IP Library Granted Patent US 11,218,132
Granted Patent B2
US 11,218,132 · App. 16/208,857 · Granted Jan 4, 2022

Acoustic resonator

Inventors: Wen-Qing Xu (Medfield, MA); Di Lan (Tampa, FL); Jing Wang (Tampa, FL); Weiqi Li (San Jose, CA); Xu Han (Tampa, FL); Chao Liu (Butler, PA); Elgin Eissler (Renfrew, PA); Giovanni Barbarossa (Saratoga, CA)
Assignees: II-VI DELAWARE, INC.; UNIVERSITY OF SOUTH FLORIDA
H03H9/171H03H9/02102H03H9/02228H03H9/02275H03H9/02338H03H9/02448H03H9/13H03H9/175
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,218,132
App. No.
16/208,857
Granted
Jan 4, 2022
Kind
B2
Abstract

An acoustic resonator includes a piezoelectric stack including a piezoelectric layer having a top surface and a bottom surface, a top electrode layer disposed above the top surface, and a bottom electrode layer disposed below the bottom surface. A number of acoustic wave reflectors are disposed on a side of the bottom electrode layer opposite the piezoelectric layer. Each acoustic wave reflector includes a high acoustic impedance layer and may include a low acoustic impedance layer. The acoustic resonator may include a tether that extends laterally to a stacking direction of the layers of the piezoelectric stack. A supporting structure may be coupled to the tether opposite the acoustic resonator for anchoring the acoustic resonator. A mirror, one or more phononic crystals, or both may be positioned on proximate the tether opposite the acoustic resonator to avoid resonant waves from exiting the acoustic resonator in use.

Claims (55)

1. An acoustic resonator comprising:

a piezoelectric stack comprising:

a piezoelectric layer having on opposite sides thereof a top surface and a bottom surface;

a top electrode layer disposed above the top surface; and

a bottom electrode layer disposed below the bottom surface; and

a plurality of acoustic wave reflectors disposed on a side of the bottom electrode layer opposite the piezoelectric layer, each acoustic wave reflector including a high acoustic impedance layer having an acoustic impedance (Za)≥60×10 6 N·s/m 3 , wherein the high acoustic impedance layer of at least one of the acoustic wave reflectors is a layer of diamond.

2. The acoustic resonator of claim 1 , wherein at least one of the acoustic wave reflectors includes a low acoustic impedance layer having an acoustic impedance (Zb) on a side of its high acoustic impedance layer opposite the bottom electrode layer, and the acoustic impedances Za and Zb have values that satisfy the equation:

|( Zb−Za )/( Za+Zb )|≥0.4.

3. The acoustic resonator of claim 2 , wherein the low acoustic impedance layer has an acoustic impedance ≤65×10 6 N·s/m 3 .

4. The acoustic resonator of claim 2 , wherein the low acoustic impedance layer is vacuum or a gas-phase material or mixture.

5. The acoustic resonator of claim 4 , wherein the gas-phase material or mixture includes one or more of the following: air, hydrogen, nitrogen, carbon dioxide, carbon monoxide, oxygen, helium, neon, argon, krypton, and xenon.

6. The acoustic resonator of claim 2 , wherein the low acoustic impedance layer is a solid-phase material.

7. The acoustic resonator of claim 6 , wherein the solid-phase material comprises at least one of the following: ceramic, glass, crystal, and/or mineral.

8. The acoustic resonator of claim 1 , wherein the high acoustic impedance layer is comprised of metal, ceramic, glass, or polymer.

9. The acoustic resonator of claim 8 , wherein the metal comprises one or more elements from one or more of the following Groups of the periodic table of the elements: IIIA, IVA, IB, IIB, IIIB, IVB, VB, VIB, VIIB, and VIIIB.

10. The acoustic resonator of claim 1 , further including at least one temperature compensation layer, the at least one temperature compensation layer disposed at least at one of the following locations:

between the bottom electrode layer and at least one of the acoustic wave reflectors;

on a side of at least one of the high acoustic impedance layers opposite the bottom electrode layer; and/or

on a side of the top electrode layer opposite the piezoelectric layer.

11. The acoustic resonator of claim 10 , wherein each temperature compensation layer includes an element comprising silicon, an element comprising oxygen, or both.

