Method and system for a vertical junction high-speed phase modulator
Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.
1. A semiconductor device, the device comprising: a semiconductor waveguide comprising:
a slab section;
a rib section extending above a region of the slab section; and
raised ridges extending above the slab section on both sides of the rib section;
a first cross section of the semiconductor waveguide including a first pn junction with p-doped material and n-doped material arranged with respect to each other in the rib section and the slab section, respectively, wherein the rib section is fully n-doped in the first cross section and the region of the slab section that the rib section extends above the slab is fully p-doped;
a second cross section in a different plane of the semiconductor waveguide than the first cross section, the second cross section including a second pn junction with p-doped material and n-doped material arranged with respect to each other in both the rib section and the slab section, wherein the second pn junction is perpendicular to the first pn junction; and
electrical contact to the p-doped material and n-doped material via contacts on the raised ridges.
2. The device of claim 1 , wherein portions of the slab section in the second cross section of the semiconductor waveguide are undoped.
3. The device according to claim 2 , wherein the portions of the slab section that are undoped are located between the raised ridges and the rib section.
4. The device of claim 1 , wherein the raised ridges are separated from the rib by trenches.
5. The device of claim 4 , wherein an undoped portion of the slab section is below one of the trenches.
6. The device of claim 1 , wherein the waveguide comprises a first phase modulation section of an optical modulator.
7. The device of claim 1 , wherein the waveguide comprises silicon.
8. The device of claim 1 , wherein the semiconductor waveguide is integrated in a complementary metal oxide semiconductor (CMOS) die.