Device structures with acoustic wave transducers and connection posts
A device structure comprises an acoustic wave transducer comprising a component. The component comprises a piezo-electric material. Component electrodes are disposed on the component and connection posts extend away from the component. Each of the connection posts is electrically connected to one of the component electrodes. The component has a center and a length greater than a width and, for at least one pair of the connection posts, a distance between the connection posts and the center is less than one quarter of the length.
1. A device structure, comprising:
an acoustic wave transducer comprising a component and component electrodes disposed on the component, wherein the component comprises a piezo-electric material; and
connection posts extending away from the component, each of the connection posts electrically connected to one of the component electrodes and attached to the component, and
wherein the component has a center and a length greater than a width and, for each of the connection posts, a distance between the connection post and the center is less than one quarter of the length.
2. The device structure of claim 1 , wherein the component has a component top side and a component bottom side opposite the component top side and at least one of the component electrodes is a component top electrode disposed on the component top side.
3. The device structure of claim 1 , wherein the component has a component top side and a component bottom side opposite the component top side and at least one of the component electrodes is a component bottom electrode disposed on the component bottom side.
4. The device structure of claim 1 , wherein the acoustic wave transducer is a surface acoustic wave transducer.
5. The device structure of claim 1 , wherein the acoustic wave transducer is a bulk acoustic wave transducer.
6. The device structure of claim 1 , comprising a surface acoustic wave filter comprising the acoustic wave transducer and a second acoustic wave transducer, wherein the second acoustic wave transducer comprises the component.
7. The device structure of claim 1 , comprising a bulk acoustic wave filter comprising the acoustic wave transducer.
8. The device structure of claim 1 , comprising a dielectric layer disposed at least partially between the component and a distal end of a connection post.
9. The device structure of claim 1 , wherein the connection posts have a distal end and a proximal end, the distal end having an area smaller than an area of the proximal end, wherein the distal end forms a sharp point.
10. The device structure of claim 1 , wherein the connection posts comprise planar edges or a pyramidal structure.
11. The device structure of claim 1 , comprising:
a component source wafer comprising a sacrificial layer comprising sacrificial portions, each sacrificial portion adjacent to one or more anchors, wherein the component is disposed entirely over one of the sacrificial portions.
12. The device structure of claim 11 , comprising a dielectric layer disposed between the one of the sacrificial portions and the component, wherein each of the connection posts is electrically connected to one of the component electrodes through the dielectric layer.
13. The device structure of claim 11 , wherein the one of the sacrificial portions is differentially etchable from the anchors.
14. The device structure of claim 11 , wherein the one of the sacrificial portions comprises an anisotropically etchable material.
15. The device structure of claim 11 , wherein the connection posts extend into the one of the sacrificial portions.
16. The device structure of claim 1 , comprising:
a component source wafer comprising a patterned sacrificial layer comprising an anchor, wherein the component is connected to the anchor by a tether and disposed such that a gap exists between the component and a surface of the component source wafer.
17. The device structure of claim 1 , comprising:
a substrate having a substrate surface and electrodes disposed on the substrate surface; and
the component disposed on the substrate surface,
wherein each of the connection posts is in electrical contact with one of the electrodes.
18. The device structure of claim 17 , comprising a patterned layer of adhesive adhering the connection posts to the substrate surface.
19. The device structure of claim 18 , wherein the patterned layer of adhesive only contacts a portion of a bottom surface of the component to the substrate surface.
20. The device structure of claim 1 , wherein the component has at least one of a length and a width less than or equal to 200 microns.
21. The device structure of claim 17 , wherein the substrate comprises a semiconductor and comprises an electronic substrate circuit.
22. The device structure of claim 1 , comprising three connection posts.
23. The device structure of claim 1 , comprising at least four connection posts.
24. The device structure of claim 1 , wherein the component comprises at least a portion of a component tether.