Systems and methods for combined thermal and electrical energy transfer
Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.
1. An interconnect circuit comprising:
an electro-thermal conductor, comprising a thermal conductor portion and an electrical conductor portion,
wherein the thermal conductor portion is electrically isolated from the electrical conductor portion with a gap,
wherein each of the thermal conductor portion and the electrical conductor portion comprises a base sublayer and a surface sublayer having a different composition than the base sublayer, and
wherein the thermal conductor portion and the electrical conductor portion have an identical thickness;
a first adhesive layer, directly interfacing the electro-thermal conductor;
a first insulator, adhered to the electrical conductor portion using the first adhesive layer,
wherein the first insulator supports the thermal conductor portion and the electrical conductor portion relative to each other thereby maintaining electrical isolation between the thermal conductor portion and the electrical conductor portion; and
a second adhesive layer, directly interfacing the electro-thermal conductor such that the electro-thermal conductor is disposed between the second adhesive layer and the first adhesive layer,
wherein the first adhesive layer and the second adhesive layer extend into the gap thereby filling the gap.
2. The interconnect circuit of claim 1 , wherein the second adhesive layer is a pressure-sensitive adhesive (PSA) film.
3. The interconnect circuit of claim 1 , further comprising a second insulator, directly interfacing the second adhesive layer such that the second adhesive layer is disposed between the electro-thermal conductor and the second insulator.
4. The interconnect circuit of claim 3 , wherein the second insulator is a polyethylene terephthalate (PET) film.
5. The interconnect circuit of claim 4 , wherein a material of the second insulator is different from a material of the first insulator.
6. The interconnect circuit of claim 3 , further comprising an additional adhesive layer, directly interfacing the second insulator such that the second insulator is disposed between the additional adhesive layer and the second adhesive layer.
7. The interconnect circuit of claim 6 , wherein the additional adhesive layer is a pressure-sensitive adhesive (PSA) film.
8. The interconnect circuit of claim 6 , further comprising a releasable liner directly interfacing the additional adhesive layer such that the additional adhesive layer is disposed between the second insulator and the releasable liner.
9. The interconnect circuit of claim 8 , wherein the releasable liner is a foil.
10. The interconnect circuit of claim 1 , wherein the second insulator is a polyethylene terephthalate (PET) film.
11. The interconnect circuit of claim 1 , wherein the second adhesive layer comprises thermally-conductive electrically-insulating particles.
12. The interconnect circuit of claim 1 , wherein the base sublayer comprises aluminum, and wherein the surface sublayer comprises copper.
13. The interconnect circuit of claim 1 , wherein each of the thermal conductor portion and the electrical conductor portion comprises an intermediate sublayer disposed between the base sublayer and the surface sublayer and having a different composition than the base sublayer and the surface sublayer.
14. The interconnect circuit of claim 13 , the intermediate sublayer comprises nickel, and the surface sublayer comprises copper.
15. The interconnect circuit of claim 1 , wherein the first adhesive-layer is a pressure-sensitive adhesive (PSA) film.
16. The interconnect circuit of claim 1 , wherein the electrical conductor portion comprises a first contact portion formed by the surface sublayer, wherein the thermal conductor portion comprises a second contact portion formed by the surface sublayer, and wherein the first contact portion and the second contact portion are exposed an opening in the first insulator.
17. The interconnect circuit of claim 16 , wherein the electrical conductor portion comprises a first contact portion formed by the surface sublayer, wherein the thermal conductor portion comprises a second contact portion formed by the surface sublayer, wherein the first contact portion is exposed through a first opening, and wherein the second contact portion is exposed through a second opening, different from the first opening.
18. The interconnect circuit of claim 1 , wherein the gap between the thermal conductor portion and the electrical conductor portion is fully filled.
19. The interconnect circuit of claim 1 , wherein the gap between the thermal conductor portion and the electrical conductor portion is partially filled.
20. The interconnect circuit of claim 1 , wherein the first insulator extends over the gap between the thermal conductor portion and the electrical conductor portion.