12. The acoustic resonator of claim 1 , wherein the acoustic resonator is coupled to at least one supporting structure disposed laterally to a stacking direction of the layers of the piezoelectric stack.

13. The acoustic resonator of claim 12 , further including a tether coupling a side or end of the acoustic resonator to the supporting structure.

14. An acoustic resonator, comprising:

a piezoelectric stack comprising:

a piezoelectric layer having on opposite sides thereof a top surface and a bottom surface;

a top electrode layer disposed above the top surface; and

a bottom electrode layer disposed below the bottom surface; and

a plurality of acoustic wave reflectors disposed on a side of the bottom electrode layer opposite the piezoelectric layer, each acoustic wave reflector including a high acoustic impedance layer having an acoustic impedance (Za)≥60×10 6 N·s/m 3 ,

wherein at least one of the acoustic wave reflectors includes a low acoustic impedance layer having an acoustic impedance (Zb) on a side of its high acoustic impedance layer opposite the bottom electrode layer, and the acoustic impedances Za and Zb have values that satisfy the equation:

|( Zb−Za )/( Za+Zb )≥0.4; and

wherein the low acoustic impedance layer is a liquid-phase material.

15. The acoustic resonator of claim 14 , wherein the high acoustic impedance layer of at least one of the acoustic wave reflectors is a layer of diamond.

16. An acoustic resonator, comprising:

a piezoelectric stack comprising:

a piezoelectric layer having on opposite sides thereof a top surface and a bottom surface;

a top electrode layer disposed above the top surface; and

a bottom electrode layer disposed below the bottom surface; and

a plurality of acoustic wave reflectors disposed on a side of the bottom electrode layer opposite the piezoelectric layer, each acoustic wave reflector including a high acoustic impedance layer having an acoustic impedance (Za)≥60×10 6 N·s/m 3 ,

wherein the acoustic resonator is coupled to at least one supporting structure disposed laterally to a stacking direction of the layers of the piezoelectric stack, and

wherein the acoustic resonator, further includes:

a tether coupling a side or end of the acoustic resonator to the supporting structure; and

a means for reflecting acoustic waves disposed on a side of the tether opposite the acoustic resonator.

17. The acoustic resonator of claim 16 , wherein the tether has a width less than a width of the side or end of the acoustic resonator.

18. The acoustic resonator of claim 16 , wherein the means for reflecting acoustic waves includes a mirror formed of a material having an acoustic impedance ≤65×10 6 N·s/m 3 .

19. The acoustic resonator of claim 16 , wherein the means for reflecting acoustic waves includes one or more phononic crystals.

20. An acoustic resonator comprising:

a piezoelectric stack comprising:

a piezoelectric layer having on opposite sides thereof a top surface and a bottom surface;

a top electrode layer disposed above the top surface; and

a bottom electrode layer disposed below the bottom surface; and

a plurality of acoustic wave reflectors disposed on a side of the bottom electrode layer opposite the piezoelectric layer, each acoustic wave reflector including a high acoustic impedance layer having an acoustic impedance (Za)≥60×10 6 N·s/m 3 ,

wherein the acoustic resonator is coupled to at least one supporting structure disposed laterally to a stacking direction of the layers of the piezoelectric stack, and

wherein the acoustic resonator, further includes:

a tether coupling a side or end of the acoustic resonator to the supporting structure; and

one or more phononic crystals included in the tether.

Assignments (7)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2019
From: II-VI INCORPORATED
To: II-VI DELAWARE, INC.
Reel/Frame 051210/0411 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2019
From: XU, WEN-QING; LI, WEIQI; LIU, CHAO; EISSLER, ELGIN; BARBAROSSA, GIOVANNI
To: II-VI INCORPORATED
Reel/Frame 048315/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2019
From: WANG, JING; HAN, XU
To: UNIVERSITY OF SOUTH FLORIDA
Reel/Frame 048300/0581 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2019
From: LAN, DI
To: II-VI INCORPORATED; UNIVERSITY OF SOUTH FLORIDA
Reel/Frame 048300/0640 →
Continuity (2)
Provisional Application 62597662 · Dec 12, 2017
Related Publication 20190181830A1 · Jun 13, 2019
Cited By (1)
US 12,244,290