IP Library Granted Patent US 11,279,002
Granted Patent B2
US 11,279,002 · App. 16/201,436 · Granted Mar 22, 2022

Dense packing particle size distribution for PDC cutters

Inventor: Gary M. Flood (Canal Winchester, OH)
Assignee: DIAMOND INNOVATIONS. INC.
B24D3/00B01J3/062B24D3/008B24D3/06B24D18/0009B01J2203/062B01J2203/066B01J2203/0645B01J2203/0655B01J2203/0685
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Quick Facts
Patent No.
US 11,279,002
App. No.
16/201,436
Granted
Mar 22, 2022
Kind
B2
Abstract

A superabrasive compact and a method of making the superabrasive compact are disclosed. A method of making a superabrasive compact comprises steps of providing a plurality of superabrasive particles having a particle size distribution with a first ratio (d50)/(d50 principle particles) ranging from about 0.86 to about 0.92; providing a support to the plurality of superabrasive particles; and subjecting the support and the plurality of superabrasive particles to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact.

Claims (12)

1. A method of making a superabrasive compact, comprising:

providing a plurality of superabrasive particles having a broad fine particle size distribution with a mean particle size d50 ranging from about 12 microns to about 30 microns and having a tail of fine superabrasive particles ranging from about 1 micron to about 9 microns;

providing a support to the plurality of superabrasive particles; and

subjecting the support and the plurality of superabrasive particles to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact,

wherein the particle size distribution has a first metric (d50)/(d50 principle particles), wherein the first metric is from about 0.86 to about 0.92.

2. The method of claim 1 , wherein the superabrasive particles are selected from the group consisting of cubic boron nitride, diamond, and diamond composite materials.

3. The method of claim 1 , wherein the support is a cemented tungsten carbide support.

4. The method of claim 1 , wherein the particle size distribution has a second metric defined as percentage of the volume of crystals greater than (0.5 times the d50), wherein the second metric is from about 86 to about 90.

5. The method of claim 1 , wherein the particle size distribution has a third metric defined as percentage of the volume less than (0.25 times d50), wherein the third metric is from 7.5 to 9.4.

6. The method of claim 1 , wherein the particle size distribution has a fourth metric defined as the volume of the distribution between d50 and (0.5 times d50) divided by the volume greater than d50, wherein the fourth metric is from 0.73 to 0.78.

7. The method of claim 1 , wherein the particle size distribution has a fifth metric defined as the volume of the distribution between (0.25 times d50) and (0.5 times d50) divided by the volume between (0.25 times d50) and d50, wherein the fifth metric is from 0.08 to 0.11.

8. The method of claim 1 , wherein the particle size distribution has a sixth metric defined as the volume of the distribution between (0.11 times d50) and (0.25 times d50) divided by the volume less than (0.25 times d50), wherein the sixth metric is from 0.46 to 0.58.

Assignments (5)
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →