Integrated transceiver with lightpipe coupler
A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.
1. A communication system comprising:
a transceiver comprising a CMOS chip and a semiconductor laser bonded to said CMOS chip;
wherein said semiconductor laser communicates an optical source signal into said CMOS chip, said optical source signal for generating first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from optical fibers and converted to electrical signals for use by said CMOS chip.
2. The communication system according to claim 1 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
3. The communication system according to claim 1 , wherein said CMOS chip comprises optical devices, and said optoelectronic devices comprise modulators and optical switches.
4. The communication system according to claim 1 , wherein said transceiver is operable to convert said second optical signals to electrical signals utilizing one or more photodetectors of said CMOS chip.
5. The communication system according to claim 4 , wherein said one or more photodetectors are integrated in said CMOS chip.
6. The communication system according to claim 4 , wherein said one or more photodetectors are mounted on said CMOS chip.
7. The communication system according to claim 1 , wherein said semiconductor laser is an edge-emitting laser.
8. The communication system according to claim 1 , wherein said semiconductor laser comprises a III-V semiconductor.
9. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signal into a top surface of said CMOS chip.
10. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals out of a top surface of said CMOS chip.
11. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signal into said CMOS chip via one or more optical couplers.
12. The communication system according to claim 1 , wherein said one or more optical couplers comprise grating couplers.
13. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals from said CMOS chip via one or more optical couplers.
14. The communication system according to claim 13 , wherein said one or more optical couplers comprise grating couplers.
15. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a semiconductor laser bonded to said CMOS chip:
communicating an optical source signal from said semiconductor laser into said CMOS chip;
generating using said optical source signal, first optical signals;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip;
receiving second optical signals from optical fibers; and
converting said second optical signals to electrical signals for use by said CMOS chip.
16. The method according to claim 15 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
17. The method according to claim 15 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators and optical switches.
18. The method according to claim 15 , comprising converting said second optical signals to electrical signals via one or more photodetectors.
19. The method according to claim 15 , wherein said one or more photodetectors are integrated in said CMOS chip.
20. The method according to claim 15 , wherein said one or more photodetectors are mounted on said CMOS chip.
21. The method according to claim 15 , wherein said semiconductor laser is an edge-emitting laser.
22. The method according to claim 15 , wherein said semiconductor laser comprises a III-V semiconductor.
23. The method according to claim 15 , comprising communicating said optical source signal into a top surface of said CMOS chip.
24. The method according to claim 15 , comprising communicating said first optical signals out of a top surface of said CMOS chip.
25. The method according to claim 15 , comprising communicating said optical source signal into said CMOS chip via one or more optical couplers.
26. The method according to claim 25 , wherein said one or more optical couplers comprise grating couplers.
27. The method according to claim 15 , comprising communicating said first optical signals from said CMOS chip via one or more optical couplers.
28. The method according to claim 15 , wherein said one or more optical couplers comprise grating couplers.
29. A communication system comprising a CMOS chip, and a semiconductor laser bonded to said CMOS chip;
wherein said semiconductor laser communicates an optical source signal into said CMOS chip, said optical source signal for generation of first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from said optical fibers and converted to electrical signals for use by said CMOS chip.
30. The system of claim 29 , wherein said first optical signals are communicated out of, and said optical source signal and said second optical signals are communicated into, a top surface of said CMOS chip.
31. The system according to claim 29 , wherein said CMOS chip is operable to convert said second optical signals to electrical signals via one or more photodetectors of said first CMOS chip.
32. The system according to claim 31 , wherein said one or more photodetectors are integrated in said CMOS chip.
33. The system according to claim 31 , wherein said one or more photodetectors are mounted on said CMOS chip.
34. The system according to claim 29 , wherein said semiconductor laser is operable to communicate said source optical signal into said CMOS chip via grating couplers integrated in said CMOS chip.
35. The system according to claim 29 , wherein said CMOS chip is operable to transmit said first optical signals from said CMOS chip via grating couplers integrated in said CMOS chip.
36. A system for two-way communication of optical signals comprising:
a CMOS chip and a semiconductor laser bonded thereto; wherein:
an optical source signal is communicated into said CMOS chip utilizing said semiconductor laser;
optical signals representative of electronic signals received from the electronic circuitry of said CMOS chip are communicated from said CMOS chip over one or more optical fibers coupled to a top surface of said CMOS chip; and
electronic signals representative of optical signals received over one or more optical fibers coupled to said top surface of said CMOS chip are communicated to electronic circuitry of said CMOS chip.
37. The communication system according to claim 36 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
38. The communication system according to claim 36 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators and optical switches.
39. The communication system according to claim 36 , wherein said CMOS chip is operable to generate said electronic signals representative of received optical signals utilizing one or more photodetectors.
40. The communication system according to claim 39 , wherein said one or more photodetectors are integrated in said CMOS chip.
41. The communication system according to claim 39 , wherein said one or more photodetectors are mounted on said CMOS chip.
42. The communication system according to claim 36 , wherein semiconductor laser is an edge-emitting laser.
43. The communication system according to claim 36 , wherein said semiconductor laser comprises a III-V semiconductor.
44. The communication system according to claim 36 , wherein said optical source signal is communicated into a top surface of said CMOS chip.
45. The communication system according to claim 36 , wherein said first optical signals are communicated out of a top surface of said CMOS chip.
46. The communication system according to claim 36 , wherein said optical source signal is communicated into said CMOS chip via one or more optical couplers.
47. The communication system according to claim 46 , wherein said one or more optical couplers comprise grating couplers.
48. The communication system according to claim 36 , wherein said first optical signals are communicated from said CMOS chip via one or more optical couplers.
49. The communication system according to claim 48 , wherein said one or more optical couplers comprise grating couplers.
50. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a semiconductor laser bonded to a surface of said CMOS chip:
communicating an optical source signal into said CMOS chip utilizing said semiconductor laser;
generating first optical signals in said CMOS chip based on said optical source signal;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip; and
receiving second optical signals from optical fibers and converting said second optical signals to electrical signals for use by said CMOS chip.
51. The method according to claim 50 , comprising communicating said optical source signal and receiving said second optical signals into, and transmitting said first optical signals out of, a top surface of said CMOS chip.
52. The method according to claim 50 , comprising converting said second optical signals to electrical signals utilizing one or more photodetectors.
53. The method according to claim 52 , wherein said one or more photodetectors are integrated in said CMOS chip.
54. The method according to claim 52 , wherein said one or more photodetectors are mounted on said CMOS chip.
55. The method according to claim 50 , wherein said CMOS chip comprises optical and electronic devices.
56. The method according to claim 50 , comprising communicating said optical source signal into said CMOS chip via grating couplers.
57. The method according to claim 50 , comprising transmitting said first optical signals from said CMOS chip via grating couplers.