IP Library Granted Patent US 10,757,836
Granted Patent B2
US 10,757,836 · App. 16/191,046 · Granted Aug 25, 2020

Solar/heat shield for pedestal housings used with active electronic devices and/or heat sensitive components

Inventors: Michael A. Lemacks (Temecula, CA); Timothy S. Safranek (Heath, TX); Edward J. Burke (Temecula, CA)
Assignee: CHANNELL COMMERCIAL CORPORATION
H05K7/20427H05K5/0213H05K5/03H05K7/20127H05K7/20418H05K9/003H05K9/0009H05K9/0032H05K9/0045H05K9/0084H05K9/0086
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Quick Facts
Patent No.
US 10,757,836
App. No.
16/191,046
Granted
Aug 25, 2020
Kind
B2
Abstract

A pedestal housing for heat reduction generated by electronic components within the pedestal housing having a cover in which the electronic components are located, a cap positioned on an upper surface of the cover for forming an attic above the cover, a support layer and an insulation layer positioned between the cover and the cap in the attic and a heat and solar barrier layer positioned within the attic for electromagnetic radiation reflection away from the electronic components and electromagnetic radiation absorption from a radiation source and the electronic components.

Claims (30)

1. A pedestal housing configured for heat reduction within the pedestal housing for electronic components contained within the pedestal housing comprising:

a cover having side walls and an integrally formed upper surface with the side walls, the upper surface enclosing the side walls;

a cap positioned on the upper surface of the cover forming an attic above the cover;

said cover and cap being subject to direct solar and radiant heat exposure;

a support layer and an insulation layer positioned between the cover and the cap,

the support layer having a plurality of legs which engage the upper surface of the cover to create an airgap between the support layer and the cover;

the cap having a plurality of legs, wherein each leg of the cap contacts an upper layer and the cap; and

a heat and solar barrier layer positioned within the attic.

2. The pedestal housing of claim 1 wherein the insulation layer is positioned on the support layer adjacent the cap.

3. The pedestal housing of claim 1 wherein the heat and solar barrier layer is positioned on the support layer.

4. The pedestal housing of claim 1 wherein the heat and solar barrier layer is co-molded with or applied to the support layer.

5. The pedestal housing of claim 1 wherein the heat and solar barrier layer is attached to the insulation layer.

6. The pedestal housing of claim 1 wherein the cover has at least one vent hole in an upper surface for ventilation.

7. The pedestal housing of claim 1 wherein the cover has a plurality of vents positioned around sides of the cover.

8. The pedestal housing of claim 6 wherein a fan is positioned in the vent hole.

9. The pedestal housing of claim 1 wherein the heat and solar barrier layer is a heat reflective material.

10. The pedestal housing of claim 1 wherein the heat and solar barrier layer is a heat absorption material.

11. The pedestal housing of claim 1 wherein the heat and solar barrier layer is an infrared reflective material comprising at least one of a transition metal, inorganic or organic material.

12. A pedestal housing for electronic components comprising:

a housing component for receipt of the electronic components;

the housing component having side walls and an integrally formed top portion with the side walls enclosing the electronic components within the pedestal housing;

an attic component positioned above the housing component having a plurality of legs that supports the attic component above the top portion of the housing component;

a support layer positioned between the attic component and the housing component having a plurality of legs that engage the top portion of the housing component and creates an airgap between the support layer and the top portion of the housing component;

wherein each leg of the attic component contacts an upper surface of one leg of the support layer to create an second airgap between the support layer and the attic component; and

a barrier layer positioned within the attic component for electromagnetic radiation reflection away from the electronic components or electromagnetic radiation absorption between a radiation source and the electronic components.

13. The pedestal housing of claim 12 further comprising an insulation layer in the attic component.

14. The pedestal housing of claim 13 wherein the barrier layer is positioned on the support layer.

15. The pedestal housing of claim 13 wherein the barrier layer and the support layer are co-molded.

16. The pedestal housing of claim 13 wherein the barrier layer is attached to the insulation layer.

17. The pedestal housing of claim 12 wherein the barrier layer is an infrared reflective material comprising at least one of a transition metal, inorganic or organic material.

Assignments (6)
TERMINATION AND RELEASE OF GRANT OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Jul 14, 2025
From: BANK OF AMERICA, N.A.
To: CHANNELL COMMERCIAL CORPORATION
Reel/Frame 071932/0940 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2025
From: BANK OF AMERICA, N.A.
To: CHANNELL COMMERCIAL CORPORATION
Reel/Frame 071383/0701 →
RELEASE OF SECURITY INTEREST Recorded Oct 29, 2024
From: BANK OF AMERICA, N.A.
To: CHANNELL COMMERICAL CORPORATION
Reel/Frame 069272/0116 →
SECURITY INTEREST Recorded Oct 23, 2024
From: CHANNELL COMMERCIAL CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 068985/0469 →
SECURITY INTEREST Recorded Apr 21, 2021
From: CHANNELL COMMERCIAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 055996/0806 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2018
From: LEMACKS, MICHAEL A.; SAFRANEK, TIMOTHY S.; BURKE, EDWARD J.
To: CHANNELL COMMERCIAL CORPORATION
Reel/Frame 047621/0666 →
Continuity (2)
Provisional Application 62594384 · Dec 4, 2017
Related Publication 20190174655A1 · Jun 6, 2019
Cited By (2)
US 12,603,485 US 12,663,603