Polysilocarb materials, methods and uses
Polysilocarb formulations, cured and pyrolized materials, was well as articles and use for this material. In particular pyrolized polysilocarb ceramic materials and articles contain these materials where, the ceramic has from about 30 weight % to about 60 weight % silicon, from about 5 weight % to about 40 weight % oxygen, and from about 3 weight % to about 35 weight % carbon, and wherein 20 weight % to 80 weight % of the carbon is silicon-bound-carbon and 80 weight % to about 20 weight % of the carbon is free carbon.
1. A grinding or cutting device having a polysilocarb formulation comprising: a bulk phase and a cutting material; wherein the bulk phase is derived from a polysilocarb formulation, wherein at least about 55 weight % of the carbon is free carbon.
2. The grinding or cutting device of claim 1 is obtained from a reaction type process.
3. The grinding or cutting device of claim 1 , wherein the formulation comprises at least one precursor selected from the group consisting of Phenyltriethoxysilane, Phenylmethyldiethoxysilane, Methyldiethoxysilane, Vinylmethyldiethoxysilane, Trimethylethoxysilane, Triethoxysilane, and a partially hydrolyzed tetraethyl orthosilicate.
4. The grinding or cutting device of claim 1 , wherein the formulation comprises at least two precursors selected from the group consisting of Phenyltriethoxysilane, Phenylmethyldiethoxysilane, Methyldiethoxysilane, Vinylmethyldiethoxysilane, Trimethylethoxysilane, Triethoxysilane, and a partially hydrolyzed tetraethyl orthosilicate.
5. The grinding or cutting device of claim 1 , wherein the cutting material is selected from the group consisting of polycrystalline diamond compact, SiC, Aluminum oxide and diamond.
6. The grinding or cutting device of claim 2 , wherein the cutting material is selected from the group consisting of polycrystalline diamond compact, SiC, Aluminum oxide and diamond.
7. The grinding or cutting device of claim 1 , wherein the cutting material is evenly distributed through the entirety of the member.
8. The grinding or cutting device of claim 2 , wherein the cutting material is evenly distributed through the entirety of the member.
9. The composite grinding or cutting member of claim 1 , wherein the cutting material is evenly distributed through a majority of a outer volume of the member, wherein the outer volume defines at least about 50% of the total volume of the member.
10. The grinding or cutting member of claim 1 , wherein the polysilocarb formulation is a mixing type formulation.
11. The grinding or cutting member of claim 1 , wherein the polysilocarb formulation is a mixing type formulation, wherein the formulation comprises at least one precursor selected from the group consisting of methyl terminated vinyl polysiloxane, vinyl terminated vinyl polysiloxane, hydride terminated vinyl polysiloxane, vinyl terminated dimethyl polysiloxane, hydroxy terminated dimethyl polysiloxane, phenyl terminated dimethyl polysiloxane, methyl terminated phenylethyl polysiloxane, and tetravinyl cyclosiloxane.
12. The grinding or cutting member of claim 10 , wherein the polysilocarb formulation is substantially solvent free.
13. The composite grinding or cutting member of claim 12 , wherein the cutting material is selected from the group consisting of polycrystalline diamond compact, SiC, Aluminum oxide and diamond.
14. The composite grinding or cutting member of claim 13 , wherein the cutting material is evenly distributed through a majority of a outer volume of the member, wherein the outer volume defines at least about 50% of the total volume of the member.
15. The grinding or cutting device of claim 1 , wherein the polysilocarb formulation comprises an SiOxCy moiety, where x≥1, y≥1, and x+y=4 and wherein the bulk material further comprises about 20 weight % to about 35 weight % carbon; wherein about 55 weight % to about 80 weight % of the carbon is free carbon.
16. The grinding or cutting device of claim 1 , wherein the polysilocarb formulation comprises a pyrolized ceramic, the ceramic comprising from about 30 weight % to about 60 weight % silicon, from about 5 weight % to about 40 weight % oxygen.
17. The grinding or cutting device of claim 1 , wherein the polysilocarb formulation comprises about 40 weight % to about 50 weight % silicon, and wherein about 25 weight % to about 40 weight % of the carbon is silicon-bound carbon.
18. The grinding or cutting device of claim 17 , wherein the polysilocarb formulation comprises about 40 weight % to about 50 weight % silicon.
19. The grinding or cutting device of claim 17 , wherein the polysilocarb formulation comprises about 20 weight % to about 30 weight % oxygen, and wherein about 60 weight % to about 75 weight % of the carbon is free carbon.
20. The grinding or cutting device of claim 17 , wherein the polysilocarb formulation comprises about 20 weight % to about 30 weight % oxygen, and wherein about 25 weight % to about 40 weight % of the carbon is silicon-bound carbon.