Seed layer free nanoporous metal deposition for bonding
Embodiments relate to forming nanoporous contacts on a receiving substrate without using a seed layer on the receiving substrate. The nanoporous contacts can be used to create bonds between electronic components and the receiving substrate. To form the contacts, a photoresist mask is created on the receiving substrate by a photolithographic process. Through a sputtering process, portions of co-alloy on a depositing substrate are transferred to the receiving substrate with the photoresist mask. The photoresist mask is removed from the receiving substrate. The remaining co-alloy portions on the receiving substrate undergo a de-alloying process to form an array of nanoporous contacts.
1. A method, comprising:
depositing a co-alloy on a surface of a depositing substrate;
transferring part of the co-alloy from the depositing substrate onto at least a portion of a receiving body; and
de-alloying the transferred part of the co-alloy to form nanoporous metal contacts on the receiving body.
2. The method of claim 1 , further comprising:
applying a mask over a surface of the receiving body before transferring part of the co-alloy from the depositing substrate; and
removing the mask from the surface of the receiving body after transferring the part of the co-alloy.
3. The method of claim 1 , wherein transferring part of the co-alloy comprises causing sputtering of particles of the co-alloy from the depositing substrate onto the receiving body by exposing the co-alloy on the surface of the depositing substrate to an ion beam.
4. The method of claim 1 , further comprising:
aligning electrodes of one or more mounting bodies with the nanoporous metal contacts of the receiving body;
placing the one or more mounting bodies on the body; and
bonding the electrodes to the nanoporous metal contacts by pressing the electrodes onto the nanoporous metal contacts to form metallic contacts between the mounting bodies and the receiving body.
5. The method of claim 4 , wherein the receiving body comprises a substrate and the mounting bodies comprise electronic components.
6. The method of claim 4 , wherein a bonding temperature is not greater than 150° C.
7. The method of claim 2 , wherein applying the mask over the receiving body further comprises:
forming a photoresist on the receiving body;
applying a photolithographic mask over the photoresist to selectively cover the photoresist;
exposing portions of the photoresist to light that are not covered with the photolithographic mask to cure portions of the photoresist; and
removing the cured portions of the photoresist.
8. The method of claim 1 , further comprising:
applying a film of underfill to cover a surface of the receiving body and the nanoporous metal contacts after de-alloying the transferred portions;
etching portions of the underfill to expose the nanoporous metal contacts; and
pressing contacts of another body or an electronic component onto the nanoporous metal contacts to bond the other body or the electronic component to the receiving body.
9. The method of claim 1 , wherein the co-alloy includes copper (Cu) and zinc (Zn) or gold (Au) and silver (Ag).
10. The method of claim 1 , wherein the nanoporous metal contacts are formed on pre-formed metal contacts of the receiving body.
11. The method of claim 1 , further comprising removing portions of the transferred part of the co-alloy from the receiving body before de-alloying.
12. An assembly fabricated by a process comprising:
depositing a co-alloy on a surface of a depositing substrate;
transferring part of the co-alloy from the depositing substrate onto at least a portion of a receiving body; and
de-alloying the transferred part of the co-alloy to form nanoporous metal contacts on the receiving body.
13. The assembly of claim 12 , wherein the process further comprises:
applying a mask over a surface of the receiving body before transferring part of the co-alloy from the depositing substrate; and
removing the mask from the surface of the receiving body after transferring the part of the co-alloy.
14. The assembly of claim 12 , wherein transferring part of the co-alloy comprises causing sputtering of particles of the co-alloy from the depositing substrate onto the receiving body by exposing the co-alloy on the surface of the depositing substrate to an ion beam.
15. The assembly of claim 12 , wherein the process further comprises:
aligning electrodes of one or more mounting bodies with the nanoporous metal contacts of the receiving body;
placing the one or more mounting bodies on the body; and
bonding the electrodes to the nanoporous metal contacts by pressing the electrodes onto the nanoporous metal contacts to form metallic contacts between the mounting bodies and the receiving body.
16. The assembly of claim 15 , wherein the receiving body comprises a substrate and the mounting bodies comprise electronic components.
17. The assembly of claim 15 , wherein a bonding temperature is not greater than 150° C.
18. The assembly of claim 13 , wherein applying the mask further comprises:
forming a photoresist on the receiving body;
applying a photolithographic mask over the photoresist to selectively cover the photoresist;
exposing portions of the photoresist to light that are not covered with the photolithographic mask to cure portions of the photoresist; and
removing the cured portions of the photoresist.
19. The assembly of claim 12 , wherein the process further comprises:
applying a film of underfill to cover a surface of the receiving body and the nanoporous metal contacts after de-alloying the transferred portions;
etching portions of the underfill to expose the nanoporous metal contacts; and
pressing contacts of another body or an electronic component onto the nanoporous metal contacts to bond the other body or the electronic component to the receiving body.
20. The assembly of claim 12 , wherein the co-alloy includes copper (Cu) and zinc (Zn) or gold (Au) and silver (Ag).