an end portion of the source contact region to at least a part of a top surface of the trench insulating region.
1. A semiconductor device, comprising:
a semiconductor substrate;
a first diffusion region of a first conductivity type and a second diffusion region of a second conductivity type in contact with each other in the semiconductor substrate;
a drain contact region of the first conductivity type in the first diffusion region;
a source contact region of the first conductivity type in the second diffusion region;
a trench insulating region in the first diffusion region between the drain contact region and the source contact region;
a third diffusion region of the second conductivity type extending along a side wall of the trench insulating region on a source contact region side in the first diffusion region between the source contact region and the trench insulating region; and
a gate electrode overlying a gate insulating film on the semiconductor substrate, the gate electrode covering an area from an end portion of the source contact region to at least a part of a top surface of the trench insulating region,
wherein the third diffusion region continuously covers an entirety of the side wall of the trench insulating region on the source contact region side and at least a part of a bottom surface of the trench insulating region.
2. The semiconductor device according to claim 1 , further comprising an embedded layer of the second conductivity type below the first diffusion region and the second diffusion region in the semiconductor substrate and spaced away from the first diffusion region and the second diffusion region.
3. The semiconductor device according to claim 1 , further comprising a fourth diffusion region of the first conductivity type below and in contact with the drain contact region and extending below the trench isolation region and having an impurity concentration higher than an impurity concentration of the first diffusion region and lower than an impurity concentration of the drain contact region.
4. A semiconductor device, comprising
a semiconductor substrate;
a first diffusion region of a first conductivity type and a second diffusion region of a second conductivity type in direct contact with each other in the semiconductor substrate;
a drain contact region of the first conductivity type in the first diffusion region;
a source contact region of the first conductivity type in the second diffusion region;
a trench insulating region in the first diffusion region between the drain contact region and the source contact region;
a third diffusion region of the second conductivity type contacting a side wall of the trench insulating region on a source contact region side in the first diffusion region between the source contact region and the trench insulating region; and
a gate electrode overlying a gate insulating film on the semiconductor substrate, the gate electrode covering an area from an end portion of the source contact region to at least a part of a top surface of the trench insulating region, and
further comprising an embedded layer of the second conductivity type below the first diffusion region and the second diffusion region in the semiconductor substrate and spaced away from the first diffusion region and the second diffusion region.
5. The semiconductor device according to claim 4 , further comprising a fourth diffusion region of the first conductivity type below and in contact with the drain contact region and extending below the trench isolation region and having an impurity concentration higher than an impurity concentration of the first diffusion region and lower than an impurity concentration of the drain contact region.
6. The semiconductor device according to claim 4 , wherein a part of the first diffusion region resides between the third diffusion region and the trench insulating region and separates the third diffusion region from the side wall of the trench insulating region.
7. The semiconductor device according to claim 6 , further comprising a fourth diffusion region of the first conductivity type below and in contact with the drain contact region and extending below the trench isolation region and having an impurity concentration higher than an impurity concentration of the first diffusion region and lower than an impurity concentration of the drain contact region.
8. A semiconductor device, comprising:
a semiconductor substrate;
a first diffusion region of a first conductivity type and a second diffusion region of a second conductivity type in direct contact with each other in the semiconductor substrate;
a drain contact region of the first conductivity type in the first diffusion region;
a source contact region of the first conductivity type in the second diffusion region;
a trench insulating region in the first diffusion region between the drain contact region and the source contact region;
a third diffusion region of the second conductivity type contacting a side wall of the trench insulating region on a source contact region side in the first diffusion region between the source contact region and the trench insulating region; and
a gate electrode overlying a gate insulating film on the semiconductor substrate, the gate electrode covering an area from an end portion of the source contact region to at least a part of a top surface of the trench insulating region,
wherein the third diffusion region covers at least a part of the side wall of the trench insulating region on the source contact region side including an upper end portion of the side wall of the trench insulating region, and
further comprising an embedded layer of the second conductivity type below the first diffusion region and the second diffusion region in the semiconductor substrate and spaced away from the first diffusion region and the second diffusion region.
9. The semiconductor device according to claim 8 , further comprising a fourth diffusion region of the first conductivity type below and in contact with the drain contact region and extending below the trench isolation region and having an impurity concentration higher than an impurity concentration of the first diffusion region and lower than an impurity concentration of the drain contact region.